G01N23/20075

Radiation phase contrast imaging device

[PROBLEM TO BE SOLVED] To provide a radiation phase contrast imaging device having a small device configuration [SOLVING MEANS] The present invention focused on the findings that the distance between the phase grating 5 and the FPD 4 does not need to be the Talbot distance. The distance between the phase grating 5 and the FPD 4 can be more freely set. However, a self-image cannot be detected unless the self-image is sufficiently magnified with respect to the phase grating 5. The degree on how much the self-image is magnified on the FPD 4 with respect to the original phase grating 5 is determined by a magnification ratio X2/X1. Therefore, in the present invention, the magnification ratio is set to be the same as the magnification ratio in a conventional configuration. With this, even if the distance X2 between the radiation source 3 and the FPD 4 is reduced, a situation in which the self-image cannot be detected by the FPD 4 due to the excessively small size thereof does not occur.

X-ray imaging system containing X-ray apparatus having gratings and object housing for setting environmental condition independent of external environment

An X-ray imaging system including: an X-ray Talbot imaging apparatus which is provided with an object table, an X-ray source, a plurality of gratings, and an X-ray detector side by side in a direction of an X-ray radiation axis, and irradiates the X-ray detector with an X-ray from the X-ray source through an object and the plurality of gratings to obtain a moire image required for forming a reconstruction image of the object; and an object housing inside which the object is housed and an environmental condition independent of an external environment is set, wherein the object housing is provided detachably with respect to the object table.

Radiation grating detector and X-ray inspection apparatus
10732302 · 2020-08-04 · ·

The radiation grating detector includes a grating portion constituting at least a second grating among a first grating, the second grating, and a third grating, and a detection portion configured to detect an incident radiation transmitted through the grating portion.

X-ray tensor tomography system

The present invention relates to an X-ray tensor tomography (XTT) system (34), comprising a source (12) for providing a beam with coherent X-rays, a first grating (16) with first grating lines and a second grating (18) with second grating lines, the second grating lines being parallel to the first grating lines and the XTT-system (34) being configured to relatively shift the first grating (16) and/or the second grating (18) in a shifting direction (32) being parallel to the planes of the gratings (16, 18), a stage (36) for rotating the specimen about a first axis of rotation and about not more than two axes of rotation (26), the first axis of rotation lying in a plane (38) being tilted by an angle with respect to the to the planes of the gratings (16, 18), wherein 0<90, and by an angle with respect to a plane being orthogonal to the direction of the beam path at a location of the stage (36), wherein 0<<90, a detector (22), a reconstruction unit configured to reconstruct scattering tensors for a specimen.

Talbot-lau x-ray source and interferometric system

An x-ray source and an x-ray interferometry system utilizing the x-ray source are provided. The x-ray source includes a target that includes a substrate and a plurality of structures. The substrate includes a thermally conductive first material and a first surface. The plurality of structures is on or embedded in at least a portion of the first surface. The structures are separate from one another and are in thermal communication with the substrate. The structures include at least one second material different from the first material, the at least one second material configured to generate x-rays upon irradiation by electrons having energies in an energy range of 0.5 keV to 160 keV. The x-ray source further includes an electron source configured to generate the electrons and to direct the electrons to impinge the target and to irradiate at least some of the structures along a direction that is at a non-zero angle relative to a surface normal of the portion of the first surface. The x-ray source further includes at least one optical element positioned such that at least some of the x-rays are transmitted through the first material and to or through the at least one optical element.

Positive electrode active material for lithium secondary battery, method for preparing the same, and secondary battery including the same
10651500 · 2020-05-12 · ·

The present invention relates to a positive electrode active material for a secondary battery, a method for preparing the same, and a secondary battery including the same, and more particularly to a positive electrode active material for a secondary battery, which includes lithium transition metal oxide particles represented by Formula 1; and lithium metal phosphate nanoparticles disposed on the surface of the lithium transition metal oxide particles and represented by Formula 2, a method for preparing the same, and a lithium secondary battery including the same
Li.sub.(1+a)(Ni.sub.1bcM.sub.bCo.sub.c)O.sub.2[Formula 1] In which, M is at least one metal selected from the group consisting of Mn, Al, Cu, Fe, Mg, Cr, Sr, V, Sc and Y, 0a0.2, 0b1, and 0c1
Li.sub.1+xM.sub.xM.sub.2x(PO.sub.4).sub.3[Formula 2] In which, M is Al, Y, Cr, or Ca, M is Ge, Ti, Sn, Hf, Zn, or Zr, and 0x0.5.

Iron-based oxide magnetic particle powder, method for producing same, coating material, and magnetic recording medium

An iron-based oxide magnetic particle powder has a narrow particle size distribution a small content of fine particles that do not contribute to magnetic recording characteristics, and a narrow coercive force distribution, to enhance magnetic recording medium density. Neutralizing an aqueous solution containing a trivalent iron ion and an ion of the metal substituting a part of the Fe sites by adding an alkali to make pH of 1.5 or more and 2.5 or less, adding a hydroxycarboxylic acid, and further neutralizing by adding an alkali to make pH of 8.0 or more and 9.0 or less are performed at 5 C. or more and 25 C. or less. A formed iron oxyhydroxide precipitate containing the substituting metal element is rinsed with water, then coated with silicon oxide, and then heated thereby providing e-type iron-based oxide magnetic particle powder. The rinsed precipitate may be subjected to a hydrothermal treatment.

X-ray imaging apparatus

The X-ray imaging apparatus is provided with an X-ray source, a plurality of gratings including a first grating and a second grating, a detector, a rotation mechanism for relatively rotating a subject including a fiber bundle and an imaging system, and an image processor for generating a dark field image. The image processor is configured to obtain a three-dimensional dark field image of the subject including at least the fiber bundle from a plurality of dark field images captured at a plurality of rotation angles.

Cathode active materials having improved particle morphologies
10593941 · 2020-03-17 · ·

Mixed-metal oxides and lithiated mixed-metal oxides are disclosed that involve compounds according to, respectively, Ni.sub.xMn.sub.yCo.sub.zMe.sub.O.sub. and Li.sub.1+Ni.sub.xMn.sub.yCo.sub.zMe.sub.O.sub.. In these compounds, Me is selected from B, Na, Mg, Al, Si, K, Ca, Sc, Ti, V, Cr, Fe, Cu, Zn, Ga, Ge, Zr, Nb, Mo, Ru, Ag, In, and combinations thereof; 0x1; 0y1; 0z<1; x+y+z>0; 00.5; and x+y+>0. For the mixed-metal oxides, 15. For the lithiated mixed-metal oxides, 0.11.0 and 1.93. The mixed-metal oxides and the lithiated mixed-metal oxides include particles having an average density greater than or equal to 90% of an ideal crystalline density.

Performing Planarization Process Controls in Semiconductor Fabrication
20200051830 · 2020-02-13 ·

A planarization process is performed to a wafer. In various embodiments, the planarization process may include a chemical mechanical polishing (CMP) process. A byproduct generated by the planarization process is collected and analyzed. Based on the analysis, one or more process controls are performed for the planarization process. In some embodiments, the process controls include but are not limited to process endpoint detection or halting the planarization process based on detecting an error associated with the planarization process.