The present disclosure relates to multi-modality detection systems and methods. One illustrative multi-modality detection system may include a distributed radiation source configured to irradiate an object under detection, a primary collimator configured to separate rays of the distributed radiation source into two parts, wherein one part is for CT detection and the other part is for XRD detection, a CT detection device configured to perform a CT detection to acquire a CT image of the object under detection, and an XRD detection device configured to perform an XRD detection to acquire an XRD image of the object under detection, wherein the CT detection and the XRD detection are performed simultaneously.

An X-ray imaging inspection system for inspecting items comprises an X-ray source 10 extending around an imaging volume 16, and defining a plurality of source points 14 from which X-rays can be directed through the imaging volume. An X-ray detector array 12 also extends around the imaging volume 16 and is arranged to detect X-rays from the source points which have passed through the imaging volume, and to produce output signals dependent on the detected X-rays. A conveyor 20 is arranged to convey the items through the imaging volume 16.

The present disclosure relates to detection systems and methods. One illustrative detection system may include a distributed radiation source having a plurality of radiation source focus points, which irradiate an object under detection, wherein the plurality of radiation source focus points are divided into a certain number of groups, and a primary collimator that limits rays of each of the radiation source focus points such that the rays emit into an XRD detection device. An XRD detection device may include a plurality of XRD detectors that are divided into the same number of groups as the radiation source focus points, wherein XRD detectors in a same group are arranged to be separated by XRD detectors in other groups, and rays of each of the radiation source focus points are received by XRD detectors having the same group number as the group number of the radiation source focus point.

An x-ray inspection device includes an x-ray irradiation unit that irradiates an object for inspection with an x-ray; a sensor that detects an electric signal corresponding to a back-scattered x-ray reflected off the object for inspection; a measurement unit that measures the object for inspection with reference to the electric signal output by the sensor; and a heavy metal plate having a pinhole that allows the back-scattered x-ray to pass therethrough, the pinhole forming an image of the back-scattered x-ray on the sensor.

A diffraction system configured to generate a diffraction signature based upon an angular disbursement of radiation is provided. In some embodiments, the diffraction system comprises a radiation source comprising a radiographic isotope configured to natural emit radiation due to decay. In some embodiment, the diffraction system is part of an object identification system that comprises one or more other radiation imaging modalities, such as a CT system and/or a line-scan system. By way of example, the one or more other radiation imaging modalities may perform an initial examination of an object to generate data indicative of the object. The data can be analyzed to identify an item of interest within the object, which can subsequently be examined by the diffraction system to generate a diffraction signature of the item. The diffraction signature of the item can be compared to known diffraction signatures of know items to characterize the item.

A method and system for scanning an elongate structure. A scanner in a scanning system is moved axially along the elongate structure using a translating structure in the scanning system. The elongate member is scanned axially as the scanner moves axially along the elongate structure. The scanner is moved rotationally around the elongate structure at a location in which an inconsistency is detected at the location during an axial scan. The elongate structure is scanned rotationally at the location while the scanner moves rotationally around the elongate structure.

An example method for aligning a spectrometer is described herein. The spectrometer includes a radiation source, a crystal analyzer, and a detector that are all positioned on an instrument plane. The method includes rotating the crystal analyzer about an axis that is within the instrument plane and perpendicular to a rotation plane such that (i) a reciprocal lattice vector of the crystal analyzer is within the instrument plane or (ii) a component of the reciprocal lattice vector within the rotation plane is perpendicular to the instrument plane. An origin of the reciprocal lattice vector is located on the axis. The method further includes tilting the crystal analyzer or translating the detector such that the reciprocal lattice vector bisects a line segment that is bounded by the detector and the radiation source. Example spectrometers related to the example method are also disclosed.

A system for inspecting an object includes a turntable on which the object may be placed. The turntable rotates the object about a first rotation axis. The system also includes an X-ray source to generate an X-ray beam in a plane to intersect with the object. The system also includes an X-ray detector that can detect at least a portion of the X-ray beam transmitted through the object during rotation and generate image data based on the detected X-ray beam. Also included is a controller that can: generate an image of the object based on the image data; determine, based on a suspect item identified in the image of the object, a second rotation axis at an angle from the first axis; cause a tilt of the turntable so that it is perpendicular to the second axis; and initiate a subsequent rotation of the object about the second axis.

Methods and systems for estimating values of process parameters, structural parameters, or both, based on x-ray scatterometry measurements of high aspect ratio semiconductor structures are presented herein. X-ray scatterometry measurements are performed at one or more steps of a fabrication process flow. The measurements are performed quickly and with sufficient accuracy to enable yield improvement of an on-going semiconductor fabrication process flow. Process corrections are determined based on the measured values of parameters of interest and the corrections are communicated to the process tool to change one or more process control parameters of the process tool. In some examples, measurements are performed while the wafer is being processed to control the on-going fabrication process step. In some examples, X-ray scatterometry measurements are performed after a particular process step and process control parameters are updated for processing of future devices.

The present specification discloses a multi-view X-ray inspection system having, in one of several embodiments, a three-view configuration with three X-ray sources. Each X-ray source rotates and is configured to emit a rotating X-ray pencil beam and at least two detector arrays, where each detector array has multiple non-pixellated detectors such that at least a portion of the non-pixellated detectors are oriented toward both the two X-ray sources.