The invention relates to a method of examining a sample using a charged particle microscope, comprising the steps of providing a charged particle beam, as well as a sample; scanning said charged particle beam over said sample; and detecting, using a first detector, emissions of a first type from the sample in response to the beam scanned over the sample. Spectral information of detected emissions of the first type is used for assigning a plurality of mutually different phases to said sample. In a further step, a corresponding plurality of different color hues—with reference to an HSV color space—are associated to said plurality of mutually different phases. Using a second detector, emissions of a second type from the sample in response to the beam scanned over the sample are detected. Finally an image representation of said sample is provided.

Embodiments described herein utilize Non-Destructive Inspection (NDI) scan data obtained during a process performed on a surface of a structure to update a location of an NDI scanner on the surface. A subsurface feature within the structure is detected based on the NDI scan data, which are correlated with pre-defined position data for the subsurface feature. A measured location of the NDI scanner on the surface is corrected based on the pre-defined position data for the subsurface feature.

A radiation imaging apparatus includes an attenuation member on the back surface side opposite the radiation incident surface of a radiation detection unit. The attenuation member is configured to reduce unexpected appearance of a part disposed on the back surface side of the radiation imaging apparatus, the unexpected appearance of which occurs due to backscattered radiation reflected by the structured part on the back surface side of the radiation imaging apparatus. The attenuation member includes a material having a radiation transmittance higher than that of the part and covers the end portion of the outline of the part that overlaps the radiation detection unit in orthogonal projection onto the surface opposite the incident surface of the radiation detection unit, and the area of the attenuation member is smaller than that of the radiation detection unit.

A radiation imaging apparatus includes an attenuation member on the back surface side opposite the radiation incident surface of a radiation detection unit. The attenuation member is configured to reduce unexpected appearance of a part disposed on the back surface side of the radiation imaging apparatus, the unexpected appearance of which occurs due to backscattered radiation reflected by the structured part on the back surface side of the radiation imaging apparatus. The attenuation member includes a material having a radiation transmittance higher than that of the part and covers the end portion of the outline of the part that overlaps the radiation detection unit in orthogonal projection onto the surface opposite the incident surface of the radiation detection unit, and the area of the attenuation member is smaller than that of the radiation detection unit.

Systems and methods of observing a sample using an electron beam apparatus are disclosed. The electron beam apparatus comprises an electron source configured to generate a primary electron beam along a primary optical axis, and a first electron detector having a first detection layer substantially parallel to the primary optical axis and configured to detect a first portion of a plurality of signal electrons generated from a probe spot on a sample. The method may comprise generating a plurality of signal electrons and detecting the signal electrons using the first electron detector substantially parallel to the primary optical axis of the primary electron beam. A method of configuring an electrostatic element or a magnetic element to detect backscattered electrons may include disposing an electron detector on an inner surface of the electrostatic or magnetic element and depositing a conducting layer on the inner surface of the electron detector.

Systems and methods of observing a sample using an electron beam apparatus are disclosed. The electron beam apparatus comprises an electron source configured to generate a primary electron beam along a primary optical axis, and a first electron detector having a first detection layer substantially parallel to the primary optical axis and configured to detect a first portion of a plurality of signal electrons generated from a probe spot on a sample. The method may comprise generating a plurality of signal electrons and detecting the signal electrons using the first electron detector substantially parallel to the primary optical axis of the primary electron beam. A method of configuring an electrostatic element or a magnetic element to detect backscattered electrons may include disposing an electron detector on an inner surface of the electrostatic or magnetic element and depositing a conducting layer on the inner surface of the electron detector.

Embodiments of the present disclosure disclose a combined scanning X-ray generator, a composite inspection apparatus and an inspection method. The combined scanning X-ray generator includes: a housing; an anode arranged in the housing, the anode including a first end of the anode and a second end of the anode opposite the first end of the anode; a pencil beam radiation source arranged at the first end of the anode and configured to emit a pencil X-ray beam; and a fan beam radiation source arranged at the second end of the anode and configured to emit a fan X-ray beam; wherein the pencil beam radiation source and the fan beam radiation source are operated independently.

Embodiments of the present disclosure disclose a combined scanning X-ray generator, a composite inspection apparatus and an inspection method. The combined scanning X-ray generator includes: a housing; an anode arranged in the housing, the anode including a first end of the anode and a second end of the anode opposite the first end of the anode; a pencil beam radiation source arranged at the first end of the anode and configured to emit a pencil X-ray beam; and a fan beam radiation source arranged at the second end of the anode and configured to emit a fan X-ray beam; wherein the pencil beam radiation source and the fan beam radiation source are operated independently.

A system for delivering hydraulic fracturing fluid to a wellbore is provided. The system includes a first frac tree connected to a first wellbore and a second frac tree connected to second wellbore. The system further includes a zipper module and a first single straight-line connection between the zipper module and the first frac tree. The system also includes a second single straight-line connection between the first frac tree and the second frac tree.

The present invention enables an overlay error between processors to be measured from a pattern image, the SN ratio of which is low. To this end, the present invention forms a secondary electron image 200 from a detection signal of a secondary electron detector 107, forms a reflected electron image 210 from a detection signal of a reflected electron detector 109, creates a SUMLINE profile 701 that is obtained by adding luminance information in the reflected electron image along the longitudinal direction of a line pattern, and calculates an overlay error of a sample by using position information about an upper layer pattern detected from the secondary electron image and position information about a lower layer pattern that is detected by using an estimation line pattern 801 estimated on the basis of the SUMLINE profile from the reflected electron image.