The subject matter described herein includes methods, systems, and computer program products for measuring the density of a material. According to one aspect, a material property gauge includes a nuclear density gauge for measuring the density of a material. A radiation source adapted to emit radiation into a material and a radiation detector operable to produce a signal representing the detected radiation. A first material property calculation function may calculate a value associated with the density of the material based upon the signal produced by the radiation detector. The material property gauge includes an electromagnetic moisture property gauge that determines a moisture property of the material. An electromagnetic field generator may generate an electromagnetic field where the electromagnetic field sweeps through one or more frequencies and penetrates into the material. An electromagnetic sensor may determine a frequency response of the material to the electromagnetic field across the several frequencies.

The subject matter described herein includes methods, systems, and computer program products for measuring the density of a material. According to one aspect, a material property gauge includes a nuclear density gauge for measuring the density of a material. A radiation source adapted to emit radiation into a material and a radiation detector operable to produce a signal representing the detected radiation. A first material property calculation function may calculate a value associated with the density of the material based upon the signal produced by the radiation detector. The material property gauge includes an electromagnetic moisture property gauge that determines a moisture property of the material. An electromagnetic field generator may generate an electromagnetic field where the electromagnetic field sweeps through one or more frequencies and penetrates into the material. An electromagnetic sensor may determine a frequency response of the material to the electromagnetic field across the several frequencies.

An automatic method is provided to align a semiconductor crystalline substrate for electron channeling contrast imaging (ECCI) in regions where an electron channeling pattern cannot be reliably obtained but crystalline defects need to be imaged. The automatic semiconductor crystalline substrate alignment method is more reproducible and faster than the current operator intensive process for ECCI alignment routines. Also, the automatic semiconductor crystalline substrate alignment method increases the throughput of ECCI.

An automatic method is provided to align a semiconductor crystalline substrate for electron channeling contrast imaging (ECCI) in regions where an electron channeling pattern cannot be reliably obtained but crystalline defects need to be imaged. The automatic semiconductor crystalline substrate alignment method is more reproducible and faster than the current operator intensive process for ECCI alignment routines. Also, the automatic semiconductor crystalline substrate alignment method increases the throughput of ECCI.

The present disclosure provides an X-ray backscattering safety inspection system, comprising: one or more backscattering inspection subsystem configured to inspect an object to be inspected by emitting X-ray beams towards the object to be inspected and inspecting scattering signals; and a control subsystem configured to adjust a distance between the backscattering inspection subsystem and locations on a side of the object to be inspected where are irradiated by the X-ray beams in real time according to a size of the object to be inspected such that the scattering signals inspected are optimized. The system may be adapted to objects to be inspected with different sizes or shapes while enhancing backscattering signals for imaging.

The present disclosure provides an X-ray backscattering safety inspection system, comprising: one or more backscattering inspection subsystem configured to inspect an object to be inspected by emitting X-ray beams towards the object to be inspected and inspecting scattering signals; and a control subsystem configured to adjust a distance between the backscattering inspection subsystem and locations on a side of the object to be inspected where are irradiated by the X-ray beams in real time according to a size of the object to be inspected such that the scattering signals inspected are optimized. The system may be adapted to objects to be inspected with different sizes or shapes while enhancing backscattering signals for imaging.

The present disclosure provides a mobile back scattering imaging security inspection apparatus, comprising: a back scattering scanner (2), a detector (3), a controller (4), and a movable stage (1) configured to carry the back scattering scanner, the detector and the controller and being movable with respect to the object to be inspected; wherein the back scattering scanner is a distributed X-ray source comprising a plurality of target points (201), each of which is able to emit the ray beam individually, and wherein the back scattering scanner, the detector and the controller perform an imaging security inspection operation on the object to be inspected during moving along with the movable stage with respect to the object.

The present disclosure provides a mobile back scattering imaging security inspection apparatus, comprising: a back scattering scanner (2), a detector (3), a controller (4), and a movable stage (1) configured to carry the back scattering scanner, the detector and the controller and being movable with respect to the object to be inspected; wherein the back scattering scanner is a distributed X-ray source comprising a plurality of target points (201), each of which is able to emit the ray beam individually, and wherein the back scattering scanner, the detector and the controller perform an imaging security inspection operation on the object to be inspected during moving along with the movable stage with respect to the object.

Described are systems and methods for segmenting images which comprise impinging a substrate surface with a particle beam at each of a plurality of sensing locations which define a subset of locations within an area of interest of the substrate surface. An intensity value associated with post-impingement particles resulting from the impinging is measured and the measured intensity based on the intensity value of the sensing location is calculated. For each of a plurality of estimated locations which define a further subset of said area of interest and a corresponding estimated intensity based on at least one of the following corresponding to one or more locations proximal to the estimated location is calculated. The plurality of estimated locations is each segmented based on the corresponding estimated intensity, each of the sensing locations, and based on the corresponding measured intensity, to correspond to one of the plurality of features.

A method of operating a radiation inspection system includes identifying a regulatory region along a predetermined path where public access is restricted based upon criteria other than radiation exposure, measuring a radiation exposure level from a radiation source of the radiation inspection system within the regulatory region, irradiating a target within the regulatory region using the radiation source and without erecting a physical barricade, and determining a restricted area around the radiation source. The restricted area corresponds to an area where a radiation exposure rate exceeds a predetermined threshold. The radiation exposure rate may be determined by the radiation exposure level from the radiation source and a speed of the radiation inspection system. The method may include operating the radiation inspection system to dynamically adjust the restricted area so that it does not extend beyond the regulatory region. The radiation inspection system may be moveable along the predetermined path.