A method for measuring a temperature of a fluid for use with a microfluidic analysis apparatus includes a reading step and a determination step. During the reading step, at least one diffusion signal is read, the latter representing a diffusion characteristic of the diffusion of the fluid. During the determination step, the temperature is determined using the at least one diffusion signal.

A method for measuring a temperature of a fluid for use with a microfluidic analysis apparatus includes a reading step and a determination step. During the reading step, at least one diffusion signal is read, the latter representing a diffusion characteristic of the diffusion of the fluid. During the determination step, the temperature is determined using the at least one diffusion signal.

The present invention relates to methods and systems for the analysis of nucleic acids present in biological samples, and more specifically, relates to clustering melt curves derived from high resolution thermal melt analysis performed on a sample of nucleic acids, the resulting clusters being usable, in one embodiment, for analyzing the sequences of nucleic acids and to classify their genotypes that are useful for determining the identity of the genotype of a nucleic acid that is present in a biological sample.

The present invention relates to methods and systems for the analysis of nucleic acids present in biological samples, and more specifically, relates to clustering melt curves derived from high resolution thermal melt analysis performed on a sample of nucleic acids, the resulting clusters being usable, in one embodiment, for analyzing the sequences of nucleic acids and to classify their genotypes that are useful for determining the identity of the genotype of a nucleic acid that is present in a biological sample.

A melt temperature sensing kit includes a housing and a cup. The housing defines a cavity and has an outer periphery configured to be received by a platen of an injection molding machine. The cup has a proximate end and a distal end and is configured to be received within at least a portion of the cavity. The cup includes a base enclosing the distal end of the cup and a sidewall extending from the base, the sidewall defining a first aperture at the proximate end of the cup, a second aperture disposed between the proximate end and the distal end of the cup, and an internal volume. The first aperture, the second aperture, and the internal volume cooperate to define a flow path. At least one of the housing and the cup facilitate measurement of a shot flow temperature as part of a melt temperature measurement process.

A melt temperature sensing kit includes a housing and a cup. The housing defines a cavity and has an outer periphery configured to be received by a platen of an injection molding machine. The cup has a proximate end and a distal end and is configured to be received within at least a portion of the cavity. The cup includes a base enclosing the distal end of the cup and a sidewall extending from the base, the sidewall defining a first aperture at the proximate end of the cup, a second aperture disposed between the proximate end and the distal end of the cup, and an internal volume. The first aperture, the second aperture, and the internal volume cooperate to define a flow path. At least one of the housing and the cup facilitate measurement of a shot flow temperature as part of a melt temperature measurement process.

The disclosed technology generally relates to electrical overstress protection devices, and more particularly to electrical overstress monitoring devices for detecting electrical overstress events in semiconductor devices. In one aspect, a device configured to monitor electrical overstress (EOS) events includes a pair of spaced conductive structures configured to electrically arc in response to an EOS event, wherein the spaced conductive structures are formed of a material and have a shape such that arcing causes a detectable change in shape of the spaced conductive structures, and wherein the device is configured such that the change in shape of the spaced conductive structures is detectable to serve as an EOS monitor.

The disclosed technology generally relates to electrical overstress protection devices, and more particularly to electrical overstress monitoring devices for detecting electrical overstress events in semiconductor devices. In one aspect, a device configured to monitor electrical overstress (EOS) events includes a pair of spaced conductive structures configured to electrically arc in response to an EOS event, wherein the spaced conductive structures are formed of a material and have a shape such that arcing causes a detectable change in shape of the spaced conductive structures, and wherein the device is configured such that the change in shape of the spaced conductive structures is detectable to serve as an EOS monitor.

The present invention provides novel methods and devices that employ microfluidic technology to generate molecular melt curves. In particular, the devices and methods in accordance with the invention are useful in providing for the analysis of PCR amplification products.

The present invention provides novel methods and devices that employ microfluidic technology to generate molecular melt curves. In particular, the devices and methods in accordance with the invention are useful in providing for the analysis of PCR amplification products.