G01N29/223

Sensor system and method

A system includes a sensor comprising a sensor bonding layer disposed on a surface of the sensor, wherein the sensor bonding layer is a metallic alloy. An inlay includes a planar outer surface, wherein the inlay may be disposed on a curved surface of a structure. A structure bonding layer may be disposed on the planar outer surface of the inlay, wherein the structure bonding layer is a metallic alloy. The sensor bonding layer is coupled to the structure bonding layer via a metallic joint, and the sensor is configured to sense data of the structure through the metallic joint, the structure bonding layer, and the sensor bonding layer. The inlay comprises at least one of a modulus of elasticity, a shape, a thickness, and a size configured to reduce strain transmitted to the sensor.

WAFER CHUCK FOR HANDLING A WAFER

The invention relates to a wafer chuck for handling a wafer, in particular in a wafer process device, further preferably in a scanning acoustic microscope, with a fixing device for the wafer, wherein the fixing device has a free space for receiving the wafer and a holder with multiple wafer contact fingers, which are movable relative to the holder for a wafer. The wafer contact fingers are arranged annularly around the free space for the wafer, preferably in one plane. The wafer contact fingers can be moved in the direction of the free space for the wafer or can be moved away from the free space for the wafer. One actuation device for the wafer contact fingers is provided and, when the actuation device is actuated, the wafer contact fingers are moved or can be moved simultaneously.

Magneto-optical system for guided wave inspection and monitoring

The present application describes a magneto-optical based guided waves system for inspection and monitoring of assets. The system has a magnetostrictive-based wave emitter for signal generation and a network of optical fiber sensors for detection, both mechanically coupled to the asset, a device with embedded software for hardware control and signal processing, and a framework capable of providing visual and analytic insights about the condition of the structure of interest. The enhancement of flaw detection, location and characterization abilities of the system are obtained through the use of high sensitivity and passive fiber optics sensors with very small size, distributed and multi-parameter sensing capabilities.

Ultrasonic monitoring probe for internal service stress of a marine structural component

An ultrasonic monitoring probe for internal service stress of a marine structural component. The probe includes a detection wedge provided with two symmetrically arranged inclined surfaces at its top, two connecting channels vertical to the two inclined surfaces and penetrating through the detection wedge and provided with threaded holes close to the inclined surfaces and water storage cavities far away from the inclined surfaces, two ultrasonic transducers mounted in the threaded holes of the two connecting channels and configured for generating and receiving ultrasonic waves; two bottom rings located at a bottom of the detection wedge and arranged relative to the water storage cavities and configured for attachment to a surface of a detected component, a magnet disposed in a magnet placement hole arranged at a central position between the two connecting passages, and a monitoring device electrically connected with the two ultrasonic transducers.

Ultrasonic flow metering

Embodiments include a novel, easy to install, non-intrusive, ultrasonic water flow meter with a self-calibrating three-piezoelectric transducer configuration attached externally to a water pipe, that allows for accurate measurement of water flow, and can provide the flow data to a remote system for billing and further analysis. The water flow data can further be analyzed for water consumption by individual fixtures, in support of conservation and usage management efforts.

Apparatus and method for detecting microcrack using orthogonality analysis of mode shape vector and principal plane in resonance point

This application relates to an apparatus and method for detecting a microcrack using orthogonality analysis of a mode shape vector and a principal plane in a resonance point. The apparatus may include a measurement unit comprising multiple sensors and configured to measure whether a crack exists at a measurement target, and an analysis unit configured to determine whether a crack exists, on the basis of measurement values of the respective sensors. The measurement unit includes a fixing jig configured to fix the measurement target, an excitation means configured to apply a predetermined impact to the measurement target, and multiple acceleration sensors attached at predetermined locations on the measurement target. The analysis unit may further calculate frequency responses of the measurement target to the impact applied by the excitation means, and determine whether a crack exists by analyzing the number of resonance points and independence of the resonance points.

Composite part with integral electronic instrumentation circuit and its manufacturing method
11639916 · 2023-05-02 · ·

A composite part (sandwich or monolithic), including a rigid outer surface, to which is integrated an electronic instrumentation circuit, the electronic instrumentation circuit including a piezoelectric transducer, connected to a coil, an electronic control circuit, connected to a coil positioned facing the coil. The coil is printed on an insulating layer, printed directly on the rigid outer surface, the coil is printed on an insulating layer, covering the coil and the transducer, conducting tracks are printed on an insulating layer printed on at least one portion of the coil to be connected to it, the electronic control circuit being attached to the rigid outer surface and being connected to the tracks.

System and method for calibrating an acoustic monitoring system of an additive manufacturing machine
11648730 · 2023-05-16 · ·

A calibration system for an acoustic monitoring system of an additive manufacturing machine includes a calibration platform removably mountable to a build platform of the additive manufacturing machine and one or more calibrated acoustic sources mounted to the calibration platform. The one or more calibrated acoustic sources define a measurement standard when operating.

Systems, methods, and apparatus for tracking location of an inspection robot

Systems, methods, and apparatus for tracking location of an inspection robot are disclosed. An example apparatus for tracking inspection data may include an inspection chassis having a plurality of inspection sensors configured to interrogate an inspection surface, a first drive module and a second drive module, both coupled to the inspection chassis. The first and second drive module may each include a passive encoder wheel and a non-contact sensor positioned in proximity to the passive encoder wheel, wherein the non-contact sensor provides a movement value corresponding to the first passive encoder wheel. An inspection position circuit may determine a relative position of the inspection chassis in response to the movement values from the first and second drive modules.

System and method for nanoscale photoacoustic tomography

A method and system of nanoscale photoacoustic tomography (nPAT) for non-invasive three-dimensional mapping and characterization of fine cellular structures (such as but not limited to organelles, vesicles, and macromolecules) of biological samples is disclosed.