An ultrasonic probe apparatus and an ultrasonic imaging apparatus are disclosed. The ultrasonic probe apparatus includes: an ultrasonic transducer configured to output an electrical signal upon receiving ultrasonic waves; a sound absorption unit, one surface of which is an installation surface of the ultrasonic transducer and is electrically connected to the ultrasonic transducer; a first electronic circuit electrically connected to the sound absorption unit; and a substrate connection unit disposed between the sound absorption unit and the first electronic circuit, configured to electrically interconnect the first electronic circuit and the sound absorption unit. The ultrasonic imaging apparatus includes the above ultrasonic probe and a main body.

Described herein is an apparatus for inspecting a component includes a first feature inspector with at least one wave transducer configured to inspect a first feature of the component. The first feature inspector further includes at least one displacement sensor configured to detect a displacement of the at least one wave transducer of the first feature inspector relative to the first feature of the component. The apparatus further includes a second feature inspector with at least one wave transducer configured to inspect a second feature of the component. The second feature inspector further includes at least one displacement sensor configured to detect a displacement of the at least one wave transducer of the second feature inspector relative to the second feature of the component.

Described herein is an apparatus for inspecting a component includes a first feature inspector with at least one wave transducer configured to inspect a first feature of the component. The first feature inspector further includes at least one displacement sensor configured to detect a displacement of the at least one wave transducer of the first feature inspector relative to the first feature of the component. The apparatus further includes a second feature inspector with at least one wave transducer configured to inspect a second feature of the component. The second feature inspector further includes at least one displacement sensor configured to detect a displacement of the at least one wave transducer of the second feature inspector relative to the second feature of the component.

A container system, having a container with an outer wall and a cavity which has either a slotted-guide element or a sliding block, a sound transducer unit with a longitudinal axis, which includes the other of the sliding block or the slotted-guide element, and a coupling element for acoustically coupling the sound transducer unit with the container. A contour of the slotted-guide element is formed such that, when introducing the sound transducer unit into the cavity, a first path of movement of the sound transducer unit relative to the container occurs, without mechanical contact of the coupling element with either the sound transducer unit or the outer wall. A second path of movement occurs, where the sound transducer unit pivots relative to the container until the sound transducer unit reaches an end position, where the coupling element is pressed in between the outer wall and the sound transducer unit.

A container system, having a container with an outer wall and a cavity which has either a slotted-guide element or a sliding block, a sound transducer unit with a longitudinal axis, which includes the other of the sliding block or the slotted-guide element, and a coupling element for acoustically coupling the sound transducer unit with the container. A contour of the slotted-guide element is formed such that, when introducing the sound transducer unit into the cavity, a first path of movement of the sound transducer unit relative to the container occurs, without mechanical contact of the coupling element with either the sound transducer unit or the outer wall. A second path of movement occurs, where the sound transducer unit pivots relative to the container until the sound transducer unit reaches an end position, where the coupling element is pressed in between the outer wall and the sound transducer unit.

Provided is an ultrasonic inspection device for inspecting a packaged semiconductor device, The ultrasonic inspection device including an ultrasonic transducer that is disposed to face the semiconductor device; a medium holding unit that is provided at an end of the ultrasonic transducer facing the semiconductor device and holds a medium through which ultrasonic waves are propagated; a stage that moves the position of the semiconductor device relative to the ultrasonic transducer; and an analysis unit that analyzes the reaction of the semiconductor device in accordance with input of the ultrasonic waves from the ultrasonic transducer.

Provided is an ultrasonic inspection device for inspecting a packaged semiconductor device, The ultrasonic inspection device including an ultrasonic transducer that is disposed to face the semiconductor device; a medium holding unit that is provided at an end of the ultrasonic transducer facing the semiconductor device and holds a medium through which ultrasonic waves are propagated; a stage that moves the position of the semiconductor device relative to the ultrasonic transducer; and an analysis unit that analyzes the reaction of the semiconductor device in accordance with input of the ultrasonic waves from the ultrasonic transducer.

An inspection device inspects a joint-type outer joint member of a constant velocity universal joint that includes a cup section having a bottomed cylindrical shape and track grooves in an inner periphery thereof for torque transmitting elements, and a shaft section extending from a bottom of the cup section. The inspection device inspects the outer joint member, which is obtained through melt-welding on a cup member forming the cup section and a shaft member forming the shaft section. The inspection device includes a surface inspection unit to inspect for a defect which appears on a surface of the outer joint member due to welding, an internal inspection unit to inspect for an internal defect of a welded portion, and a recording unit to record an inspection result of the inspection. The inspection device is configured to efficiently perform in-line total inspection for the melt-welded joint-type outer joint member.

A system includes an inspection robot for performing an inspection on an inspection surface with an inspection robot, the apparatus comprising a position definition circuit structured to determine an inspection robot position on the inspection surface; a data positioning circuit structured to interpret inspection data, and to correlate the inspection data to the inspection robot position on the inspection surface; and wherein the data positioning circuit is further structured to determine position informed inspection data in response to the correlating of the inspection data with the inspection robot position, wherein the position informed inspection data comprises absolute position data.

A system includes an inspection robot for performing an inspection on an inspection surface with an inspection robot, the apparatus comprising a position definition circuit structured to determine an inspection robot position on the inspection surface; a data positioning circuit structured to interpret inspection data, and to correlate the inspection data to the inspection robot position on the inspection surface; and wherein the data positioning circuit is further structured to determine position informed inspection data in response to the correlating of the inspection data with the inspection robot position, wherein the position informed inspection data comprises absolute position data.