An ultrasonic quality control as disclosed can inspect a quality of a piece and classify the piece automatically. The piece can be scanned, and an image formed from the scanning. A reference piece is also scanned, and a reference image is formed. A negative image of the reference image is formed, and an indication image is created by utilizing the image and the negative image. The indication image is filtered by utilizing several image filters, each image filter filtering all data of the indication image except an image filter specific indication level data. Further several indication levels data are provided from the image filter specific indication level data, and the piece can be classified utilizing the several indication levels data.

A microelectromechanical sensing apparatus with calibration function comprises a microelectromechanical sensor and an IC chip. The microelectromechanical sensor comprises a proof mass, a movable driving electrode and a movable sensing electrode disposed on the proof mass, and a stationary driving electrode and stationary sensing electrode disposed on a substrate, wherein the sensing electrodes output a sensing signal when the proof mass vibrates. The IC chip comprises a conversion module electrically connected to the microelectromechanical sensor, wherein the conversion module converts the sensing signal into an input spectrum signal, and a calibration module electrically connected to the conversion module, wherein the calibration module receives the input spectrum signal and transforms the input spectrum signal into an output spectrum signal; wherein, the output spectrum signal is equal amplitude spectrum signal when the microelectromechanical sensor is subjected to an equal amplitude vibration and the input spectrum signal is an unequal amplitude spectrum signal.

A microelectromechanical sensing apparatus with calibration function comprises a microelectromechanical sensor and an IC chip. The microelectromechanical sensor comprises a proof mass, a movable driving electrode and a movable sensing electrode disposed on the proof mass, and a stationary driving electrode and stationary sensing electrode disposed on a substrate, wherein the sensing electrodes output a sensing signal when the proof mass vibrates. The IC chip comprises a conversion module electrically connected to the microelectromechanical sensor, wherein the conversion module converts the sensing signal into an input spectrum signal, and a calibration module electrically connected to the conversion module, wherein the calibration module receives the input spectrum signal and transforms the input spectrum signal into an output spectrum signal; wherein, the output spectrum signal is equal amplitude spectrum signal when the microelectromechanical sensor is subjected to an equal amplitude vibration and the input spectrum signal is an unequal amplitude spectrum signal.

The invention relates to a test kit which is designed for bioanalysis, in particular for an immunoassay. The test kit comprises at least one measuring sensor (M) for the quantitative detection of a substance and at least one reference sensor (R1, R2, R3) which is already supplied with the substance in a defined manner. In the method for analyzing a test kit, the measuring sensor (M) is read and a measurement value for a concentration, a substance quantity, or a mass is obtained, wherein the read value of the at least one measuring sensor (M) is scaled using the read values of the at least one reference sensor (R1, R2, R3), or a measured value which corresponds to the read value is obtained by means of a compensation curve which puts the read values of the reference sensors (R1, R2, R3) into relationship with the defined supply of the substance to the reference sensors (R1, R2, R3).

The invention relates to a test kit which is designed for bioanalysis, in particular for an immunoassay. The test kit comprises at least one measuring sensor (M) for the quantitative detection of a substance and at least one reference sensor (R1, R2, R3) which is already supplied with the substance in a defined manner. In the method for analyzing a test kit, the measuring sensor (M) is read and a measurement value for a concentration, a substance quantity, or a mass is obtained, wherein the read value of the at least one measuring sensor (M) is scaled using the read values of the at least one reference sensor (R1, R2, R3), or a measured value which corresponds to the read value is obtained by means of a compensation curve which puts the read values of the reference sensors (R1, R2, R3) into relationship with the defined supply of the substance to the reference sensors (R1, R2, R3).

A non-destructive testing calibration system includes a first multi-axis robotic device having a first end effector, a second multi-axis robotic device having a second end effector. A calibration assembly includes an emitter arranged on the first end effector and a receiver arranged on the second end effector, where the emitter and the receiver exchange a calibration signal between the first robotic device and the second robotic device. A data processor and a memory storing instructions, which when executed causes the data processor to perform operations comprising: performing a calibration scan, where the calibration scan includes a plurality of measurement points along a scan path of the emitter and the receiver; measuring the deviation between the emitter and the receiver at each measurement point along the scan path; and determining a corrected scan path based on the deviation between the emitter and receiver at each measurement point during the calibration scan.

A non-destructive testing calibration system includes a first multi-axis robotic device having a first end effector, a second multi-axis robotic device having a second end effector. A calibration assembly includes an emitter arranged on the first end effector and a receiver arranged on the second end effector, where the emitter and the receiver exchange a calibration signal between the first robotic device and the second robotic device. A data processor and a memory storing instructions, which when executed causes the data processor to perform operations comprising: performing a calibration scan, where the calibration scan includes a plurality of measurement points along a scan path of the emitter and the receiver; measuring the deviation between the emitter and the receiver at each measurement point along the scan path; and determining a corrected scan path based on the deviation between the emitter and receiver at each measurement point during the calibration scan.

Various embodiments of an interconnect device and modules and systems that utilize such interconnect device are disclosed. In one or more embodiments, the interconnect device can include a printed circuit board (PCB). The PCB can include a substrate forming a resiliently deflectable element, a conductive material disposed on the substrate, and an electrical contact disposed on the resiliently deflectable element and electrically coupled to the conductive material. The interconnect device can also include a connector that includes a connecting pin configured to electrically couple with the electrical contact of the resiliently deflectable element of the PCB and cause the resiliently deflectable element to deflect when the element contacts the connecting pin.

Various embodiments of an interconnect device and modules and systems that utilize such interconnect device are disclosed. In one or more embodiments, the interconnect device can include a printed circuit board (PCB). The PCB can include a substrate forming a resiliently deflectable element, a conductive material disposed on the substrate, and an electrical contact disposed on the resiliently deflectable element and electrically coupled to the conductive material. The interconnect device can also include a connector that includes a connecting pin configured to electrically couple with the electrical contact of the resiliently deflectable element of the PCB and cause the resiliently deflectable element to deflect when the element contacts the connecting pin.

The disclosure discloses a stress gradient high-efficiency non-destructive detection system based on frequency domain calculation of broadband swept frequency signals, and a detection method thereof. The detection method includes: step 1: calibrating an LCR wave velocity of an object to be measured; step 2: calculating a starting frequency and a cut-off frequency of broadband swept frequency signals based on the LCR wave velocity of the object to be measured in the step 1 and a stress gradient measuring range in a depth direction of the object to be measured; step 3: converting phase delay to time delay information based on the phase delay of the starting frequency and the cut-off frequency in the step 2; and step 4: determining stresses of depths corresponding to different frequency components based on the time delay information in the step 3 to finally realize layer-by-layer scanning of stresses at different depths of the measured object. The disclosure is used to solve the problem of low stress gradient measuring accuracy, and realize the high-efficiency characterization of the stress gradient in the depth direction.