A die bonding apparatus includes a first illumination device for irradiating a die with light along an optical axis of a photographing device, and a second illumination device that is located above the first illumination device and irradiates the die with light having a predefined angle with respect to the optical axis. The second illumination device includes a second light emitting section, and a light path control member that limits a light path of second irradiation light emitted from the second light emitting section. The second illumination device is disposed in such a way that the second irradiation light, the light path of which is limited by the light path control member, passes through the cylinder of the first illumination device, and the top surface of the die is irradiated with the second irradiation light.

The disclosed device, which, using an electron microscope or the like, minutely observes defects detected by an optical appearance-inspecting device or an optical defect-inspecting device, can reliably insert a defect to be observed into the field of an electron microscope or the like, and can be a device of smaller scale. The electron microscope, which observes defects detected by an optical appearance-inspecting device or an optical defect-inspecting device, has a configuration incorporating an optimal microscope that re-detects defects, and a spatial filter and a distribution polarization element are inserted at the pupil plane when making dark-field observations using this optical microscope. The electron microscope, which observes defects detected by an optical appearance-inspecting device or an optical defect-inspecting device, has a configuration incorporating an optimal microscope that re-detects defects, and a distribution filter is inserted at the pupil plane when making dark-field observations using this optical microscope.

In an inspection apparatus, inspection is carried out by linearly moving a wafer while rotating the wafer with respect to light. In a case where the wafer is rotated, the velocity of flow of air in outer regions of the wafer is increased, and there is a possibility that the flow of the air in the outer regions cause particles contained in an atmosphere in the vicinity of the wafer to be adhered to the wafer. In a case where such particles are adhered to the wafer, the particles are also detected as a defect, and therefore yields and cleanliness in a semiconductor production process cannot be correctly evaluated. Therefore, it is desirable that adhesion of the particles contained in the atmosphere in the vicinity of the wafer to the wafer be reduced as much as possible. Further, it is expected that, when, for example, rotation speed of the wafer is increased or a diameter of the wafer is increased, such particles are adhered further remarkably. This point has not been satisfactorily considered in the conventional arts. The invention has a feature that a conductor such as a draft to outer regions is supplied from above a substrate while the substrate is being rotated and the supplied conductor is exhausted on outside of the substrate.

An optical device includes an array of lenses and a plurality of first and second segments disposed under the array of lenses. At a first viewing angle, the array of lenses presents a first image for viewing without presenting the second image for viewing, and at a second viewing angle different from the first viewing angle, the array of lenses presents for viewing the second image without presenting the first image for viewing. In some examples, individual ones of the first and second segments can comprise specular reflecting, transparent, diffusely reflecting, and/or diffusely transmissive features. In some examples, individual ones of the first and second segments can comprise transparent and non-transparent regions. Some examples can incorporate more than one region producing an optical effect.

The present invention relates, in part, to systems for characterizing force (e.g., friction, wear, and/or torque). In one embodiment, the system allows for wear testing of samples in a high throughput manner. In another embodiment, the system allows for torque sensing in a non-contact manner.

A stimulated Raman scattering microscope device is configured to irradiates a sample with a first optical pulse at a first repetition frequency, to irradiate the sample with a second optical pulse of an optical frequency different from an optical frequency of the first optical pulse at a second repetition frequency, and to detect optical pulses of the first repetition frequency that are included in detected light from the sample irradiated with the first optical pulse and the second optical pulse, as a detected optical pulse train. The second optical pulse is generated by dispersing predetermined optical pulses that include lights of a plurality of optical frequencies, regulating to output optical pulses of a predetermined number of different optical frequencies out of the dispersed optical pulses at the second repetition frequency, and coupling the regulated optical pulses.

A dark-field optical system may include a rotational objective lens assembly with a dark-field objective lens to collect light from a sample within a collection numerical aperture, where the dark-field objective lens includes an entrance aperture and an exit aperture at symmetrically-opposed azimuth angles with respect to an optical axis, a rotational bearing to allow rotation of at least a part of the dark-field objective lens including the entrance aperture and the exit aperture around the optical axis, and a rotational driver to control a rotational angle of the entrance aperture. The system may also include a multi-angle illumination sub-system to illuminate the sample with an illumination beam through the entrance aperture at two or more illumination azimuth angles, where an azimuth angle of the illumination beam on the sample is selectable by rotating the objective lens to any of the two or more illumination azimuth angles.

An optical system (10) for a spectral component analysis of non-solid media, the system comprising: one or several light emitter assemblies (3), each comprising several light emitter modules (1) arranged in a curve along a ring-shaped circumference (3a) of the light emitter assembly (3); and one or several light detector assemblies (4), each comprising several light detector modules (2) arranged in a curve along a ring-shaped circumference (4a) of the light detector assembly (4), The light emitter assemblies (3) and the light detector assemblies (4) are coaxially arranged following one another along a common center axis (C) in an alternating manner.

In one embodiment, an agricultural sampling apparatus is provided. The apparatus comprising: a wave emitter; a wave transmitter configured to direct the waves from the wave emitter as a plurality of linewise waves to irradiate surface points of the agricultural sample; a dispersive element configured to receive waves arriving from the sample and deflect the arriving waves in at least two directions depending upon the wavelength of an arriving wave; and a detector configured with a plurality of detection elements disposed in at least two dimensions, the detector configured to convert the waves arriving from the dispersive element to a signal.

A system, comprising a processor and a memory. The memory stores instructions executable by the processor to determine, from an image including a portion of a surface of a human body, a reflected light intensity from the body surface portion, determine, a skin reflectance of the body surface portion based on a location of the body surface, a light source, and an image sensor location, and to determine, for the body surface portion, an incoming radiance, based on the skin reflectance and the reflected light intensity.