An edge portion measuring apparatus for measuring shape of an edge portion of a wafer, including, a holding portion that holds the wafer, a rotating means for rotating the wafer, a sensor including a light projecting portion for projecting a laser light from a light source onto the edge portion of the wafer held by the holding portion, and a light receiving detection unit receiving diffuse reflected light that the laser light projected is reflected at the edge portion of the wafer, wherein, rotating the wafer while holding the wafer, at least in a range from normal direction of a held surface of the wafer to normal direction of a surface opposite to the held surface, projecting the laser light and detecting the diffuse reflected light by the sensor, being able to measure the shape of an entire area of the edge portion of the wafer by a triangulation method.

A detection device, a detection apparatus, and a detection method are provided. The detection device includes a detection assembly and a driving assembly. At least two rows of detection units are provided, and the detection units are arranged in a matrix along the first direction and the second direction. During detection, the driving assembly may drive one or both of the to-be-detected object and the detection assembly to move along at least one of the first direction and the second direction, so that the detection units scan different areas of the surface of the to-be-detected object, thereby realizing a scanning of the entire surface. That is, the scanning of the surface of the to-be-detected object is completed by using multiple detection units, which improves detection efficiency for the to-be-detected surface, and realizes a relatively high imaging quality.

Embodiments herein provide a test apparatus and system for a millimeter wave reflection test to measure propagation of millimeter wave signal through a material at various incident angles. In one example, the test apparatus may include a mechanized arch over a base plate, the mechanized arch including antenna carriers coupled to the mechanized arch and configured to hold respective antennas. A motor assembly moves the antenna carriers along the mechanized arch while maintaining the antenna carriers at symmetrical (equal and opposite) angles with respect to the base plate.

An irradiation unit configured to scan and irradiate a sample with pulse waves; a reception unit configured to receive reflected waves of the pulse waves from the sample; a waveform generation unit configured to generate time waveforms of a signal representing the reflected waves at respective scan positions of the pulse waves; and a waveform correction unit configured to detect at least one peak in each of the time waveforms, and correct each of the time waveforms on a basis of each of positions of the at least one peak in the time waveforms are included.

Embodiments herein provide a test apparatus and system for a millimeter wave reflection test to measure propagation of millimeter wave signal through a material at various incident angles. In one example, the test apparatus may include a mechanized arch over a base plate, the mechanized arch including antenna carriers coupled to the mechanized arch and configured to hold respective antennas. A motor assembly moves the antenna carriers along the mechanized arch while maintaining the antenna carriers at symmetrical (equal and opposite) angles with respect to the base plate.

Presented herein are systems and methods directed to a multispectral absorption-based imaging approach that provides for rapid and accurate detection, localization, and quantification of gas leaks. The imaging technology described herein utilizes a scanning optical sensor in combination with structured and scannable illumination to detect and image spectral signatures produced by absorption of light by leaking gas in a quantitative manner over wide areas, at distance, and in the presence of background such as ambient gas and vapor. Moreover, the specifically structured and scannable illumination source of the systems and methods described herein provides a consistent source of illumination for the scanning optical sensor, allowing imaging to be performed even in the absence of sufficient natural light, such as sunlight. The imaging approaches described herein can, accordingly, be used for a variety of gas leak detection, emissions monitoring, and safety applications.

A measurement device includes mechanical support elements (101-104) for supporting a sample well, other mechanical support elements (105-109) for supporting a measurement head (112) suitable for optical measurements, and a control system (111) configured to control the measurement head to carry out at least two optical measurements from at least two different measurement locations inside the sample well, where each measurement location is a center point of a capture range from which radiation is captured in the respective optical measurement. The final measurement result is formed from the results of the at least two optical measurements in accordance with a pre-determined rule. The use of the at least two optical measurements from different measurement locations reduces measurement variation in situations where the sample well (153) contains a piece (158) of sample carrier.

An apparatus for processing crop, animal feed or components with a drivable tool and at least one NIR sensor system for determining at least feed values, having a scanning head with a spectrometric sensor and at least one light source behind a transparent pane which can be passed by the feed, comprises in a housing of the NIR sensor system a calibration surface, the appearance of which is different from the appearance of the feed to be scanned on the pane, wherein the scanning head is actively adjustable for calibration between a scanning position aligned with the pane and a calibration position aligned with the respective calibration surface.

A sheet material measurement system includes an optical system for identifying at least a first area of a moving sheet material suspected of including at least one defect. A terahertz (THz) system includes a THz generator for generating a THz beam and a THz detector and a scanner including a scanner head for positioning the THz system over the first area. A computing device is coupled to receive signals sensed by the THz detector after interacting with the first area. The computing device determines whether the first area is a metal-contaminated area including metal particles.

A sheet material measurement system includes an optical system for identifying at least a first area of a moving sheet material suspected of including at least one defect. A terahertz (THz) system includes a THz generator for generating a THz beam and a THz detector and a scanner including a scanner head for positioning the THz system over the first area. A computing device is coupled to receive signals sensed by the THz detector after interacting with the first area. The computing device determines whether the first area is a metal-contaminated area including metal particles.