A method and apparatus for obtaining reference samples during the generation of a mid-infrared (MW) image without requiring that the sample being imaged be removed is disclosed. A tunable MIR laser generates a light beam that is focused onto a specimen on a specimen stage that moves the specimen in a first direction. An optical assembly includes a scanning assembly having a focusing lens and a mirror that moves in a second direction, different from the first direction, relative to the stage such that the focusing lens maintains a fixed distance between the focusing lens and the specimen stage. A light detector measures an intensity of light leaving the point on the specimen. A controller forms an image from the measured intensity. A reference stage is positioned such that the mirror moves over the reference stage in response to a command so that the controller can also make a reference measurement.

Disclosed is an inspection and measurement system for hollow cylindrical objects (100) such as internal gun barrel surface of large caliber gun barrels (150). The system (100) comprises an inspection device (200,500) operatively connected to the controller (400). The controller (400) is configured to receive realtime 2D image and 3D laser scan data captured by the inspection device (200,500) to generate 2D and 3D maps of the internal surface of the hollow cylindrical object and provide a means of visualization and interpretation of inspection and measurement data.

An edge portion measuring apparatus for measuring shape of an edge portion of a wafer, including, a holding portion that holds the wafer, a rotating means for rotating the wafer, a sensor including a light projecting portion for projecting a laser light from a light source onto the edge portion of the wafer held by the holding portion, and a light receiving detection unit receiving diffuse reflected light that the laser light projected is reflected at the edge portion of the wafer, wherein, rotating the wafer while holding the wafer, at least in a range from normal direction of a held surface of the wafer to normal direction of a surface opposite to the held surface, projecting the laser light and detecting the diffuse reflected light by the sensor, being able to measure the shape of an entire area of the edge portion of the wafer by a triangulation method.

Provided is a method for the simultaneous determination of parameters, in particular of at least two, three or four parameters, of at least one resin layer applied to at least one carrier material by recording and evaluating at least one NIR spectrum in a wavelength range between 500 nm and 2500 nm, preferably between 700 nm and 2000 nm, more preferably between 900 nm and 1700 nm, and particularly advantageously between 1450 nm and 1550 nm, using at least one NIR measuring head, in particular at least one NIR multimeter head.

A positioning device for positioning a stage relative to a tool mounted on a carrier device includes two intersecting linear axes disposed one above the other for pre-positioning the stage. A first magnetic levitation unit is configured to support the stage on one of the linear axes, the stage being actively movable for fine positioning in six degrees of freedom. A measuring head and first and second 6-DOF encoders are configured to determine a position of the stage relative to the carrier device. The measuring head is mounted on the other linear axis. The first 6-DOF encoder is disposed between the carrier device and the measuring head and the second 6-DOF encoder is disposed between the measuring head and the stage. A second magnetic levitation unit disposed on the other linear axis is configured to actively move the measuring head in the six degrees of freedom.

Provided is a method for the simultaneous determination of parameters, in particular, of at least two, three, or four parameters, of at least one resin layer applied to at least one carrier material by recording and evaluating at least one Near Infra Red (NIR) spectrum in a wavelength range between 500 nm and 2500 nm, preferably between 700 nm and 2000 nm, more preferably between 900 nm and 1700 nm, and particularly advantageously between 1450 nm and 1550 nm, using at least one NIR measuring head, in particular at least one NIR multimeter head.

An appearance inspection apparatus includes a shape measurement unit configured to measure the three-dimensional shape of a weld and a data processor configured to process sample shape data and shape data acquired by the shape measurement unit. The data processor includes a first learning data set generator configured to generate a plurality of first learning data sets based on the sample shape data, a second learning data set generator configured to generate a plurality of second learning data sets based on the first learning data sets, a determination model generator configured to generate multiple types of determination models using the second learning data sets, and a first determination unit configured to determine whether the shape of the weld is good or bad based on the shape data and one of the determination models.