A measurement system may direct an illumination beam including at least one of a first frequency comb or a second frequency comb to a sample, and generate a sequence of images of the sample based on the first frequency comb and the second frequency comb. The system may include one or more coding optical elements to encode data associated with one or more transfer matrix elements into the sequence of images of the sample. The system may further generate a transfer matrix dataset including measurements of at least one of the one or more transfer matrix elements associated with the sample based on at least one of spectral, spatial, or temporal analysis of the sequence of images, and generate one or more measurements of the sample based on the transfer matrix dataset.

A method of manufacturing a semiconductor device using a semiconductor measurement apparatus includes extracting an interference pattern using a microsphere, and measuring a distance between a specimen and the microsphere, based on the interference pattern. A semiconductor measurement apparatus includes a light source configured to output at least one light, a scanner having a microsphere-objective lens, the scanner configured to allow the at least one light to be incident on a specimen, a spectrometer configured to obtain a spectrum of light reflected from the specimen; and a distance measurement apparatus configured to calculate a microsphere-to-specimen distance by analyzing a change in the spectrum.

Described is a system for inducing and detecting multi-photon processes, in particular multi-photon fluorescence or higher harmonic generation in a sample. The system comprises a dynamically-controllable light source, said dynamically-controllable light source comprising a first sub-light source, said first sub-light source being electrically controllable such as to generate controllable time-dependent intensity patterns of light having a first wavelength, and at least one optical amplifier, thereby allowing for active time-control of creation of multi-photon-excitation. The system further comprises a beam delivery unit for delivering light generated by said dynamically-controllable light source to a sample site, and a detector unit or detector assembly for detecting signals indicative of said multi-photon process, in particular multi-photon fluorescence signals or higher harmonics signals.

A method is disclosed for selecting an optimal value for an adjustable parameter of a structured light metrology (SLM) system, for scanning an object. The SLM system performs test scans of the object to acquire a plurality of sets of measurements of the object, wherein a different value is used for the parameter for each test scan. For each test scan, a value of a quality metric is calculated, based on the set of measurements of the object associated with the test scan and simulation data representing a simulated scan of the object by the SLM system. A test scan is then identified that has a quality metric value that satisfies a specified optimization criterion; and a value of the adjustable parameter that was used for the identified test scan is selected as the optimal value of the adjustable parameter, for scanning the object.

A inspection apparatus includes a light-emitting part that emits light, a first align key attached to one side of the light-emitting part, a light-receiving part disposed to be spaced apart from the light-emitting part in a first direction and receiving the light emitted from the light-emitting part, and a camera attached to one side of the light-receiving part, disposed to be spaced apart from the align key in the first direction, and capturing the first align key.

Various examples are provided related to oblique view imaging for die bonding inspection. In one example, a method includes obtaining an oblique view image of a die on an inspection stage in an XOY plane, the image obtained at an angle with respect to the die; generating a top view image in the XOY plane by projecting the oblique view image using a projection matrix based upon top view and oblique view intrinsic parameters; and determining positions of fiducial markers in the projected top view image. In another example, a method includes obtaining an oblique view image of a die on an inspection stage in an XOY plane; generating a side view image in a YOZ plane or an XOZ plane by projecting the oblique view image using a projection matrix based upon side view and oblique view intrinsic parameters; and determining positions of fiducial markers.

A method for quality inspection of an etching paste material based on a spectral response difference, including: identifying a position of density mutation boundary through spectral collection and density gradient analysis. Applying a specific frequency beam to obtain the resonance response parameter, generating stress field reconstruction data. Performing a reverse optical tracking to obtain a defect formation path, generating degradation prediction data. Establishing a self-organizing optical monitoring grid, to form a hierarchical spectral fingerprint library. Constructing a multi-point linked defect blocking network, to form an interconnected optical energy field. Monitoring a cooperative response to obtain network stability data, Identifying abnormal position coordinates based on a material quality grade and the network stability data, obtaining the abnormal position coordinates. Performing a phase adjustment to obtain a phase difference spectral set, conducting a phase comparison marking on the abnormal position coordinates, completing the quality inspection of the etching paste material.

An inspection device comprises a layer conveyor which has a pickup and a drive in order to pick up a respective individual anode or cathode layer from a transfer location and bring it to a delivery location. A stacking table picks up the anode or cathode layer from the pickup at the delivery location to form a layer stack. The layer conveyor delivers an anode or cathode layer from its pickup to the stacking table at the delivery location. An image sensor is directed towards an area encompassing an upper edge of the layer stack located on the stacking table, which comprises a connection tab of the anode or cathode layer located at the top of the layer stack and performs an image feed before or after the anode or cathode layer is deposited on the stacking table.