A system for evaluating a rigidity of an angle bracket includes a test system having a first test fixture and a second test fixture. The system includes an angle bracket coupon including a first wall, a second wall coupled to the first wall at a bend to define an angle between the first wall and the second wall, and at least one three dimensional feature defined at the bend that extends between the first wall and the second wall. The angle bracket coupon is to be coupled to at least one of the first test fixture and the second test fixture to evaluate the rigidity of the angle bracket.

The present disclosure provides for a guide for use in a compression test, the compression test comprising loading a test sample between a first loading plate and an opposing load applied between the test sample and the first loading plate in a loading direction, the guide comprising: at least one support member, positionable between the first loading plate and the load and extending substantially parallel to the loading direction to constrain the test sample in a direction perpendicular to the loading direction, wherein, when in use, the at least one support member is positioned to define a space between the first loading plate and the support member such that when a load is applied the test sample is deformable in a direction perpendicular to the loading direction within the space.

A method for measuring multiple rock properties using a multi-stage indentation test is provided. The method includes measuring load and displacement versus time on an indentation measurement unit, while preforming the multi-stage indentation test. The multi-stage indentation test includes indenting a saturated specimen to full load to generate a line segment 1, releasing the load on the saturated specimen to generate a line segment 2, indenting the saturated specimen to full load to generate a line segment 3, holding the loading until the displacement curve levels off to generate a line segment 4, and reducing the loading to zero to generate a line segment 5.

The invention relates to a load simulation test stand having at least one hydraulic test cylinder (1) which comprises at least one cylinder chamber (1a, 1b) which can be charged with hydraulic fluid, preferably two cylinder chambers (1a, 1b) which can be charged with hydraulic fluid and which act counter to one another, in the case of which load simulation test stand the at least one test cylinder (1), in particular each of multiple provided test cylinders (1), comprises at least one capacity element (5, 6, 7), preferably a capacity element (5, 6, 7) which is exchangeable or which is adjustable in terms of hydraulic capacity, by means of which the hydraulic overall capacity of the at least one cylinder chamber (1a, 1b) can be adjusted. The invention furthermore relates to a method for operating a load simulation test stand having at least one test cylinder (1), wherein the at least one test cylinder (1) is connected to a load which is to be moved, and wherein the load is moved by means of a pressure control system (4) by temporally changeable control of the fluid pressure in the at least one cylinder chamber (1a, 1b) of the at least one test cylinder (1), and wherein, for the load which is to be moved by means of the at least one test cylinder (1), in a manner dependent on the pressure control bandwidth of the pressure control system (4), the natural frequency of the unit composed of the at least one test cylinder (1) and load is set to a value smaller than the pressure control bandwidth by changing the capacity of the capacity element (5, 6, 7), preferably adjusting the capacity of the adjustable capacity element (5, 6, 7).

The present invention provides a method for evaluating a semiconductor wafer concerning a breaking strength of a notch portion of the semiconductor wafer, comprising: applying a load to a notch portion of the semiconductor wafer to be evaluated toward the center of the wafer such that the notch portion of the semiconductor wafer is broken; and evaluating the breaking strength of the notch portion. The present invention provides a method and an apparatus for evaluating a semiconductor wafer that can evaluate the breaking strength of a notch portion of a semiconductor wafer with higher precision and higher sensitivity.

Provided is a material performance testing system under a fixed multi-field coupling effect in a hypergravity environment, including a hoisted sealed cabin, a bearing frame, a high-temperature furnace, a mechanical test device, and a buffer device. The bearing frame and the high-temperature furnace are fixedly mounted inside the hoisted sealed cabin. The bearing frame is covered on the high-temperature furnace. The buffer device is mounted at a bottom of the high-temperature furnace. Upper and lower ends of the mechanical test device are connected in a top of the bearing frame and the bottom of the high-temperature furnace. A sample is connected and mounted at an end of the mechanical test device.

A sub-micron scale property testing apparatus including a test subject holder and heating assembly. The assembly includes a holder base configured to couple with a sub-micron mechanical testing instrument and electro-mechanical transducer assembly. The assembly further includes a test subject stage coupled with the holder base. The test subject stage is thermally isolated from the holder base. The test subject stage includes a stage subject surface configured to receive a test subject, and a stage plate bracing the stage subject surface. The stage plate is under the stage subject surface. The test subject stage further includes a heating element adjacent to the stage subject surface, the heating element is configured to generate heat at the stage subject surface.

A fixing jig is provided, including a supporting base, a fixing plate, and a fixing component. The supporting base includes a first upper surface. The fixing plate is disposed on the supporting base. A side of the fixing plate is pivotally connected to the supporting base and includes a second upper surface, a bottom surface, and via a hole. The fixing component presses the fixing plate on the second upper surface. The fixing jig can fix an object pending testing and allows one flexible electric circuit board of the object pending testing to be exposed outside of the fixing jig, so that when performing a pull force test, this can allow an angle between two flexible electric circuit boards to be 90 degrees, thereby improving accuracy of an experimental result.

Methods for drilling a wellbore into a subterranean formation include preparing a drilling fluid and circulating the drilling fluid in the wellbore while drilling in the subterranean formation, forming a filtercake from the drilling fluid, creating or encountering one or more fractures in the subterranean formation while drilling, and allowing a portion of the filtercake formed to at least partially seal the one or more fractures while continuing the drilling.

The present invention relates to a test system and method capable of simultaneously carrying out a high-throughput test of mechanical properties for miniature specimens. The system comprises one workstation (17) and a plurality of specimen test modules (16) installed horizontally or vertically on a workbench (15), wherein the workstation (17) comprises an operation interface, a data processing unit and a load output unit; each specimen test module (16) comprises a drive unit (5), an interchangeable clamp unit (8), a displacement sensor (2), and a load sensor (14); the workstation (17) controls the drive unit (5) of the specimen test module (16) and receives detection data of the displacement sensor (2) and the load sensor (14); each specimen test module (16) optionally performs mechanical property testing independently; and the workstation (17) controls simultaneously started testing of a plurality of specimens (9). The present invention can achieve tensile, bending, compression bending, stress-rupture, relaxation, and fatigue strength tests on a plurality of specimens at the same time.