An optical inspection is performed to detect potential defects within integrated circuit devices and a first electron-based inspection of less than all of the potential defects is performed to identify primary actual defects. A process window of manufacturing parameter settings used to manufacture the integrated circuit devices is identified and the integrated circuit devices manufactured using the manufacturing parameter settings inside the process window have less than a threshold number of the primary actual defects. To identify additional actual defects a second electron-based inspection is performed that is limited to selected ones of the potential defects in the integrated circuit devices that were manufactured using the manufacturing parameter settings inside the process window but were uninspected in the first electron-based inspection.

A method and system for calibrating a PET scanner are described. The PET scanner may have a field of view (FOV) and multiple detector rings. A detector ring may have multiple detector units. A line of response (LOR) connecting a first detector unit and a second detector unit of the PET scanner may be determined. The LOR may correlate to coincidence events resulting from annihilation of positrons emitted by a radiation source. A first time of flight (TOF) of the LOR may be calculated based on the coincidence events. The position of the radiation source may be determined. A second TOF of the LOR may be calculated based on the position of the radiation source. A time offset may be calculated based on the first TOF and the second TOF. The first detector unit and the second detector unit may be calibrated based on the time offset.

Various methods and systems are provided for analyzing sample inclusions. As one example, a correction factor may be generated based on inclusion properties of a first sample determined using both an optical emission spectrometry (OES) system and a charged-particle microscopy with energy dispersive X-ray spectroscopy (CPM/EDX) system. The OES system may be calibrated with the correction factor. The inclusion properties of a second, different, sample may be determined using the calibrated OES system.

An X-ray analyzer includes an X-ray source, a straight tube type multi-capillary, a flat plate spectroscopic crystal, a parallel/point focus type multi-capillary X-ray lens, and a Fresnel zone plate. A qualitative analysis is performed over an area on the sample, the flat plate spectroscopic crystal and the Fresnel zone plate are removed from the X-ray optical path, and X-rays are collected by the multi-capillary lens and the sample is irradiated. When analyzing the chemical morphology of an element, the multi-capillary lens retracts from the optical path, the source rotates, and the flat plate spectroscopic crystal and the Fresnel zone plate are inserted on the optical path. A narrow sample area is irradiated by the Fresnel zone plate with X-rays having energy extracted from the flat plate spectroscopic crystal. This makes it possible to carry out accurate qualitative analysis on the sample and perform detailed analysis of more minute parts.

An analysis apparatus comprises: a moveable stage assembly; a sample holder on a top surface of the stage assembly; a first photon source and a first photon detector or detector array, the first photon source being configured to emit a first beam of photons that intercepts the surface of a sample at a first location on the sample and the first photon detector or detector array being configured to detect photons that are emitted from the first location; and a second photon source and a second photon detector or detector array, the second photon source being configured to emit a second beam of photons that intercepts the surface of the sample at a second location on the sample, the second location being spaced apart from the first location, and the second photon detector or detector array being configured to detect photons that are emitted from the second location.

Through-tubing, cased-hole sealed material density can be evaluated using gamma ray measurements. Density evaluation comprises detecting, by at least one detector positioned within a casing of a wellbore including a sealing material positioned between the casing and a subsurface formation, electromagnetic radiation generated in response to nuclear radiation being emitted outward toward the subsurface formation, determining an electromagnetic radiation count based on the detected electromagnetic radiation, selecting at least one of a first reference material having a density that is less than a density of the sealing material and a second reference material having a density that is greater than the density of the sealing material, adjusting the electromagnetic radiation count based on the density of the at least one of the first reference material and the second reference material, and determining a density of the sealing material based on the adjusted electromagnetic radiation count.

An inspection apparatus for inspecting an inspection target surface arranged on an inspection plane, includes an X-ray generation tube having a target including an X-ray generation portion that generates X-rays by irradiation with an electron beam, and configured to emit X-rays to the inspection plane; and an X-ray detector configured to detect X-rays emitted from a foreign substance existing on the inspection target surface irradiated with the X-rays from the X-ray generation portion and totally reflected by the inspection target surface. The X-ray detector has an energy resolution not less than 1 keV or the X-ray detector has no energy analysis function.

An inspection apparatus for inspecting an inspection target object, includes an X-ray generation tube having a target including an X ray generation portion that generates X-rays by irradiation with an electron beam, and configured to emit X-rays to an inspection target surface of the inspection target object, an X-ray detector configured to detect X-rays emitted from a foreign substance existing on the inspection target surface irradiated with the X-rays from the X ray generation portion and totally reflected by the inspection target surface, and an adjustment mechanism configured to adjust a relative position between the inspection target surface and the X-ray detector.

A device for examining a sample by X-radiation having a radiation generation system for generating primary radiation, a first goniometer arm on which the radiation generation system is mounted and which is pivotable about a goniometer axis, a detection system configured to detect secondary radiation emanating from the sample, a second goniometer arm on which the detection system is mounted and which is pivotable about the goniometer axis, and an evacuable sample chamber within which the sample is arrangeable in a sample region encompassing a portion of the goniometer axis, the sample chamber being delimited by a sample chamber wall which has a transmission region which is transmissive to the primary radiation and is vacuum-tight, in order to allow the primary radiation to penetrate into the sample chamber and to impinge on the sample region at different angles of incidence.

A system and method for analyzing a three-dimensional structure of a sample includes generating a first x-ray beam having a first energy bandwidth less than 20 eV at full-width-at-half maximum and a first mean x-ray energy that is in a range of 1 eV to 1 keV higher than an absorption edge energy of a first atomic element of interest, and that is collimated to have a collimation angular range less than 7 mrad in at least one direction perpendicular to a propagation direction of the first x-ray beam; irradiating the sample with the first x-ray beam at a plurality of incidence angles relative to a substantially flat surface of the sample, the incidence angles of the plurality of incidence angles in a range of 3 mrad to 400 mrad; and simultaneously detecting a reflected portion of the first x-ray beam from the sample and detecting x-ray fluorescence x-rays and/or photoelectrons from the sample.