A monitoring system and method are provided for determining at least one property of an integrated circuit (IC) comprising a multi-layer structure formed by at least a layer on top of an underlayer. The monitoring system receives measured data comprising data indicative of optical measurements performed on the IC, data indicative of x-ray photoelectron spectroscopy (XPS) measurements performed on the IC and data indicative of x-ray fluorescence spectroscopy (XRF) measurements performed on the IC. An optical data analyzer module analyzes the data indicative of the optical measurements and generates geometrical data indicative of one or more geometrical parameters of the multi-layer structure formed by at least the layer on top of the underlayer. An XPS data analyzer module analyzes the data indicative of the XPS measurements and generates geometrical and material related data indicative of geometrical and material composition parameters for said layer and data indicative of material composition of the underlayer. An XRF data analyzer module analyzes the data indicative of the XRF measurements and generates data indicative of amount of a predetermined material composition in the multi-layer structure. A data interpretation module generates combined data received from analyzer modules and processes the combined data and determines the at least one property of at least one layer of the multi-layer structure.

A method includes determining a predicted contrast-to-noise ratio sensitivity function (CNR SF) for crack detection of a predetermined target flaw size with the radiographic inspection system in the selected set-up. The method also includes qualifying an inspection image quality indicator (IQI) for the predetermined target flaw size for use in the radiographic inspection system in the selected set-up. The method also includes performing an inspection process. The inspection process includes selecting the qualified inspection IQI for the predetermined target flaw size. The inspection process also includes performing an inspection test on the qualified inspection IQI using the radiographic inspection system in the selected set-up. The inspection process also includes determining one or more inspection output parameters. The inspection process also includes verifying that the one or more inspection output parameters meet or exceed minimum qualified values to qualify the radiographic inspection system in the selected set-up.

A method is provided for inspection of an item comprising acquiring a projection image of the item using a radiation imaging system and obtaining a plurality of simulated projection images of the item or a component thereof, based on a simulation of a numerical three-dimensional model. A relative orientation of the item with respect to the imaging system is determined by comparing the projection image to the plurality of simulated images, and at least one angle of rotation is determined by taking into account a viewing angle and the relative orientation. The method further comprises moving the item and/or the imaging system in accordance with the at least one angle of rotation and acquiring a further projection image of the item.

Methods and systems for improving a measurement recipe describing a sequence of measurements employed to characterize semiconductor structures are described herein. A measurement recipe is repeatedly updated before a queue of measurements defined by the previous measurement recipe is fully executed. In some examples, an improved measurement recipe identifies a minimum set of measurement options that increases wafer throughput while meeting measurement uncertainty requirements. In some examples, measurement recipe optimization is controlled to trade off measurement robustness and measurement time. This enables flexibility in the case of outliers and process excursions. In some examples, measurement recipe optimization is controlled to minimize any combination of measurement uncertainty, measurement time, move time, and target dose. In some examples, a measurement recipe is updated while measurement data is being collected. In some examples, a measurement recipe is updated at a site while data is collected at another site.

A system to characterize a film layer within a measurement box is disclosed. The system obtains a first mixing fraction corresponding to a first X-ray beam, the mixing fraction represents a fraction of the first X-ray beam inside a measurement box of a wafer sample, the measurement box represents a bore structure disposed over a substrate and having a film layer disposed inside the bore structure. The system obtains a contribution value for the measurement box corresponding to the first X-ray beam, the contribution value representing a species signal outside the measurement box that contributes to a same species signal inside the measurement box. The system obtains a first measurement detection signal corresponding to a measurement of the measurement box using the first X-ray beam. The system determines a measurement value of the film layer based on the first measurement detection signal, the contribution value, and the first mixing fraction.

A method for assigning one of a safe and threat condition to an object includes determining density and effective atomic number values for a plurality of predetermined safe and threat objects, plotting the values in a probability map to correlate corresponding density and effective atomic number values with each of the safe and threat objects, scanning an object to provide dual-energy attenuation images representing the object, decomposing the attenuation images into dual-reference material equivalent path length images to provide reference material equivalent path lengths representing the object, converting the reference path lengths into object path lengths, determining the effective atomic number for each pixel representing the object, and, imposing the effective atomic number and the mass density of the unknown object onto the probability map to determine a probability that the object is correlated with one of the predetermined safe and threat objects.

There is provided a method for assigning an attribute to x-ray attenuation including the steps of acquiring first and second reference material equivalent path length information associated with a first range of dual-energy x-ray attenuation information, acquiring second and third reference material equivalent path length information associated with a second range of dual-energy x-ray attenuation information, and, joining the first the first dual-energy x-ray attenuation information range with the second dual-energy x-ray attenuation information range using coefficients representing dual-energy x-ray attenuation information of the second reference material to define a third dual-energy x-ray attenuation information range upon which may be imposed dual-energy x-ray attenuation values within the third dual-energy x-ray attenuation information range to determine corresponding first reference material equivalent path lengths and third reference material equivalent path lengths.

There is provided a method for assigning an attribute to x-ray attenuation including scanning in an x-ray scanning device first and second reference materials each having known atomic composition, dimensions and orientation in the scanning device. The device emits x-rays which pass through the first reference material with first reference material path lengths and the second reference material with second reference material path lengths. The x-rays are detected by detectors to provide a plurality of dual-energy attenuation images having dual-energy x-ray attenuation information. The dual-energy x-ray attenuation information in the dual-energy attenuation images is associated with the first and second reference material path lengths. Then, each of the first and second reference material path lengths are expressed collectively as a function of the associated attenuation information to define attenuation surfaces upon which may be imposed dual-energy attenuation values to determine corresponding first and second reference material equivalent path lengths.

A method for assigning attributes to an unknown object includes the steps of scanning the unknown object at least partially overlapping with a background object within an x-ray scanning device to provide dual-energy attenuation images having dual-energy attenuation information representing an overlap region wherein the background object and the unknown object overlap, decomposing the attenuation images into reference material equivalent path length images, removing the background object to provide reference material equivalent path lengths representing the unknown object, converting the reference material equivalent path lengths representing the unknown object into unknown object path lengths multiplied by a predetermined scaling factor, reducing the scaling factor to provide a contour of the unknown object and unknown object path lengths, and, determining a density and effective atomic number of the unknown object.

There is provided a method for assigning an attribute to an unknown object overlapping with a predetermined background object. The unknown object is scanned overlapping with the background object within an x-ray scanning device to obtain a plurality of dual-energy attenuation images having attenuation information representing the background object and an overlap region wherein the background object and the unknown object overlap. The dual-energy attenuation images are decomposed into reference material equivalent path length images. The reference material equivalent path lengths representing the background object in the overlap region are determined and eliminated from the overlap region to provide reference material equivalent path length images having first and second reference material equivalent path lengths through only the unknown object.