The invention relates to a method of examining a sample using a charged particle microscope, comprising the steps of providing a charged particle beam, as well as a sample; scanning said charged particle beam over said sample; and detecting, using a first detector, emissions of a first type from the sample in response to the beam scanned over the sample. Spectral information of detected emissions of the first type is used for assigning a plurality of mutually different phases to said sample. In a further step, a corresponding plurality of different color hues—with reference to an HSV color space—are associated to said plurality of mutually different phases. Using a second detector, emissions of a second type from the sample in response to the beam scanned over the sample are detected. Finally an image representation of said sample is provided.

A radiation imaging apparatus comprises an image generating unit configured to generate a material characteristic image by using a plurality of radiation images of different radiation energy levels; an evaluation information calculation unit configured to calculate evaluation information which indicates a correlation between a plurality of material characteristic images; and a scattered ray amount estimation unit configured to estimate, based on the evaluation information, an amount of scattered rays included in the plurality of radiation images.

An imaging system includes: a micro computed tomography (micro-CT) subsystem, a specimen processing subsystem, a scanning electron microscopy (SEM) and a processor. The micro-CT subsystem includes an X-ray source and an X-ray detector, and is configured to acquire a three-dimensional image of a specimen. The specimen processing subsystem includes a focused ion beam subsystem and a mechanical cutting device. The focused ion beam subsystem is configured to process the specimen in a first processing manner, and the mechanical cutting device is configured to process the specimen in a second processing manner to obtain a target section of a target area. The SEM is located above the specimen and is configured to acquire a two-dimensional image of the target section. The processor is configured to perform three-dimensional reconstruction on the two-dimensional images to obtain a three-dimensional imaging of the specimen.

Various embodiments include a method for facilitating tomographic reconstruction comprising: emitting an x-ray beam from an x-ray unit; ascertaining an attenuation of the x-ray beam during transmission through an object situated in a beam path of the x-ray beam; ascertaining structure data of the object based at least in part on the attenuation of the x-ray beam; and ascertaining a pose of the x-ray unit relative to the object using a digital model of the object and based at least in part on the attenuation of the x-ray beam.

Systems and methods for scatter correction of x-ray images are provided. A scatter image of an object can be corrected using partial-scatter free images acquired using an aperture plate. The plate is positioned between an object and a radiation detector and includes apertures in a grid. The original x-rays pass through the apertures and scattered x-rays can be blocked by the aperture plate. The aperture plate can be moved to different positions, allowing partial scatter-free images to be acquired at each position of the aperture plate. A full scatter-free image can be generated by combining partial scatter-free images. The scatter and scatter-free images can be further used to train scatter correction models.

In one embodiment, a computing system may access design data of a printed circuit board to be produced by a manufacturing process. The system may determine one or more corrections for the design data of the printed circuit board based on one or more correction rules for correcting one or more parameters associated with the printed circuit board. The system may automatically adjust one or more of the parameters associated with the design data of the printed circuit board based on the one or more corrections. The adjusted parameters may be associated with an impedance of the printed circuit board. The one or more corrections may cause the impendence of the printed circuit board to be independent from layer thickness variations of the printed circuit board to be produced by the manufacturing process.

Method for automatic sorting of batteries, the method including generating a fan-shaped X-ray beam; scanning the batteries with the fan-shaped X-Ray beam; for each battery, capturing X-rays that pass though the battery with an X-ray detector and converting the X-rays into first and second digital images, wherein the first digital image represents X-rays at a first energy, and the second digital image represents X-rays at a second energy; automatically analyzing the first and second digital images to determine a type of the battery by identifying characteristic features of each battery type based on a gray spectrum of at least 8 bit resolution that is looked up in a model database branch; and sorting the batteries by type.

The present invention provides a charged particle beam device with which optimal parameters for the device can be effectively derived in a short time period. This charged particle beam device comprises: an electron gun (1) that irradiates a sample (10) with an electron beam (2); an image processing unit (901) that acquires an image of the sample (10) from a signal (12) generated by the sample (10) due to the electron beam (2); a database (604) that holds correspondence between a first parameter that is an optical condition, a second parameter that is a value pertaining to device performance, and a third parameter that is information pertaining to the device configuration, and stores a plurality of analysis values and measurement values; and a learning machine (605) that searches the database (604) and derives a first parameter that satisfies a target value of the second parameter.

There is provided a technique for non-destructively and relatively easily acquiring orientation information of an anisotropic material even for a large-sized object. An object is irradiated with X-rays in a tangential direction of a curved anisotropic material from a radiation source of a phase-contrast X-ray optical system. A scattering image is then obtained using a detection signal of X-rays having penetrated through the object. Structure information of the anisotropic material is acquired based on the scattering image.

A method of generating a correction line indicating a relationship between an amount of deviation of an edge of a wafer pattern from an edge of a reference pattern and a width of a space adjacent to the edge of the reference pattern, includes: creating an appearance-frequency graph of widths of spaces adjacent to reference patterns located within a designated area; obtaining images of wafer patterns corresponding to a plurality of space widths shown in the appearance-frequency graph; calculating amounts of deviation between edges of the wafer patterns on the images and edges of corresponding reference patterns; plotting a plurality of data points on a coordinate system, the plurality of data points being specified by the plurality of space widths and the amounts of deviation; and generating a correction line from the plurality of data points on the coordinate system.