A charged particle beam apparatus using a light guide that improves light utilization efficiency includes a detector including a scintillator for emitting light when a charged particle is incident, a light receiving element, and a light guide for guiding the light from the scintillator to the light receiving element. The light guide includes: an incident surface that faces a light emitting surface of the scintillator and to which the light emitted by the scintillator is incident; an emitting surface that is configured to emit light; and a reflecting surface that is inclined with respect to the incident surface so that the light from the incident surface is reflected toward the emitting surface. The emitting surface is smaller than the incident surface. A slope surface is provided between the incident surface and the emitting surface, faces the reflecting surface, and is inclined with respect to the incident surface.

In one embodiment, an X-ray inspection system may access a first set of X-ray images of one or more first samples that are labeled as being non-conforming. The system may adjust a classification algorithm based on the first set of X-ray images. The classification algorithm may classify samples into conforming or non-conforming categories based on an analysis of corresponding X-ray images. The system may analyze a second set of X-ray images of a number of second samples using the adjusted classification algorithm. The second samples may be previously inspected samples that have been classified as conforming by the classification algorithm during a previous analysis before the classification algorithm is adjusted. The system may identify one or more of the second samples from the second set of X-ray images. Each identified second sample may be classified as non-conforming by the adjusted classification algorithm.

A fiber optic plate 122 including a plurality of core glasses 122a, a clad glass 122b covering the core glass 122a, and a light-absorbing glass 122c disposed between the plurality of core glasses 122a, wherein a content of TiO.sub.2 in the core glass 122a is 7% by mass or less, a content of B.sub.2O.sub.3 in the core glass 122a is 15% by mass or more, and a content of WO.sub.3 in the core glass 122a is more than 0% by mass.

In one embodiment, a computing system may access design data of a printed circuit board to be produced by a manufacturing process. The system may determine one or more corrections for the design data of the printed circuit board based on one or more correction rules for correcting one or more parameters associated with the printed circuit board. The system may automatically adjust one or more of the parameters associated with the design data of the printed circuit board based on the one or more corrections. The adjusted parameters may be associated with an impedance of the printed circuit board. The one or more corrections may cause the impendence of the printed circuit board to be independent from layer thickness variations of the printed circuit board to be produced by the manufacturing process.

A radiation detector including: a sensor substrate including a flexible base member and a layer provided on a first surface of the base member and formed with plural pixels that accumulates electrical charge generated in response to light converted from radiation; a conversion layer provided on the first surface side of the sensor substrate, the conversion layer converts radiation into the light; and an elastic layer provided on the opposite side of the conversion layer to a side provided with the sensor substrate, the elastic layer having a greater restoring force with respect to bending than the sensor substrate.

A scanner comprises an electromagnetic wave source; and a detector positioned to measure emissions from the electromagnetic wave source, wherein the electromagnetic wave source comprises a first technology, and the electromagnetic wave source is interchangeable with a second electromagnetic wave source comprising a second technology and/or wherein the detector comprises a first technology, and the detector is interchangeable with a second detector comprising a second technology. The scanner can comprise a storage medium having instructions stored thereon to perform a method for training the scanner for an inspection application, the method comprising operating the electromagnetic wave source to generate electromagnetic wave emissions at a plurality of combinations of parameters; moving a conveyor belt to expose product having a plurality of contaminants of different sizes to the emissions generated at more than one combination of parameters; recording attenuated emissions that pass through the product at more than one combination of parameters; and selecting a combination of parameters to use when inspecting for the contaminant.

An image processing apparatus comprises a processing unit configured to performing energy subtraction processing using information concerning a plurality of attenuation rates corresponding to a plurality of radiation energies that are different from each other and are obtained by performing imaging in which an object is irradiated with radiation. The processing unit estimates attenuation information of a decomposition target material contained in the object using at least one image obtained by the energy subtraction processing, and generates an image concerning the decomposition target material using the attenuation information and the information concerning the plurality of attenuation rates.

Systems, methods, apparatuses, and computer program products for the detection of X-ray electromagnetic radiation using a scintillator are provided. In one example embodiment, at least one X-ray device may comprise an X-ray source configured to emit an X-ray cone, a scintillator, a detector, and at least one shroud positioned to block stray light from reaching the detector.

In one embodiment, an X-ray inspection system may nondestructively inspect a printed circuit board to measure a number of dimensions at a number of pre-determined locations of the printed circuit board. The X-ray inspection system may generate a data set for the printed circuit board based on the measured dimensions. The X-ray inspection system may calculate one or more drilling values based on the data set of the printed circuit board. The X-ray inspection system may provide, to a drilling machine, instructions for drilling a number of plated-through vias based on the calculated drilling values for the printed circuit board.

A image acquiring device includes a camera configured to scan radiation passing through a target object in one direction and acquire an X-ray image, a scintillator configured to convert the X-rays into light, and a control device configured to input the X-ray image to a trained model constructed through machine learning in advance and execute a noise removal process. The camera includes a scan camera in which pixel lines each having M pixels arranged in one direction are configured to be arranged in N columns in a direction orthogonal to one direction and which is configured to output a detection signal for each of the pixels, and a readout circuit configured to output the X-ray image by adding the detection signals output from at least two pixels for each of the pixel lines of N columns in the scan camera and sequentially outputting the added N detection signals.