A method, apparatus, and system for scanning an elongate structure. A scanner in a scanning system is moved axially along the elongate structure using a translating structure in the scanning system. The elongate structure is scanned axially using an x-ray beam emitted by the scanner as the scanner moves axially along the elongate structure to perform an axial scan. The x-ray beam has a first orientation. A location on the elongate structure having an inconsistency is detected while scanning the elongate structure axially. The elongate structure is scanned at the location with the x-ray beam in a second orientation.

This disclosure relates to monitoring and assessing the mechanical stability and fluid accumulation in natural or man-made slopes comprising primarily of unconsolidated material, such as embankments, dams, roads, waste dumps, as well as man-made heaps of bulk materials that may occur in the stockpiling of grains, gravel, stones, sand, coal, cement, fly ash, salts, chemicals, clays, crushed limestone as well as heaps of mining ores, including crushed, milled and/or agglomerated ore, and run-of-mine materials.

An information processing apparatus that processes information based on a radiation image capturing a subject, comprises: an average value obtainment unit configured to obtain an average value of pixel values of the radiation image; a variance value obtainment unit configured to obtain a variance value of the pixel values of the radiation image; and an arithmetic processing unit configured to calculate, based on the average value and the variance value, one of an effective atomic number and a surface density forming the subject.

A method for assigning one of a safe and threat condition to an object includes determining density and effective atomic number values for a plurality of predetermined safe and threat objects, plotting the values in a probability map to correlate corresponding density and effective atomic number values with each of the safe and threat objects, scanning an object to provide dual-energy attenuation images representing the object, decomposing the attenuation images into dual-reference material equivalent path length images to provide reference material equivalent path lengths representing the object, converting the reference path lengths into object path lengths, determining the effective atomic number for each pixel representing the object, and, imposing the effective atomic number and the mass density of the unknown object onto the probability map to determine a probability that the object is correlated with one of the predetermined safe and threat objects.

There is provided a method for assigning an attribute to x-ray attenuation including the steps of acquiring first and second reference material equivalent path length information associated with a first range of dual-energy x-ray attenuation information, acquiring second and third reference material equivalent path length information associated with a second range of dual-energy x-ray attenuation information, and, joining the first the first dual-energy x-ray attenuation information range with the second dual-energy x-ray attenuation information range using coefficients representing dual-energy x-ray attenuation information of the second reference material to define a third dual-energy x-ray attenuation information range upon which may be imposed dual-energy x-ray attenuation values within the third dual-energy x-ray attenuation information range to determine corresponding first reference material equivalent path lengths and third reference material equivalent path lengths.

There is provided a method for assigning an attribute to x-ray attenuation including scanning in an x-ray scanning device first and second reference materials each having known atomic composition, dimensions and orientation in the scanning device. The device emits x-rays which pass through the first reference material with first reference material path lengths and the second reference material with second reference material path lengths. The x-rays are detected by detectors to provide a plurality of dual-energy attenuation images having dual-energy x-ray attenuation information. The dual-energy x-ray attenuation information in the dual-energy attenuation images is associated with the first and second reference material path lengths. Then, each of the first and second reference material path lengths are expressed collectively as a function of the associated attenuation information to define attenuation surfaces upon which may be imposed dual-energy attenuation values to determine corresponding first and second reference material equivalent path lengths.

A method for assigning attributes to an unknown object includes the steps of scanning the unknown object at least partially overlapping with a background object within an x-ray scanning device to provide dual-energy attenuation images having dual-energy attenuation information representing an overlap region wherein the background object and the unknown object overlap, decomposing the attenuation images into reference material equivalent path length images, removing the background object to provide reference material equivalent path lengths representing the unknown object, converting the reference material equivalent path lengths representing the unknown object into unknown object path lengths multiplied by a predetermined scaling factor, reducing the scaling factor to provide a contour of the unknown object and unknown object path lengths, and, determining a density and effective atomic number of the unknown object.

There is provided a method for assigning an attribute to an unknown object overlapping with a predetermined background object. The unknown object is scanned overlapping with the background object within an x-ray scanning device to obtain a plurality of dual-energy attenuation images having attenuation information representing the background object and an overlap region wherein the background object and the unknown object overlap. The dual-energy attenuation images are decomposed into reference material equivalent path length images. The reference material equivalent path lengths representing the background object in the overlap region are determined and eliminated from the overlap region to provide reference material equivalent path length images having first and second reference material equivalent path lengths through only the unknown object.

A method, apparatus, and system for scanning an elongate structure. A scanner in a scanning system is moved axially along the elongate structure using a translating structure in the scanning system. The elongate structure is scanned axially using an x-ray beam emitted by the scanner as the scanner moves axially along the elongate structure to perform an axial scan. The x-ray beam has a first orientation. A location on the elongate structure having an inconsistency is detected while scanning the elongate structure axially. The elongate structure is scanned at the location with the x-ray beam in a second orientation.

There is provided a novel Cu bonding wire that achieves a favorable FAB shape and achieves a favorable bond reliability of the 2nd bonded part even in a rigorous high-temperature environment. The bonding wire for semiconductor devices is characterized in that the bonding wire includes: a core material of Cu or Cu alloy; and a coating layer containing conductive metal other than Cu formed on a surface of the core material, wherein the coating layer has a region containing Pd as a main component on a core material side, and has a region containing Ni and Pd in a range from a wire surface to a depth of 0.5 d when a thickness of the coating layer is defined as d (nm) in a thickness direction of the coating layer, the thickness d of the coating layer is 10 nm or more and 130 nm or less, a ratio C.sub.Ni/C.sub.Pd of a concentration C.sub.Ni (mass %) of Ni to a concentration C.sub.Pd (mass %) of Pd relative to the entire wire is 0.02 or more and 0.7 or less, a position indicating a maximum concentration of Ni is present in the range from the wire surface to a depth of 0.5 d in a concentration profile in a depth direction of the wire, and the maximum concentration of Ni is 10 atomic % or more, and at least one of the following conditions (i) and (ii) is satisfied: (i) a concentration of In relative to the entire wire is 1 ppm by mass or more and 100 ppm by mass or less (ii) a concentration of Ag relative to the entire wire is 1 ppm by mass or more and 500 ppm by mass or less.