Patent classifications
G01N2223/645
Quality inspection method
Provided is a quality inspection method in which an inner state of a three-dimensional laminated molding can be quickly and easily inspected without destroying the three-dimensional laminated molding. To this end, the quality inspection method uses an X-ray Talbot imaging system 1 which creates a reconstructed image of an inspection object on the basis of a moire image obtained by using an X-ray detector to read X-rays which, after being radiated from an X-ray source 11a, have passed through: a plurality of grids in which a plurality of slits S are arranged in a direction perpendicular to the radiation axis direction of the X-ray; and an inspection object H placed on a subject table 13. The inspection object H is a three-dimensional laminated molding formed into a three-dimensional shape by laminating multiple layers of constituent materials. The reconstructed image is created while the inspection object H is placed on the subject table 13 in such a way that at least the lamination direction of layers constituting the inspection object H and the arrangement direction of the plurality of slits S in the plurality of grids are parallel. The inner state of the inspection object H is inspected on the basis of the reconstructed image.
SMALL SPOT
A system to characterize a film layer within a measurement box is disclosed. The system obtains a first mixing fraction corresponding to a first X-ray beam, the mixing fraction represents a fraction of the first X-ray beam inside a measurement box of a wafer sample, the measurement box represents a bore structure disposed over a substrate and having a film layer disposed inside the bore structure. The system obtains a contribution value for the measurement box corresponding to the first X-ray beam, the contribution value representing a species signal outside the measurement box that contributes to a same species signal inside the measurement box. The system obtains a first measurement detection signal corresponding to a measurement of the measurement box using the first X-ray beam. The system determines a measurement value of the film layer based on the first measurement detection signal, the contribution value, and the first mixing fraction.
Method and system utilizing imaging analysis for golf balls
A method and system for determining concentricity of a multiple layer golf ball are disclosed herein. One or more images of a golf ball are generated using an X-ray source, a camera or a digital detector, and an image intensifier. An edge detection algorithm is preferably utilized. The method also includes calculating Y,Z center coordinates of the a best fit diameter or ellipse of the inner edge layer and outer edge layer of the multiple layer golf ball.
X-ray system and method for golf ball inspection
Systems and methods for measuring the concentricity of golf balls using filter pairs to gather and analyze data on concentricity.
System and method using x-rays for depth-resolving metrology and analysis
A system and method for analyzing a three-dimensional structure of a sample includes generating a first x-ray beam having a first energy bandwidth less than 20 eV at full-width-at-half maximum and a first mean x-ray energy that is in a range of 1 eV to 1 keV higher than an absorption edge energy of a first atomic element of interest, and that is collimated to have a collimation angular range less than 7 mrad in at least one direction perpendicular to a propagation direction of the first x-ray beam; irradiating the sample with the first x-ray beam at a plurality of incidence angles relative to a substantially flat surface of the sample, the incidence angles of the plurality of incidence angles in a range of 3 mrad to 400 mrad; and simultaneously detecting a reflected portion of the first x-ray beam from the sample and detecting x-ray fluorescence x-rays and/or photoelectrons from the sample.
X-RAY AUTOMATED CALIBRATION AND MONITORING
A scanner comprises an electromagnetic wave source; a collimator positioned to alter the electromagnetic waves emitted from the electromagnetic wave source into an electromagnetic beam; and a detector positioned to measure one or more levels of electromagnetic energy of the electromagnetic beam, wherein a collimator element is spatially adjustable in at least one axis via one or more adjusting mechanisms to change the one or more levels of electromagnetic energy measured the detector.
RAPID MEASUREMENT SYSTEMS AND METHODS FOR PLASTIC ARTICLES
Systems and methods for rapid measurement of the chemical and structural properties of plastic articles are provided. The systems and methods involve measuring both mechanical deformation of the plastic article and x-ray fluorescence of the plastic article in order to determine changes in composition as a result of contamination and/or issues associated with plastic article manufacturing lines. The systems and methods can be performed in minutes, compared to hours or days for typical testing methods.
Apparatus and method for inspecting battery cells for automation of total inspection
The present invention relates to an apparatus and a method for inspecting battery cells for automation of total inspection. To this end, the present invention is configured such that test objects are sequentially stacked on a test object casing provided on an upper portion of a mounting stage of a main stage, images of the test objects are obtained by radiography after the test object casing is moved to a test object inspection unit, and the test objects stacked on the test object casing are unloaded to the outside after the images are obtained. Accordingly, the present invention enables total inspection to be performed on battery cells, which are the test objects, in order to quickly divide good and defective products, and solves a delay of a flow rate caused by X-ray inspection of the test object inspection unit in order to improve productivity and efficiency.
Methods and systems for semiconductor metrology based on wavelength resolved soft X-ray reflectometry
Methods and systems for measuring structural and material characteristics of semiconductor structures based on wavelength resolved, soft x-ray reflectometry (WR-SXR) at multiple diffraction orders are presented. WR-SXR measurements are simultaneous, high throughput measurements over multiple diffraction orders with broad spectral width. The availability of wavelength resolved signal information at each of the multiple diffraction orders improves measurement accuracy and throughput. Each non-zero diffraction order includes multiple measurement points, each different measurement point associated with a different wavelength. In some embodiments, WR-SXR measurements are performed with x-ray radiation energy in a range of 10-5,000 electron volts at grazing angles of incidence in a range of 1-45 degrees. In some embodiments, the illumination beam is controlled to have relatively high divergence in one direction and relatively low divergence in a second direction, orthogonal to the first direction. In some embodiments, multiple detectors are employed, each detecting different diffraction orders.
UTENSIL FOR EVALUATING LENGTH MEASUREMENT ERROR IN X-RAY CT DEVICE FOR THREE-DIMENSIONAL SHAPE MEASUREMENT
In order to sufficiently capture spatial distortion specific to an X-ray CT device and evaluate the three-dimensional shape measurement accuracy of the X-ray CT device, in a utensil, by attaching support rods fixing spheres to the tip thereof and having different lengths to a base spheres are arranged in an XYZ space on the base. On a flat surface on the top of the base, the support rods supporting the spheres and having different lengths are arranged at predetermined intervals. In doing so, the spheres are arranged in the XYZ space respectively at appropriate inter-sphere distances.