In one embodiment, a computing system may obtain a high-resolution X-ray image and a number of low-resolution X-ray images of an object of interest. The system may divide each of the low-resolution X-ray images into a number of low-resolution patches. Each low-resolution patch may be associated with a portion of the object of interest. The system may input a set of low-resolution patches associated with a same portion of the object of interest into a machine-learning model. Each low-resolution patch of the set may be from a different low-resolution X-ray image. The machine-learning model may output a high-resolution patch for the same portion of the object of interest. The system may compare the high-resolution patch outputted by the machine-learning model to a corresponding portion of the high-resolution X-ray image of the object of interest and adjust one or more parameters of the machine-learning model based on the comparison.

An X-ray inspection device of the present invention includes a sample placement unit 11 for placing a sample as an inspection target therein, a sample placement unit positioning mechanism 30 for moving the sample placement unit 11, a goniometer 20 including first and second rotation members 22, 23 that rotate independently of each other, an X-ray irradiation unit 40 installed on the first rotation member 22, and a two-dimensional X-ray detector 50 installed on the second rotation member 23. The sample placement unit positioning mechanism 30 includes a χ rotation mechanism 35 for rotating the sample placement unit 11 and a ϕ-axis about a χ-axis that is orthogonal to a θs-axis and a θd-axis at a measurement point P and extends horizontally.

A method includes obtaining a layout of a circuit pattern implemented on a semiconductor wafer, and identifying one or more polygons in the layout based on a length criteria. One or more measurement gauges are placed on the identified polygons to thereby obtain measured polygons. A scanning electron microscope (SEM) image of the circuit pattern is obtained. The SEM image is aligned with the layout including the measured polygons. A critical dimension of one or more objects in the SEM image is measured. The one or more objects correspond to the one or more polygons. Based on the measured critical dimension, it is determined whether the circuit pattern is acceptable.

In various aspects, an apparatus for an electron-beam powder bed fusion (EB-PBF) printer includes a radiation collector configured to collect radiation in an ultraviolet (UV) spectrum at a powder bed surface within a vacuum chamber during an electron beam scanning cycle of EB-PBF operation, an optical fiber configured to be transparent to the radiation in the UV spectrum and configured to receive the radiation at the powder bed surface via the radiation collector, and a processor configured to receive one or more extracted wavelengths of radiation in the UV spectrum based on the radiation carried on the optical fiber.

Computer-implemented methods for monitoring the functional state of a system for the computer-tomographic examination of workpieces by carrying out one or more computer-tomographic measurements on the workpiece. The measurements each result here in at least one measured value for at least one measurement variable. The method for monitoring the functional state selects measured values for at least one measurement variable from at least two measurements on one or more workpieces. At least one degree of variation for the selected measured values of the at least one measurement variable as well as at least one reference degree of variation for measured values of the at least one measurement variable is determined. The functional state of the system is determined by comparing the at least one determined degree of variation with the at least one reference degree of variation for the at least one measurement variable.

An equipment for inspecting a secondary battery is provided. The equipment includes a loading device on which a secondary battery is loaded in an upright position, and a side portion inspecting device which inspects a side portion of the secondary battery loaded on the loading device, wherein the side portion inspecting device comprises an elevation unit which lifts the secondary battery loaded on the loading device so as to be withdrawn out of the loading device and allows the secondary battery to return to its original position after a first period of time elapses and a side portion inspecting unit which captures an image of the side portion of the secondary battery, which is withdrawn out of the loading device by the elevation unit, thereby inspecting the side portion of the secondary battery.

Provided are X-ray and metal detectable thermoset composites and methods of detecting the same. The present X-ray and metal detectable thermoset composites may be formed into trays, sheets, or other substrates suitable for use in food or pharmaceutical processing or manufacturing.

An X-ray product quality automatic inspection device of the present invention comprises: a distributed X-ray source having a plurality of targets and being able to generate X-rays for irradiating an inspected product from the plurality of targets in a predetermined sequence; a detector for receiving the X-rays generated by the distributed X-ray source and outputting a signal representing characteristics of the received X-rays; a transport device for carrying the inspected product to pass through an X-ray radiation region; and a power supply and control device, which is used to supply power to and control the X-ray product quality automatic inspection device, to form characteristic information of the inspected product according to the signal from the detector and to provides an inspection and analysis result of the inspected product according to the characteristic information.

A method and system for inspection of an item, and a use thereof, are presented. The method comprises acquiring a plurality of projection images of an item at a plurality of projection angles for performing a tomographic reconstruction of the item. A plurality of objects are detected in the tomographic reconstruction and each object has a generic shape described by a parametric three-dimensional numerical model. Said detection comprises determining initial estimates of position and/or orientation of each object and at least one geometrical parameter of the three-dimensional model for each object. The initial estimates are iteratively refining by using a projection-matching approach, in which forward projection images are simulated for the objects according to operating parameters of the radiation imaging device and a difference metric between acquired projection images and simulated forward projection images is reduced at each iteration step.

Provided is a quality inspection method in which an inner state of a three-dimensional laminated molding can be quickly and easily inspected without destroying the three-dimensional laminated molding. To this end, the quality inspection method uses an X-ray Talbot imaging system 1 which creates a reconstructed image of an inspection object on the basis of a moire image obtained by using an X-ray detector to read X-rays which, after being radiated from an X-ray source 11a, have passed through: a plurality of grids in which a plurality of slits S are arranged in a direction perpendicular to the radiation axis direction of the X-ray; and an inspection object H placed on a subject table 13. The inspection object H is a three-dimensional laminated molding formed into a three-dimensional shape by laminating multiple layers of constituent materials. The reconstructed image is created while the inspection object H is placed on the subject table 13 in such a way that at least the lamination direction of layers constituting the inspection object H and the arrangement direction of the plurality of slits S in the plurality of grids are parallel. The inner state of the inspection object H is inspected on the basis of the reconstructed image.