Patent classifications
G01N2223/646
PROCESS FOR NON-DESTRUCTIVE QUALITY CONTROL INSPECTION OF SELF-PIERCING RIVET (SPR) JOINTS
A system and method for inspecting an assembly including components joined by self-piercing rivets by a computerized tomography (CT) scan of the joint is provided. The system includes a source of x-rays, a mounting unit for an assembly including the joint which is subject to the x-rays, and an x-ray detector disposed opposite the source for detecting the x-rays. The x-rays are provided at a high energy level of at least 200 kV to generate images having a resolution of at least 200 micrometers (μm). A computer stitches the images together to form reconstructive images which show details of the joint. The assembly to be inspected is not destroyed or modified prior to the inspection process. The resolution of the images generated by the x-rays is high enough to determine the presence of cracks, if any, the interlock (S.sub.H), minimum thickness (T.sub.min), and overall structure of the unmodified assembly.
Multi-scan computed tomography defect detectability
Systems and methods for representing internal defects of an object to determine defect detectability using a multi-scan computed tomography (CT) approach are disclosed. A defect-free object may be scanned using a CT machine. In one or more separate scans, phantom defects may be imaged and the resulting projections combined and reconstructed to represent internal defects. The air-normalized intensities of the object and the phantom defect may be used to represent voids and inclusions. Subtraction of materials may be represented by the quotient of the air-normalized intensities thereof, and the addition of materials may be represented by the product of the air-normalized intensities thereof. A void may be represented by subtracting a phantom defect scan from the object scan. An inclusion may be represented by creating a void, scanning an additional phantom defect, and adding the additional phantom defect in the volume created by the void.
Real time additive manufacturing process inspection using x-ray emission and detection through a build chamber
Systems and methods for real time, nondestructive inspection of an object being formed by additive manufacturing is provided. The disclosed systems and methods can be used with any additive manufacturing system and can detect defects introduced during fabrication. In operation, additive manufacturing of the object can be paused and the object rotated within the build chamber. An x-ray pulse can then be directed through a linear aperture towards the object being formed inside the build chamber. A linear x-ray detector array can detect the x-ray pulse and an x-ray image of the object being formed can be created. By rotating the object being formed during exposure to the x-ray pulse at least one half of one full rotation, the entire volume of the object can be inspected.
SYSTEM AND METHOD FOR INSPECTING DEFECTS OF STRUCTURE BY USING X-RAY
A method of detecting a defect in a wind turbine blade uses a system that includes an X-ray generator, moved by a first transporting means, that generates X-ray to be irradiated to the wind turbine blade; an X-ray detector, moved by a second transporting means, that detects the X-ray generated by the X-ray generator and transmitted through the wind turbine blade; and a control unit. To detect a defect, the control unit divides virtually the wind turbine blade into a plurality of lengthwise sections based on a thickness profile thereof, receives a location of the X-ray generator, and controls output of the X-ray generator based on the location of the X-ray generator relative to the plurality of lengthwise sections. In particular, the output of the X-ray generator is decreased for a section among the plurality of lengthwise sections that is farther from a hub of the wind turbine blade.
STRUCTURE INFORMATION ACQUISITION METHOD AND STRUCTURE INFORMATION ACQUISITION APPARATUS
There is provided a technique for non-destructively and relatively easily acquiring orientation information of an anisotropic material even for a large-sized object. An object is irradiated with X-rays in a tangential direction of a curved anisotropic material from a radiation source of a phase-contrast X-ray optical system. A scattering image is then obtained using a detection signal of X-rays having penetrated through the object. Structure information of the anisotropic material is acquired based on the scattering image.
RAPID X-RAY RADIATION IMAGING SYSTEM AND MOBILE IMAGING SYSTEM
An X-ray radiation imaging system is for imaging a tubular object. The X-ray radiation imaging system may include an enclosure, a motorized base to be positioned within the enclosure and configured to rotate the tubular object, and a gantry within the enclosure. The X-ray radiation imaging system may further include an X-ray source coupled to the gantry and being adjacent the motorized base. The X-ray source may be configured to irradiate the tubular object with X-ray radiation while the motorized base rotates the tubular object. The X-ray radiation imaging system may also include an X-ray detector coupled to the gantry and being adjacent the tubular object, and the X-ray detector may receive the X-ray radiation from the tubular object. The X-ray radiation imaging system may include a processor coupled to the X-ray source and the X-ray detector and configured to generate an image of the tubular object.
ELECTRON BEAM DETECTION APPARATUS FOR SEMICONDUCTOR DEVICE AND ELECTRON BEAM DETECTION ASSEMBLY
An electron beam detection apparatus for a semiconductor device and an electron beam detection assembly are disclosed, the electron beam detection apparatus including a stage, which is configured to carry and hold the semiconductor device at a top surface of the stage, and is translatable in two directions orthogonal to each other, an aiming device, configured to determine a position of the semiconductor device in a coordinate system of the electron beam detection apparatus by capturing an image of the semiconductor device, the aiming device provided with a first field of view and a first optical axis, and an electron beam detection device, configured to detect an emergent electron beam exiting the semiconductor device by projecting an electron beam to the semiconductor device, the electron beam detection device provided with a second field of view and a second optical axis which is not consistent with the first optical axis.
TUBE WELD X-RAY INSPECTION DEVICE
Provided is a tube weld X-ray inspection device for inspecting an abnormality, such as a tube welding part crack, of a heat exchanger by using X-rays.
INSPECTION SYSTEM FOR QUALITY ANALYSIS OF A PRODUCT TO BE INSPECTED
The invention relates to an inspection system for quality analysis of a food product, comprising conveyance means for moving it to an inspection area, a lighting device consisting of LEDs that emit a light sequence directed towards the inspection area to light up the product by transmission, a linear camera with at least one line of pixels for collecting a plurality of images in each light sequence of the lighting device, and focusing means for focusing the beam emitted by the lighting device. Advantageously, the lighting device is activated in a pulsed manner, generating a light sequence with at least two different illuminations, at least one of which is a transmission-pulsed illumination. The lighting device is aligned on the axis formed by the product to be inspected and the linear camera.
LIVE FLAW DETECTION SYSTEM FOR MULTI-BUNDLED CONDUCTOR SPLICING SLEEVE AND APPLICATION METHOD THEREOF
A live flaw detection system for a multi-bundled conductor splicing sleeve and an application method thereof are disclosed. The system includes an upper apparatus and a lower apparatus, where the upper apparatus includes an unmanned aerial vehicle and an industrial X-ray machine, and a laser sensor, and the lower apparatus includes a press plate frame apparatus, vertical screw slide table modules, a horizontal screw slide table module, a projection imager, and a linear retractable apparatus. The unmanned aerial vehicle functions as a power apparatus that controls the system to be online or offline, the industrial X-ray machine is configured to perform ray flaw detection on each splicing sleeve, the laser sensor is configured to guide the unmanned aerial vehicle to land the lower apparatus on splicing sleeves accurately, and the press plate frame apparatus is configured to fixedly clamp the splicing sleeves.