Provided is a method of analyzing a diffraction pattern of a mixture, the method including: a first step of fitting, through use of a fitting pattern including a term obtained by multiplying a known target pattern indicating a target component by a first intensity ratio, and a term obtained by multiplying an unknown pattern indicating a residual group consisting of one or more residual components by a second intensity ratio, and having the first intensity ratio, the second intensity ratio, and the unknown pattern as fitting parameters, the fitting pattern to the observed pattern by changing the first and the second intensity ratio in a state where the unknown pattern is set to an initial pattern; and a second step of fitting the fitting pattern to the observed pattern by changing the unknown pattern while restricting the changes of the first and the second intensity ratio.

A method, apparatus, and system for scanning an elongate structure. A scanner in a scanning system is moved axially along the elongate structure using a translating structure in the scanning system. The elongate structure is scanned axially using an x-ray beam emitted by the scanner as the scanner moves axially along the elongate structure to perform an axial scan. The x-ray beam has a first orientation. A location on the elongate structure having an inconsistency is detected while scanning the elongate structure axially. The elongate structure is scanned at the location with the x-ray beam in a second orientation.

The present disclosure is directed to systems and methods for scanning an object of interest. The system can include a controller for generating scan instructions. The system can further include a scanner, responsive to the scan instructions, for providing radiation at an energy to generate scan data for the object of interest and an other scanner, responsive to scan instructions from the controller generated based on the scan data, for providing radiation an at other energy to generate scan data for the object of interest. The system can also include a conveyance controller for generating conveyance instructions to control the relative movement of the scanner and the other scanner with respect to the object of interest based on the scan data.

An inspection device and method suppressing measurement time and power consumption. A detection device according to the present disclosure includes a first probe with a first antenna unit for transmission, a second probe with a second antenna unit for reception, the second probe being opposed to the first probe at a predetermined distance, a measurement unit that measures a measurement signal including a propagation characteristic of an electromagnetic wave in a medium between the first and second antenna units, and a calculation unit that calculates characteristics information of the medium based on the measurement signal. In a first mode, the measurement unit measures the measurement signal in a first frequency band for the electromagnetic wave propagating in the medium, and in a second mode, the measurement unit measures the measurement signal in a second frequency band, which is a part of the first frequency band for the electromagnetic wave.

The invention relates to a method for testing an electronic component for defects, by examining the electronic component in a production line by means of automatic optical inspection; determining the coordinates of regions in which an examination using automatic optical inspection is not possible; transmitting the coordinates of these regions from the production line to a computer; transporting the electronic component from the production line into an X-ray device which is arranged outside the production line, for non-destructive material testing; transmitting the coordinates of the regions from the computer to this X-ray device; examining the electronic component by means of the X-ray device only in the regions in which an examination using automatic optical inspection is not possible; transmitting the results of the examination in the X-ray device to the computer; returning the electronic component to the production line if the result indicates that it is not defective.

Various embodiments for generating a defect sample for electron beam review are provided. One method includes combining, on a defect-by-defect basis, one or more first attributes for defects determined by optical inspection of a wafer on which the defects were detected with one or more second attributes for the defects determined by optical review of the wafer thereby generating combined attributes for the defects. The method also includes separating the defects into bins based on the combined attributes for the defects. The bins correspond to different defect classifications. In addition, the method includes sampling one or more of the defects for the electron beam review based on the bins into which the defects have been separated thereby generating a defect review sample for the electron beam review.

The invention relates to method and system configured for material analysis and mineralogy. At least one image based on first emission from a sample is provided. First spectra of the sample based on second emissions from the second scan locations of the image are provided. A confidence score is calculated for every first spectrum, and second scan location(s) with confidence score(s) below a threshold value are selected. Second emissions from the selected second scan location(s) are acquired to provide new image and determine new second scan locations within the respective new image.

Described herein are a computed tomography scanning system for inspecting an object and methods incorporating the same. The system includes an imaging assembly including a frame positioned within an underground chamber below a ground surface, a platform coupled to and translatable with respect to the frame, and a stage coupled to and rotatable with respect to the platform. The platform is translatable to raise the object above the ground surface and lower the object below the ground surface when the object is on the stage. The imaging assembly also includes an X-ray source fixed with respect to the frame and configured to emit radiation that is attenuated by the object as the platform translates and the stage rotates, and an X-ray detector fixed with respect to the frame, the X-ray detector configured to detect the radiation transmitted through the object and generate a signal representative of the transmitted radiation.

An image management system includes a first storage section, a second storage section, and a third storage section. The first storage section stores a first image of a first sample related to quality information. The second storage section stores an evaluation result of a second sample cut out from the first sample. The third storage section stores information on a cut-out position of the first sample or the second sample and a feature amount at a position selected from the first image. The first image, the evaluation result of the second sample, the information on the cut-out position, and the feature amount are associated with each other.