Patent classifications
G01N2291/018
Method for non-destructively testing a quality of an ultrasonic weld
A method for non-destructive testing of a quality of an ultrasonic weld from a welding process includes detecting of a time-dependent measurement value over a period of time, where the measurement value is characteristic of a mechanical or electrical vibration behavior of a welding process to be tested. The method includes evaluating a measurement-value course of the detected time-dependent measurement value by using a Fourier analysis. The method further includes comparing a result of the evaluation to a reference value in order to test the quality of the weld. A measuring device and an ultrasonic welding system are also included.
ACOUSTIC SENSING THROUGH A BARRIER
The invention provides embodiments of an apparatus and for improved, higher quality and higher resolution acoustic impedance scanning of an object through a barrier. Such acoustic impedance scanning can be employed to obtain biometric information of a person via fingerprint pattern.
FLUID DENSITY FROM TUNABLE ACOUSTIC IMPEDANCE MATCHING
Downhole tools for measuring properties of a fluid include a sample chamber configured to receive the fluid, a field responsive material (FRM) arranged with an interface between the field responsive material and the fluid under test in the sample chamber. The field responsive material is tunable to change an acoustic impedance of the field responsive material in response to application of an applied field. A field generator is arranged in relation to the field responsive material, the field generator configured to generate and apply a field to the field responsive material. An acoustic transducer is arranged to direct acoustic energy into and through the field responsive material toward the interface between the field responsive material and the fluid and configured to detect reflections of acoustic energy that reflect from the interface.
Acoustic sensing through a barrier
The invention provides embodiments of an apparatus and for improved, higher quality and higher resolution acoustic impedance scanning of an object through a barrier. Such acoustic impedance scanning can be employed to obtain biometric information of a person via fingerprint pattern.
Method and assembly for inspecting a partially cured repair patch prior to installation
A method and assembly are provided in order to inspect a partially cured repair patch prior to installation. For example, an assembly for inspecting a repair patch is provided that includes a partially cured repair patch comprised of a composite material. The assembly also includes an acoustic facilitation layer disposed proximate of the surface of the repair patch through which ultrasonic signals will be introduced. The assembly further includes a vacuum bag surrounding the repair patch and the acoustic facilitation layer. The acoustic facilitation layer has an acoustic impedance that is closer to the respective acoustic impedances of the repair patch and the vacuum bag than the acoustic impedance of air is to the respective acoustic impedances of the repair patch and the vacuum bag.
FLUID AERATION SENSOR AND METHOD OF OPERATING THE SAME
A fluid sensing system including a first transducer, a second transducer, a filter, and a controller. The first transducer is configured to output a first sound wave through a first fluid in a first measurement channel. The second transducer is configured to output a second sound wave through a second fluid in a second measurement channel. The filter is configured to substantially prevent aeration in the second fluid contained within the second measurement channel. The controller is configured to determine a first characteristic of the first sound wave, and determine a second characteristic of the second sound wave. The controller is further configured to determine a percentage of aeration by volume within the first fluid based on the first characteristic and second characteristic, and output the percentage of aeration by volume within the first fluid.
Methods, systems and computer program products for multi-resolution imaging and analysis
Methods for determining a mechanical parameter for a sample having a target region include generating a tissue displacement in the target region; transmitting tracking pulses in the target region; receiving corresponding echo signals for the tracking pulses in the target region at a plurality of positions; analyzing the echo signals at one or more multi-resolution pairs of the positions and/or acquisition times; and determining at least one mechanical parameter of the target region based on the echo signals at the one or more multi-resolution pairs of positions and/or acquisition times.
SYSTEM AND METHOD FOR DETERMINING CONCENTRATION
An apparatus to determine the concentration of a target component in a mixture, the apparatus including at least one acoustic transducer located within the mixture, a controller generating a signal for the at least one acoustic transducer that's generating an acoustic signal in the mixture and transmitting same toward the target component within the mixture, wherein the acoustic signal is generated with a known power level, and a processor for measuring change in the power level of the at least one acoustic transducer as the acoustic signal is transmitted through the mixture, wherein the magnitude of the change in signal power determines the concentration of the target component in the mixture.
INTEGRATED CIRCUIT INTEGRITY AND SECURITY BREACH DETECTION
An integrated circuit (IC) includes a semiconductor substrate and a mold compound on the semiconductor substrate. The IC also includes an acoustic signal generator between the mold compound and the semiconductor substrate. The acoustic signal generator is configured to transmit an acoustic signal having a predetermined set of frequencies through at least one of the semiconductor substrate or the mold compound.
Wafer clamp detection based on vibration or acoustic characteristic analysis
A workpiece clamping status detection system and method for detecting a clamping state of a clamping device is provided. A clamping device having a clamping surface is configured to selectively clamp a workpiece to the clamping surface. The clamping device may be an electrostatic chuck or a mechanical clamp for selectively securing a semiconductor wafer thereto. A vibration-inducing mechanism is further provided, wherein the vibration-inducing mechanism is configured to selectively vibrate one or more of the clamping device and workpiece. A vibration-sensing mechanism is also provided, wherein the vibration-sensing mechanism is configured to detect the vibration of the one or more of the clamping device and workpiece. Detection of clamping status utilizes changes in acoustic properties, such as a shift of natural resonance frequency or acoustic impedance, to determine clamping condition of the workpiece. A controller is further configured to determine a clamping state associated with the clamping of the workpiece to the clamping surface, wherein the clamping state is associated with the detected vibration of the one or more of the clamping device and workpiece.