A reflection-mode multispectral photoacoustic microscopy (PAM) system and related method is disclosed, based on an optical-acoustic objective in communication with an ultrasonic transducer. In some embodiments of the disclosed technology, when aligned and positioned in a predetermined manner, little to no chromatic aberration is provided, and with convenient confocal alignment of the optical excitation and acoustic detection.

Laser ultrasonic testing includes a laser apparatus; a splitting unit that splits a pulsed laser from the laser apparatus into first and second lasers; a first pulse width conversion unit that converts a pulse width of the first laser; a first optical system that guides the first laser having the converted pulse width to a test object; a second pulse width conversion unit that converts a pulse width of the second laser; a pulse propagation time adjustment unit that adjusts a propagation time of the second laser having the converted pulse width; a second optical system that guides the second laser having the converted pulse width and adjusted propagation time to the test object; and a detection unit that detects a surface displacement change of the test object caused by an ultrasonic wave generated by the first laser when the second laser is reflected by the test object.

A high frequency magnetostrictive transducer includes a magnetostrictive rod or wire inserted co-axially into a driving coil, wherein the driving coil includes a coil arrangement with a plurality of small coil segments along the magnetostrictive rod or wire; wherein frequency operation of the high frequency magnetostrictive transducer is controlled by a length of the small coil segments and a material type of the magnetostrictive rod or wire. This design of the high frequency magnetostrictive transducer retains the beneficial aspects of the magnetostrictive design, while reducing its primary drawback, lower frequency operation.

A scanning system to analyze wood and determine defects includes at least two ultrasonic transducers configured to scan the wood from edge to edge by triangulating the wood. The at least two ultrasonic transducers are configured to find splits and shakes.

A defect detection device (100) that detects defects in a semiconductor device (13) comprises ultrasonic speakers (21) that ultrasonically vibrate the semiconductor device (13), a laser source (30) that irradiates the semiconductor device (13) with collimated laser light (32), a camera (40) that has an imaging element (42) which acquires images by imaging the semiconductor device (13) that has been irradiated with the collimated laser light (32), and a detection unit (55) that detects defects in the semiconductor device (13) on the basis of the images picked up by the camera (40), wherein the detection unit (55) detects defects in the semiconductor device (13) on the basis of the deviation between images acquired by the camera (40) of the semiconductor device (13) when static and when ultrasonically vibrated.

Provided are an inspection apparatus and an inspection method capable of two-dimensionally detecting a range of recession. The inspection apparatus includes a probe group, an ultrasonic waveform recording unit (recording unit), and a computation unit. The probe group includes a plurality of vertical probes that are attached to the surface of an inspection target object and transmit and receive ultrasonic waves. The recording unit records a plurality of reception signals obtained by receiving the ultrasonic wave transmitted from a first probe by a plurality of probes other than the first probe. The computation unit calculates a plurality of attenuation indexes representing degrees of attenuation of a plurality of second reception signals received after a plurality of first reception signals, with respect to the plurality of first reception signals recorded before an occurrence of recession in the inspection target object among the plurality of reception signals.

A defect detection device (100) that detects defects in a semiconductor device (13) comprises ultrasonic speakers (21) that ultrasonically vibrate the semiconductor device (13), a laser source (30) that irradiates the semiconductor device (13) with collimated laser light (32), a camera (40) that has an imaging element (42) which acquires images by imaging the semiconductor device (13) that has been irradiated with the collimated laser light (32), and a detection unit (55) that detects defects in the semiconductor device (13) on the basis of the images picked up by the camera (40), wherein the detection unit (55) detects defects in the semiconductor device (13) on the basis of the deviation between images acquired by the camera (40) of the semiconductor device (13) when static and when ultrasonically vibrated.

Systems and methods for components, e.g., liquid or gas handling, are described. A tester includes a wand that is handheld that can communicate with a handheld electronic device which in turn can communicate with a central monitor for storing and compiling readings as historical profile data. The wand includes an acoustic probe to physically contact the device to acoustically sense the performance of the device. The acoustic probe includes a probe tip and a stack of acoustic elements, an electrode, a stack mass, and a head to convert the acoustic signal into an electrical signal. The tester can include onboard force sensors associated with the probe or a temperature sensor. The tester or a handheld device includes circuitry to process the information, interact with the user, and transmit information to and from the handheld electronic device and/or the central monitor.

An acoustic microscope system is described that includes a container for holding a medium with an object to be measured. Compressional waves are generated by a probe into the medium. The compressional waves travel along an acoustic axis to interact with the object. Shear waves are generated by a shear wave source into the medium. The shear waves travel along a secondary axis which intersects with the acoustic axis at the object with a non-zero angle. The shear waves are configured to cause shear wave oscillations directed transverse to the secondary axis and at least partially directed along the acoustic axis. A measurement of the object is determined based on the compressional waves having interacted with the object as a function of the generation of the shear waves.

An ultrasonic testing device uses a scanner, employing an ultrasonic probe for scanning, to ultrasonically test a desired tested range of a subject, and includes: an information acquirer to acquire data on the subject, the scanner, the ultrasonic probe, and testing conditions; an interference analyzer to use the data acquired by the information acquirer to calculate one or more interference ranges between the subject, having one or more interferers, and the scanner, having the ultrasonic probe attached thereto, and a scan path planner to use the one or more interference ranges to calculate a scan path of the ultrasonic probe, based on the acquired data on the testing conditions, so as to avoid the one or more interference ranges.