G01P1/023

QUARTZ CRYSTAL DEVICE, CRYSTAL UNIT, AND CRYSTAL CONTROLLED OSCILLATOR
20220416721 · 2022-12-29 · ·

A quartz crystal device includes a package, a pedestal, and a crystal element. The pedestal is disposed in the package. The crystal element is bonded to the pedestal at four points. An angle formed by a center line connecting midpoints of both short sides of the crystal element and a straight line connecting a center point of the center line and each of bonding points is 22° or more and 30° or less.

NAVIGATION DEVICE AND METHOD OF MANUFACTURING NAVIGATION DEVICE
20220397398 · 2022-12-15 ·

A navigation device includes an outer panel and an inertial sensor. The outer panel includes a pair of side plates separated from each other in a first direction and facing each other. A pair of fixing portions are provided on the pair of side plates. The pair of fixing portions are fixed to moving body-side fixing members. The inertial sensor is provided inside surrounded by the outer panel and arranged at a position sandwiched between the pair of fixing portions in the first direction.

Emergency localization device, in particular ELT, for initiating an emergency measure
11518539 · 2022-12-06 · ·

An emergency localization device for initiating an emergency measure, wherein the emergency localization device comprises a control unit, at least one acceleration sensor and at least one position sensor, the control unit being configured to receive a plurality of motion and/or position parameters from the acceleration sensor and/or from the position sensor, and by evaluating the plurality of motion or position parameters to determine a risk level for an emergency using a predefined logic, and to initiate an emergency measure if the calculated risk level exceeds a predefined threshold. The emergency localization device is reliable, robust and largely independent of aircraft-mounted systems.

Semiconductor device

A semiconductor device may include a first substrate, a first electrical component, a lid, a second substrate, and a second electrical component. The first substrate may include an upper surface, a lower surface, and an upper cavity in the upper surface. The first electrical component may reside in the upper cavity of the first substrate. The lid may cover the upper cavity and may include a port that permits fluid to flow between an environment external to the semiconductor device and the upper cavity. The second substrate may include the second electrical component mounted to an upper surface of the second substrate. The lower surface of the first substrate and the upper surface of the second substrate may fluidically seal the second electrical component from the upper cavity.

Physical Quantity Detection Element, Physical Quantity Sensor, And Physical Quantity Sensor Device
20230055371 · 2023-02-23 ·

A physical quantity detection element includes a first base portion and a second base portion, a pair of vibrating beams extending between the first base portion and the second base portion, and a plurality of excitation electrodes provided in surfaces of the pair of vibrating beams. The vibrating beam includes a first region, a second region, and a third region. The first region is located between the second region and the first base portion, and the third region is located between the second region and the second base portion. The excitation electrode provided in the first region is disposed such that a distance from the first base portion is 2.5% or more and 12.3% or less of a total length of the vibrating beam, and the excitation electrode provided in the third region is disposed such that a distance from the second base portion is 2.5% or more and 12.3% or less of the total length of the vibrating beam.

INERTIAL SENSOR MODULE
20230099306 · 2023-03-30 ·

Provided is an inertial sensor module having excellent detection accuracy. The inertial sensor module includes: a first sensor having a first axis, a second axis, and a third axis as detection axes; and a second sensor having accuracy higher than that of the first sensor and having the third axis as a detection axis. The first sensor and the second sensor are disposed on an inner bottom surface which is one plane in a package. The first sensor and the second sensor are sealed by the package in an airtight manner.

Micromechanical sensor
11485630 · 2022-11-01 · ·

A micromechanical sensor. The sensor includes a substrate, a cap element situated on the substrate, at least one seismic mass that is deflectable orthogonal to the cap element, an internal pressure that is lower by a defined amount relative to the surrounding environment prevailing inside a cavity, and a compensating element designed to provide a homogenization of a temperature gradient field in the cavity during operation of the micromechanical sensor.

PHYSICAL QUANTITY SENSOR, PHYSICAL QUANTITY SENSOR DEVICE, AND METHOD FOR MANUFACTURING PHYSICAL QUANTITY SENSOR DEVICE
20230032633 · 2023-02-02 ·

A physical quantity sensor includes: a base portion; a first arm portion, a second arm portion, and a third arm portion that are coupled to the base portion and that are provided with fixing portions; a movable portion disposed between the first arm portion and the second arm portion and between the first arm portion and the third arm portion in a plan view; a constricted portion that is disposed between the base portion and the movable portion, and that couples the base portion and the movable portion; and a physical quantity detection element that is disposed across the constricted portion in the plan view and that is attached to the base portion and the movable portion. Thin portions are formed at least at two positions in at least one of the second arm portion and the third arm portion.

PROXIMITY SENSOR TECHNIQUES
20220346727 · 2022-11-03 ·

A system for sensing true positive impacts may include a sensing device configured for secured coupling to a user. The sensing device may include a sensor configured for sensing accelerations of an impact and for generating a signal based on the impact. The sensing device may also include a control sensor for sensing when the sensing device is in position for sensing. The sensing device may also include a computer-readable storage medium having instructions stored thereon for receiving and capturing the signal from the sensor, and comparing first and second signals from the control sensor to determine if the signal is a true positive signal. The system may also include a processor for processing the instructions to capture the signal, perform the comparing, and identify the signal as a true positive signal. Method of sensing true positive impacts and of workload monitoring are also provided.

Combined corrugated piezoelectric microphone and corrugated piezoelectric vibration sensor

A MicroElectroMechanical Structure (MEMS) accelerometer includes a piezoelectric membrane including at least one electrode and an inertial mass, the piezoelectric membrane being affixed to a holder; and a circuit for evaluating sums and differences of signals associated with the at least one electrode to determine a three-dimensional acceleration direction, wherein the at least one electrode includes a segmented electrode, and wherein the segmented electrode includes four segmentation zones.