A measuring sensor includes a housing in which an acceleration sensor is arranged and in which a circuit board is retained with a sensor electronics arranged thereon and a mounting element functions to secure the measuring sensor to a test object, wherein the acceleration sensor is mechanically rigidly coupled to the mounting element and connected to the sensor electronics via a flexible line connection, where in order to optimize the coupling of the acceleration sensor to the test object to be monitored, in terms of detecting oscillations, vibrations or structure-borne noise, the acceleration sensor is directly connected to the mounting element without mechanical contact with the housing, and the housing is retained elastically on the mounting element and supported by the mounting element.

A motion detecting device includes an accelerometer configured to generate gravitational acceleration readings associated respectively with consecutive time segments, an angular acceleration sensor and configured to generate angular acceleration readings, and a processor operable in one of a standby mode and an active mode. When operated in the standby mode, the processor activates the accelerometer, deactivates the angular acceleration sensor, and determines whether the user is in a substantial moving state. When determined that the user is in the substantial moving state, the processor switches to the active mode to activate both the accelerometer and said angular acceleration sensor, in order to determine the motion of the user.

An inertial sensor includes a substrate, a first supporting beam being a first rotation axis extending along a first direction, a first movable member swingable around the first rotation axis, a second supporting beam being a second rotation axis extending along a second direction crossing the first direction, a second movable member swingable around the second rotation axis, a third rotation axis extending along a second direction, a third movable member swingable around the third rotation axis, and a projection, wherein the second and third movable members are line-symmetrically placed with a center line of the first movable member along the second direction as an axis of symmetry, a center of gravity of the second movable member is closer to the center line than the second supporting beam, and a center of gravity of the third movable member is closer to the center line than the third supporting beam.

A microelectromechanical sensor module includes a sensing mechanism for measuring an acceleration, pressure, air humidity or the like, a control mechanism for controlling the sensing mechanism, an energy supply mechanism for supplying the sensor module with energy, and a transmission mechanism for transmitting signals of the sensing mechanism. At least three of the mechanisms are integrated at the chip level in at least one chip in each case. A corresponding method is implemented to produce the microelectromechanical sensor module.

A method of making a system-in-package device, and a system-in-package device is disclosed. In the method, at least one first species die with predetermined dimensions, at least one second species die with predetermined dimensions, and at least one further component of the system-in-device is included in the system-in package device. At least one of the first and second species dies is selected for redimensioning, and material is added to at least one side of the selected die such that the added material and the selected die form a redimensioned die structure. A connecting layer is formed on the redimensioned die structure. The redimensioned die structure is dimensioned to allow mounting of the non-selected die and the at least one further component into contact with the redimensioned die structure via the connecting layer.

A sensor includes a sensor element, a package accommodating the sensor element in an inside of the package, a grounding electrode disposed in the package, a lid covering an opening of the package, and a lead extending from the package. The lead includes first and second portions. The first portion of the lead is electrically connected to the grounding electrode and extends along a side surface of the package with a gap provided between the first portion and the side surface. The second portion of the lead is disposed between the lid and the package and extends toward the inside of the package. In this sensor, the opening can be sealed without soldering and reliably connect the lid to the grounding electrode.

The electronic module has a three-dimensional frame, a printed circuit board and a plurality of electronic devices. The printed circuit board is fixed to the three-dimensional frame and has a plurality of support portions which extend transversely to each other in space. The electronic devices are fixed to the printed circuit board and are operatively coupled to each other. The electronic devices are arranged on at least one support portion of the printed circuit board.

A sensor unit includes a plurality of terminal members each of which includes a lead portion and an external terminal portion having an external connection end face, a sensor device connected to the lead portions, and a resin member that covers the sensor device and a part of the plurality of terminal members. The lead portion includes a thin wall portion having a thickness thinner than the external terminal portion and a protruding portion protruding from the thin wall portion to an external connection end face side. In a plan view from a direction where the terminal member and the sensor device overlap, the sensor device is disposed at a position overlapping the protruding portion and not overlapping the external terminal portion.

Aspects of the present disclosure are directed to monolithically integrating an optical gyroscope fabricated on a planar silicon platform as a photonic integrated circuit with a MEMS accelerometer on the same die. The accelerometer can be controlled by electronic circuitry that controls the optical gyroscope. The optical gyroscope may have a microresonator ring or a multi-turn waveguide coil. Gaps may be introduced between adjacent waveguide turns to reduce cross-talk and improve sensitivity and packing density of the optical gyroscope.

The present invention consists in a method of welding a nickel strength lug with a bronze connecting pin and a brass contact ring in an accelerometer sensor, the strength lug being interleaved between the connecting pin and the contact ring, the welding being effected electrically with the strength lug pressed simultaneously against the connecting pin and the contact ring. Before welding, the strength lug undergoes deformation of its external surface at least on each of two portions of the surface respectively facing the connecting pin and the contact ring, the surface deformation creating on each of the portions asperities intended to come into local contact with the connecting pin and the contact ring, respectively.