Printed circuit boards (PCBs) are configured with an athermalized mounting suitable for securing and positioning and the PCBs within an inertial measurement unit (IMU). The PCBs include integrated circuit (IC) components, such as accelerometers and/or gyroscopes, which require relative positional stability within the IMU environment in order to provide accurate results. The athermalized mounting configuration of the PCB enables the PCBs to experience thermal expansion within the IMU without causing significant displacement of the IC relative to the IMU environment.

A sensor device includes a sensor element, a substrate, and a bonding wire. Over the substrate, provided is the sensor element. The bonding wire forms at least part of a connection path that electrically connects the sensor element and the substrate together. The bonding wire is provided to connect two connection surfaces that intersect with each other.

A sensor system including a chip arrangement, the chip arrangement including a sensor and an acceleration sensor, and the sensor system including a processor circuit. The processor circuit is configured in such a way that: one or multiple temperature-dependent variables and/or properties of the sensor are ascertained, and an offset of a signal of the acceleration sensor induced by a temperature gradient is corrected with the aid of the one or the multiple ascertained temperature-dependent variables and/or properties of the sensor.

An inertial sensor device includes a plurality of inertial measurement units, one of the inertial measurement units includes an inertial sensor, a reception section configured to receive data of another of the inertial measurement units, a combination processing section configured to operate the data of the another of the inertial measurement units and data of the one of the inertial measurement units, and a first transmission section configured to transmit output of the combination processing section.

A hybrid inertial measurement unit (IMU) comprises: a low frequency (LF) sensor providing a first signal containing information for a first parameter of the hybrid IMU; a shock resistant (SR) sensor providing a second signal containing information for the first parameter, wherein the SR sensor is resistant to destabilization during a destabilizing operational period; and a processor, wherein the processor further comprises: a weighting factor computation module to compute a weight to be applied to the first signal and to compute a weight to be applied to the second signal; a LF weighting module to apply the computed weight to the first signal to create a weighted first signal; a SR weighting module to apply the computed weight to the second signal to create a weighted second signal; and a compensator to combine the weighted first signal and the weighted second signal to create a compensated signal containing information for the first parameter.

A sensor device includes: a detection device that detects a predetermined physical quantity and converts the physical quantity into a detection signal; a communication device that is to be connected to a controller through a first line and a second line, performs at least one of reception from the controller or transmission to the controller by a differential transmission method and, based on a request signal received from the controller, transmits the detection signal generated by the detection device; and a conductive shield member that is applied with a constant potential and covers the detection device and the communication device. The conductive shield member reduces radiation noise generation and simplifies the sensor device structure.

An acceleration transducer defines a rectangular coordinate system with two orthogonal horizontal axes that are both normal to a vertical axis and includes a main body defining tangential side faces arranged tangentially to the vertical axis, and normal side faces arranged normally to the vertical axis. The transducer includes exactly three piezoelectric elements and three seismic masses. Exactly one piezoelectric element is secured to each of the three tangential side faces, and exactly one seismic mass is secured to each of the three piezoelectric elements. Each piezoelectric element has a high sensitivity for a shear force exerted by the attached seismic mass along a principal tangential axis that is another one of the three axes for each of the three piezoelectric elements.

A swing measuring attachment includes a base portion and a protrusion protruding from the base portion, in which the protrusion is provided with a screw thread, the protrusion including a projection at a front end of the protrusion.

An inertial sensor includes oscillating-type angular velocity sensing element (32), IC (34) for processing signals supplied from angular velocity sensing element (32), capacitor (36) for processing signals, and package (38) for accommodating angular velocity sensing element (32), IC (34), capacitor (36). Element (32) and IC (34) are housed in package (38) via a vibration isolator, which is formed of TAB tape (46), plate (40) on which IC (34) is placed, where angular velocity sensing element (32) is layered on IC (34), and outer frame (44) placed outside and separately from plate (40) and yet coupled to plate (40) via wiring pattern (42).

Microchip assemblies, such as self-contained, aided, INS microchip assemblies configured for being coupled with a circuit board or another electrical component. In some embodiments, two inertial navigation sensors may be provided, along with a receiver configured to receive an external signal comprising location data or another aiding sensor, such as a barometric pressure sensor, magnetometer, or WIFI receiver. The assembly may further comprise a processor configured to receive inertial parameter data from inertial navigation sensors and location data from the receiver, and may be configured to process the inertial parameter data and location data to output inertial navigation information.