A vibration rectification error correction device includes a first filter that operates in synchronization with the measured signal, and a second filter that operates in synchronization with the reference signal, in which the first filter generates a third signal based on a first signal having a first group delay amount and a second signal having a second group delay amount, the second filter receives a signal based on the third signal and outputs a fourth signal, and a first vibration rectification error and a second vibration rectification error have different polarities.

A buffer unit for temporarily storing a substrate includes a housing having a space for storing a substrate therein, one or more slots disposed within the housing for placing a substrate thereon, and a holding unit disposed at a bottom portion of the housing, having a flat and non-inclined top surface, and comprising a built-in wireless charging module. A substrate type sensor is stored at the holding unit.

A vibration rectification error correction device includes a reference signal generation circuit that outputs a reference signal, a first frequency delta-sigma modulation circuit that performs frequency delta-sigma modulation on the reference signal by using a first measured signal to generate a first frequency delta-sigma modulated signal, a first filter, a second filter that operates in synchronization with the reference signal, and a first timing control circuit that controls a timing of outputting an input signal in synchronization with the first timing signal, in which the first filter and the first timing control circuit are provided on a signal path from an output of the first frequency delta-sigma modulation circuit to an input of the second filter.

A sensor unit includes a substrate, an inertial sensor module mounted at the substrate, a container including a storage space for storing the substrate and the inertial sensor module, and a coupling member that couples the container and the substrate in a state in which the substrate and the container are in non-contact with each other. The coupling member has elasticity, and an elastic modulus of the coupling member is smaller than an elastic modulus of the container.

Aspects of the present disclosure are directed to monolithically integrating an optical gyroscope fabricated on a planar silicon platform as a photonic integrated circuit with a MEMS accelerometer on the same die. The accelerometer can be controlled by electronic circuitry that controls the optical gyroscope. Gaps may be introduced between adjacent waveguide turns to reduce cross-talk and improve sensitivity and packing density of the optical gyroscope.

Fixed conductive plates are buried in a case. In its internal space, a first contact surface, which is part of each fixed conductive plate, and a second contact surface, which is an inner surface of the case, are opposite to each other, and an elastic conductive plate is interposed in this opposing portion. The elastic conductive plate is structured so that, in a restricting portion, a support piece portion is fitted to the thin plate portion of the fixed conductive plate and that an elastic arm portion extends from the support piece portion.

According to some aspects of the subject technology, an apparatus includes an accelerometer including one or more sense electrodes to sense an input acceleration, and an unstick device to free the accelerometer from a stuck state due to a saturating acceleration input. The unstick device includes at least one unstick electrode and a control circuitry to cause the unstick electrode to generate vibrational energy to free the accelerometer.

A sensor package comprising: a sensor, wherein the sensor comprises a sensing structure formed in a material layer and one or more further material layers arranged to seal the sensing structure to form a hermetically sealed sensor unit; a support structure; one or more springs flexibly fixing the hermetically sealed sensor unit to the support structure; wherein the one or more springs are formed in the same material layer as the sensing structure of the sensor unit; and one or more external package wall(s) encapsulating the sensor unit, the support structure, and the one or more springs, wherein the support structure is fixed to at least one of the package wall(s). The springs decouple mechanical stresses between the sensor unit and the external package wall(s) so as to reduce the long term drift of scale factor and bias.

An inertial measurement unit includes: a sensor unit having at least one inertial sensor; a substrate where at least one of a processing unit performing processing based on detection information from the inertial sensor and a display unit performing a display based on the detection information is provided; and at least one fixing member removably fixing the sensor unit and the substrate together.

The present teaching relates to method and system related to providing an anti-tampering sensor assembly on a vehicle. An inertial measurement unit (IMU) is attached to a structure hosting at least one sensor to form a rigid integral structure, which is deployed on a vehicle with an installation pose to enable the at least one sensor therein to sense surrounding information to facilitate autonomous driving. The installation pose of the IMU is indicative of an installation pose of the at least one sensor. The IMU is configured to obtain, in accordance with a schedule, one or more measurements associated with its state, which can be used to enable detecting tampering of the rigid integral structure.