Patent classifications
G01P3/14
Method for the decoupled control of the quadrature and the resonance frequency of a micro-mechanical rotation rate sensor by means of sigma-delta-modulation
A method for the precise measuring operating of a micro-mechanical rotation rate sensor, including at least one seismic mass, at least one drive device for driving the seismic mass in the primary mode (q.sub.1) and at least three trimming electrode elements which are jointly associated directly or indirectly with the seismic mass. An electric trimming voltage (u.sub.1, u.sub.2, u.sub.3, u.sub.4) is set respectively between the trimming electrode elements and the seismic mass. Each of the electric trimming voltages (u.sub.1, u.sub.2, u.sub.3, u.sub.4) are adjusted in accordance with a resonance frequency variable (.sub.T, .sub.T,0), a quadrature variable (.sub.c, .sub.C,0) and a restoring variable (.sub.S).
Method for the decoupled control of the quadrature and the resonance frequency of a micro-mechanical rotation rate sensor by means of sigma-delta-modulation
A method for the precise measuring operating of a micro-mechanical rotation rate sensor, including at least one seismic mass, at least one drive device for driving the seismic mass in the primary mode (q.sub.1) and at least three trimming electrode elements which are jointly associated directly or indirectly with the seismic mass. An electric trimming voltage (u.sub.1, u.sub.2, u.sub.3, u.sub.4) is set respectively between the trimming electrode elements and the seismic mass. Each of the electric trimming voltages (u.sub.1, u.sub.2, u.sub.3, u.sub.4) are adjusted in accordance with a resonance frequency variable (.sub.T, .sub.T,0), a quadrature variable (.sub.c, .sub.C,0) and a restoring variable (.sub.S).
Sensor Module
A sensor module includes a first inertial sensor device group including a first inertial sensor device, a second inertial sensor device, and a third inertial sensor device, and a base including a first placement surface on which the first inertial sensor device is disposed, a second placement surface parallel to the first placement surface, on which the second inertial sensor device is disposed, and a third placement surface parallel to the first placement surface, on which the third inertial sensor device is disposed.
Device for measuring a parameter indicative of the rotational speed of a component
A device for measuring a parameter indicative of a rotational speed of a component includes a wired or wireless input configured to receive a vibration signal from a vibration sensor, a boost filter configured to filter the vibration signal, based on a predetermined frequency range, into a sinusoidal signal and, a comparator configured to generate a pulse waveform signal from the sinusoidal signal in order to read the value of the parameter. Also a motor or pump controller including the device.
Device for measuring a parameter indicative of the rotational speed of a component
A device for measuring a parameter indicative of a rotational speed of a component includes a wired or wireless input configured to receive a vibration signal from a vibration sensor, a boost filter configured to filter the vibration signal, based on a predetermined frequency range, into a sinusoidal signal and, a comparator configured to generate a pulse waveform signal from the sinusoidal signal in order to read the value of the parameter. Also a motor or pump controller including the device.