A thermal airflow sensor includes a sensor element, a bonding wire, a resin, and a protective film. The sensor element has a thin-wall portion. The thin-wall portion has a heating resistor. The bonding wire is electrically connected to the sensor element. The resin covers the bonding wire. The protective film is formed on a surface of the sensor element so that the heating resistor is exposed. The protective film has at least a slit between the resin and the thin-wall portion.

A thermal airflow sensor includes a sensor element, a bonding wire, a resin, and a protective film. The sensor element has a thin-wall portion. The thin-wall portion has a heating resistor. The bonding wire is electrically connected to the sensor element. The resin covers the bonding wire. The protective film is formed on a surface of the sensor element so that the heating resistor is exposed. The protective film has at least a slit between the resin and the thin-wall portion.

It is an object to provide a flow rate sensor device having improved sensor responsiveness compared with the prior art. The present invention is a flow rate sensor device including a sensor element that detects a flow rate, wherein a sensor unit on which the sensor element is mounted and a drive substrate including a drive control circuit are connected through a connection portion narrower than a width of the drive substrate. Thus, a heat source in the drive substrate and a heat source in the sensor unit can be separated by the connection portion that is thin in width, and the thermal influence from the drive substrate to the sensor unit can be suppressed. Therefore, good sensor responsiveness can be maintained.

Disclosed herein is a wind measuring system including a first flow sensor and plural second flow sensors. The first flow sensor and the plural second flow sensors each include a microheater including a board, an insulating film, and a heater. The board includes a first principal surface and a second principal surface. The board has defined therein an opening portion passing through the board along a direction from the first principal surface toward the second principal surface. The insulating film includes a peripheral portion disposed on the first principal surface, a central portion having the heater disposed thereon, and a connection portion extending from the central portion to be connected to the peripheral portion to support the central portion over the opening portion. The first flow sensor and the plural second flow sensors each output a signal that varies according to a change in electrical resistance value of the heater.

The inventive concept provides a wafer type sensor unit which acquires data on a wind direction and a wind velocity of an air flow during processing, the wafer type sensor unit supported by a supporting unit of a substrate processing apparatus. The unit comprising a wafer-shaped circuit board and a hot-wired wind velocity sensor placed apart from an upper surface of the circuit board.

The inventive concept provides a wafer type sensor unit which acquires data on a wind direction and a wind velocity of an air flow during processing, the wafer type sensor unit supported by a supporting unit of a substrate processing apparatus. The unit comprising a wafer-shaped circuit board and a hot-wired wind velocity sensor placed apart from an upper surface of the circuit board.

A flow velocity sensor includes a substrate, a resistor, and a signal processing section. The substrate has first and second substrate surfaces outwardly opposite to each other. The first substrate surface is exposed to a fluid. The resistor is mounted on the second substrate surface. The resistor has a heat generating portion facing the second substrate surface. The signal processing section is configured to receive a signal from the resister. The signal from the resistor represents heat dissipation of the resistor. A fluid velocity is detected based on the signal from the resistor.

A flow velocity sensor includes a substrate, a resistor, and a signal processing section. The substrate has first and second substrate surfaces outwardly opposite to each other. The first substrate surface is exposed to a fluid. The resistor is mounted on the second substrate surface. The resistor has a heat generating portion facing the second substrate surface. The signal processing section is configured to receive a signal from the resister. The signal from the resistor represents heat dissipation of the resistor. A fluid velocity is detected based on the signal from the resistor.

A sensor assembly includes a metallic layer positioned at least partially on an insulating material coupled to a fuselage of an aircraft. The sensor assembly further includes a pair of terminals arranged at opposite ends of the metallic layer and a temperature probe thermally coupled to the metallic layer. The metallic layer is heated by a heater thermally coupled to the metallic layer. The temperature probe is used to determine a rate of cooling for the metallic layer, responsive to an air flow over the metallic layer.

A sensor assembly includes a metallic layer positioned at least partially on an insulating material coupled to a fuselage of an aircraft. The sensor assembly further includes a pair of terminals arranged at opposite ends of the metallic layer and a temperature probe thermally coupled to the metallic layer. The metallic layer is heated by a heater thermally coupled to the metallic layer. The temperature probe is used to determine a rate of cooling for the metallic layer, responsive to an air flow over the metallic layer.