A method is disclosed. The method includes receiving measured linescan information describing a pattern structure of a feature, applying the received measured linescan information to an inverse linescan model that relates measured linescan information to feature geometry information, identifying, based at least in part on the applying the received measured linescan model to the inverse linescan model, feature geometry information that describes a feature that would produce a linescan corresponding to the received measured linescan information, determining, at least in part using the inverse linescan model, feature edge positions of the identified feature, and analyzing the feature edge positions to detect the presence or absence of defects in the pattern structure.

An edge detection system is disclosed. The edge detection system includes an imaging device configured for imaging a pattern structure to form a first image, wherein the pattern structure includes a predetermined feature, and the imaging device images the pattern structure to generate measured linescan information that includes image noise. The edge detection system includes a processor, coupled to the imaging device, configured to receive the measured linescan information including image noise from the imaging device, wherein the processor is configured to: apply the measured linescan information to an inverse linescan model that relates the measured linescan information to feature geometry information, determine, from the inverse linescan model, feature geometry information that describes feature edge positions of the predetermined feature corresponding to the measured linescan information, determine from the feature geometry information at least one metric that describes a property of the edge detection system.

An edge detection system is disclosed. The edge detection system includes an imaging device configured for imaging a pattern structure to form a first image, wherein the pattern structure includes a predetermined feature, and the imaging device images the pattern structure to generate measured linescan information that includes image noise. The edge detection system includes a processor, coupled to the imaging device, configured to receive the measured linescan information including image noise from the imaging device, wherein the processor is configured to: apply the measured linescan information to an inverse linescan model that relates the measured linescan information to feature geometry information, determine, from the inverse linescan model, feature geometry information that describes feature edge positions of the predetermined feature corresponding to the measured linescan information, determine from the feature geometry information at least one metric that describes a property of the edge detection system.

A method includes scanning a probe laterally across a surface so that the probe follows a scanning motion across the surface and steering a detection beam onto the probe via a steering mirror, the detection beam reflecting from the probe in the form of a return beam. The method also includes moving the steering mirror so that the detection beam follows a tracking motion which is synchronous with the scanning motion and the detection beam remains steered onto the probe by the steering mirror and using the return beam to obtain image measurements, each indicative of a measured height of a respective point on the surface. An associated height error measurement is obtained for each point on the surface, each measurement being indicative of a respective error in the measured height. The height error measurements are used to correct the image measurements so as to generate corrected image measurements.

A method includes scanning a probe laterally across a surface so that the probe follows a scanning motion across the surface and steering a detection beam onto the probe via a steering mirror, the detection beam reflecting from the probe in the form of a return beam. The method also includes moving the steering mirror so that the detection beam follows a tracking motion which is synchronous with the scanning motion and the detection beam remains steered onto the probe by the steering mirror and using the return beam to obtain image measurements, each indicative of a measured height of a respective point on the surface. An associated height error measurement is obtained for each point on the surface, each measurement being indicative of a respective error in the measured height. The height error measurements are used to correct the image measurements so as to generate corrected image measurements.

The present application relates to an apparatus for a scanning probe microscope, said apparatus having: (a) at least one first measuring probe having at least one first cantilever, the free end of which has a first measuring tip; (b) at least one first reflective area arranged in the region of the free end of the at least one first cantilever and embodied to reflect at least two light beams in different directions; and (c) at least two first interferometers embodied to use the at least two light beams reflected by the at least one first reflective area to determine the position of the first measuring tip.

In one embodiment, a method includes receiving measured linescan information describing a pattern structure of a feature, applying the received measured linescan information to an inverse linescan model that relates measured linescan information to feature geometry information, and identifying, based at least in part on the applying the received measured linescan model to the inverse linescan model, feature geometry information that describes a feature that would produce a linescan corresponding to the received measured linescan information. The method also includes determining, at least in part using the inverse linescan model, feature edge positions of the identified feature, analyzing the feature edge positions to determine errors in the manufacture of the pattern structure, and controlling a lithography tool based on the analysis of the feature edge positions.

The invention is directed at a method of performing scanning probe microscopy on a substrate surface using a scanning probe microscopy system. A probe tip and substrate surface are moved relative to each other in one or more directions parallel to the scanning plane to position the probe tip to a scanning position on the substrate surface with the probe tip; a displacement is measured by an encoder of said probe tip in said one or more directions; and a fiducial pattern is provided fixed relative to the substrate surface, said fiducial pattern having a scannable structure that is scannable by said probe tip and said structure forming a grid of fiducial marks in said one or more dimensions; said grid dimensioned to allow for measuring placement deviations of the probe tip relative to the probe head by identifying one or more fiducial marks in the fiducial pattern.

A method for assessing the quality of a tip of a scanning probe microscope (SPM) includes recording an SPM image, extracting a plurality of images of dangling bonds from the SPM image, feeding the extracted images of dangling bonds into a convolution neural network one image at a time, analyzing each of the plurality of images of dangling bonds using the convolution neural network, assigning each of the plurality of images of dangling bonds one of a sharp tip status or a double tip status, and determining whether the number of the plurality of images of dangling bonds of the SPM image assigned the double tip status exceeds a predetermined threshold. A method of automatically conditioning a tip of a scanning probe microscope (SPM) during imaging of a sample and a method of mass-producing atomistic quantum dots, qubits, or particular atom orbital occupation are also provided.

A method for assessing the quality of a tip of a scanning probe microscope (SPM) includes recording an SPM image, extracting a plurality of images of dangling bonds from the SPM image, feeding the extracted images of dangling bonds into a convolution neural network one image at a time, analyzing each of the plurality of images of dangling bonds using the convolution neural network, assigning each of the plurality of images of dangling bonds one of a sharp tip status or a double tip status, and determining whether the number of the plurality of images of dangling bonds of the SPM image assigned the double tip status exceeds a predetermined threshold. A method of automatically conditioning a tip of a scanning probe microscope (SPM) during imaging of a sample and a method of mass-producing atomistic quantum dots, qubits, or particular atom orbital occupation are also provided.