A method for assessing the quality of a tip of a scanning probe microscope (SPM) includes recording an SPM image, extracting a plurality of images of dangling bonds from the SPM image, feeding the extracted images of dangling bonds into a convolution neural network one image at a time, analyzing each of the plurality of images of dangling bonds using the convolution neural network, assigning each of the plurality of images of dangling bonds one of a sharp tip status or a double tip status, and determining whether the number of the plurality of images of dangling bonds of the SPM image assigned the double tip status exceeds a predetermined threshold. A method of automatically conditioning a tip of a scanning probe microscope (SPM) during imaging of a sample and a method of mass-producing atomistic quantum dots, qubits, or particular atom orbital occupation are also provided.

An atomic-force-microscope-based apparatus and method including hardware and software, configured to collect, in a dynamic fashion, and analyze data representing mechanical properties of soft materials on a nanoscale, to map viscoelastic properties of a soft-material sample. The use of the apparatus as an addition to the existing atomic-force microscope device.

The method for detecting mechanical and magnetic features comprises the steps of: aiming a probe of the sensor at a sample; defining several detected points for detection on the sample; detecting one of points and comprising the steps of: approaching the probe to the detected point from a predetermined height; contacting the probe with the detected point and applying a predetermined force on the detected point; making the probe far away from the detected point until to the predetermined height; shifting the probe to the next point for detection and repeating the detection; collecting the data of each of the detected points while the probe rapidly approaches to the points from the predetermined height; using a signal decomposition algorithm to transform the collected data to a plurality of data groups; and choosing a part of the data groups to be as data of feature distributions of the sample.

The method for detecting mechanical and magnetic features comprises the steps of: aiming a probe of the sensor at a sample; defining several detected points for detection on the sample; detecting one of points and comprising the steps of: approaching the probe to the detected point from a predetermined height; contacting the probe with the detected point and applying a predetermined force on the detected point; making the probe far away from the detected point until to the predetermined height; shifting the probe to the next point for detection and repeating the detection; collecting the data of each of the detected points while the probe rapidly approaches to the points from the predetermined height; using a signal decomposition algorithm to transform the collected data to a plurality of data groups; and choosing a part of the data groups to be as data of feature distributions of the sample.

Methods, systems, and computer-readable mediums for configuring a lithography tool to manufacture a semiconductor device. The method includes selecting a first variable, selecting a second variable, selecting at least one response variable that is a function of the first variable and second variable, determining a measurement uncertainty for each response variable, determining, based on a measurement of the response variable, and the measurement uncertainty for the response variable, a plurality of probabilities representing a plurality of indications of whether a plurality of points associated with a lithography process meet a specification requirement for each response variable, wherein the plurality of probabilities represent a process window, and configuring, based on the process window, a lithography tool to manufacture a semiconductor device.

Methods, systems, and computer-readable mediums for configuring a lithography tool to manufacture a semiconductor device. The method includes selecting a first variable, selecting a second variable, selecting at least one response variable that is a function of the first variable and second variable, determining a measurement uncertainty for each response variable, determining, based on a measurement of the response variable, and the measurement uncertainty for the response variable, a plurality of probabilities representing a plurality of indications of whether a plurality of points associated with a lithography process meet a specification requirement for each response variable, wherein the plurality of probabilities represent a process window, and configuring, based on the process window, a lithography tool to manufacture a semiconductor device.

In one embodiment, a method includes receiving measured linescan information describing a pattern structure of a feature, applying the received measured linescan information to an inverse linescan model that relates measured linescan information to feature geometry information, and identifying, based at least in part on the applying the received measured linescan model to the inverse linescan model, feature geometry information that describes a feature that would produce a linescan corresponding to the received measured linescan information. The method also includes determining, at least in part using the inverse linescan model, feature edge positions of the identified feature, analyzing the feature edge positions to determine errors in the manufacture of the pattern structure, and controlling a lithography tool based on the analysis of the feature edge positions.

In one embodiment, a method includes receiving measured linescan information describing a pattern structure of a feature, applying the received measured linescan information to an inverse linescan model that relates measured linescan information to feature geometry information, and identifying, based at least in part on the applying the received measured linescan model to the inverse linescan model, feature geometry information that describes a feature that would produce a linescan corresponding to the received measured linescan information. The method also includes determining, at least in part using the inverse linescan model, feature edge positions of the identified feature, analyzing the feature edge positions to determine errors in the manufacture of the pattern structure, and controlling a lithography tool based on the analysis of the feature edge positions.

The invention is directed at a method of performing scanning probe microscopy on a substrate surface using a scanning probe microscopy system. A probe tip and substrate surface are moved relative to each other in one or more directions parallel to the scanning plane to position the probe tip to a scanning position on the substrate surface with the probe tip; a displacement is measured by an encoder of said probe tip in said one or more directions; and a fiducial pattern is provided fixed relative to the substrate surface, said fiducial pattern having a scannable structure that is scannable by said probe tip and said structure forming a grid of fiducial marks in said one or more dimensions; said grid dimensioned to allow for measuring placement deviations of the probe tip relative to the probe head by identifying one or more fiducial marks in the fiducial pattern.

A method for analyzing a polymer membrane, which can improve accuracy of structural analysis of the polymer membrane and shorten the analysis time by effectively removing noise is provided.