An edge detection system is disclosed. The edge detection system includes an imaging device configured for imaging a pattern structure to form a first image, wherein the pattern structure includes a predetermined feature, and the imaging device images the pattern structure to generate measured linescan information that includes image noise. The edge detection system includes a processor, coupled to the imaging device, configured to receive the measured linescan information including image noise from the imaging device, wherein the processor is configured to: apply the measured linescan information to an inverse linescan model that relates the measured linescan information to feature geometry information, determine, from the inverse linescan model, feature geometry information that describes feature edge positions of the predetermined feature corresponding to the measured linescan information, determine from the feature geometry information at least one metric that describes a property of the edge detection system.

An edge detection system is disclosed. The edge detection system includes an imaging device configured for imaging a pattern structure to form a first image, wherein the pattern structure includes a predetermined feature, and the imaging device images the pattern structure to generate measured linescan information that includes image noise. The edge detection system includes a processor, coupled to the imaging device, configured to receive the measured linescan information including image noise from the imaging device, wherein the processor is configured to: apply the measured linescan information to an inverse linescan model that relates the measured linescan information to feature geometry information, determine, from the inverse linescan model, feature geometry information that describes feature edge positions of the predetermined feature corresponding to the measured linescan information, determine from the feature geometry information at least one metric that describes a property of the edge detection system.

A scanning probe microscope 1 is provided with a control unit 15. The control unit 15 includes a signal acquisition processing unit 151, an image acquisition processing unit 152, a scanning condition change processing unit 154, a scanning processing unit 155, and a noise determination processing unit 156. In the scanning probe microscope 1, when removing noise included in a surface image of a sample, the scanning condition change processing unit 154 changes a scanning condition. And, the signal acquisition processing unit 151 acquires an output signal from a detection unit 12. The image acquisition processing unit 152 acquires a surface image of a sample S based on the output signal. The noise determination processing unit 156 determines whether or not noise is inclined in the output signal contains noise based on the change in the output signal or the change in the surface image of the sample S when the scanning condition is changed by the scanning condition change processing unit 154. Therefore, if noise is included in the output signal, it is possible to correctly determinate the fact.

A scanning probe microscope 1 is provided with a control unit 15. The control unit 15 includes a signal acquisition processing unit 151, an image acquisition processing unit 152, a scanning condition change processing unit 154, a scanning processing unit 155, and a noise determination processing unit 156. In the scanning probe microscope 1, when removing noise included in a surface image of a sample, the scanning condition change processing unit 154 changes a scanning condition. And, the signal acquisition processing unit 151 acquires an output signal from a detection unit 12. The image acquisition processing unit 152 acquires a surface image of a sample S based on the output signal. The noise determination processing unit 156 determines whether or not noise is inclined in the output signal contains noise based on the change in the output signal or the change in the surface image of the sample S when the scanning condition is changed by the scanning condition change processing unit 154. Therefore, if noise is included in the output signal, it is possible to correctly determinate the fact.

A scanning probe microscope including a measurement light-casting section configured to cast light onto a reflective surface provided on a movable end of a cantilever; a light-detecting section configured to detect reflected light from the reflective surface with a light-receiving surface having a larger area than the incident area of the reflected light, the light-receiving surface divided into a plurality of areas; a deflection-calculating section configured to determine at preset intervals, the amount of deflection of the cantilever based on the proportion of the amounts of light incident on the plurality of areas while the distance between the base end and the sample is changed; a determining section configured to determine whether or not the amount of change in the deflection of the cantilever is equal to or larger than a previously determined threshold K.sub.th.

A scanning probe microscope including a measurement light-casting section configured to cast light onto a reflective surface provided on a movable end of a cantilever; a light-detecting section configured to detect reflected light from the reflective surface with a light-receiving surface having a larger area than the incident area of the reflected light, the light-receiving surface divided into a plurality of areas; a deflection-calculating section configured to determine at preset intervals, the amount of deflection of the cantilever based on the proportion of the amounts of light incident on the plurality of areas while the distance between the base end and the sample is changed; a determining section configured to determine whether or not the amount of change in the deflection of the cantilever is equal to or larger than a previously determined threshold K.sub.th.

This invention is directed to a pattern height information correction system which includes a contour line information of a pattern extracted from an acquired image including at least an AFM (atomic force microscope) module, a design information database that stores design information including at least layer information, and a computer system that divides the extracted pattern into regions based on the design information stored in the design information database relating to the extracted pattern and associates the divided regions with layer information, in which the computer system specifies a horizontal region designated as horizontal in advance from the divided regions, creates an approximated curved surface based on the specified horizontal region corresponding to the same layer information, and corrects height information of the extracted pattern using the approximated curved surface.

In one embodiment, a method includes receiving measured linescan information describing a pattern structure of a feature, applying the received measured linescan information to an inverse linescan model that relates measured linescan information to feature geometry information, and identifying, based at least in part on the applying the received measured linescan model to the inverse linescan model, feature geometry information that describes a feature that would produce a linescan corresponding to the received measured linescan information. The method also includes determining, at least in part using the inverse linescan model, feature edge positions of the identified feature, analyzing the feature edge positions to determine errors in the manufacture of the pattern structure, and controlling a lithography tool based on the analysis of the feature edge positions.

In one embodiment, a method includes receiving measured linescan information describing a pattern structure of a feature, applying the received measured linescan information to an inverse linescan model that relates measured linescan information to feature geometry information, and identifying, based at least in part on the applying the received measured linescan model to the inverse linescan model, feature geometry information that describes a feature that would produce a linescan corresponding to the received measured linescan information. The method also includes determining, at least in part using the inverse linescan model, feature edge positions of the identified feature, analyzing the feature edge positions to determine errors in the manufacture of the pattern structure, and controlling a lithography tool based on the analysis of the feature edge positions.

A method is disclosed. The method includes receiving measured linescan information describing a pattern structure of a feature, applying the received measured linescan information to an inverse linescan model that relates measured linescan information to feature geometry information, identifying, based at least in part on the applying the received measured linescan model to the inverse linescan model, feature geometry information that describes a feature that would produce a linescan corresponding to the received measured linescan information, determining, at least in part using the inverse linescan model, feature edge positions of the identified feature, and analyzing the feature edge positions to detect the presence or absence of defects in the pattern structure.