Patent classifications
G01Q60/30
METHOD AND APPARATUS FOR DETECTING FERROELECTRIC SIGNAL
A method of detecting a ferroelectric signal from a ferroelectric film and a piezoelectric force microscopy (PFM) apparatus are provided. The method includes following steps. An input waveform signal is applied to the ferroelectric film. An atomic force microscope probe scans over a surface of the ferroelectric film to measure a surface topography of the ferroelectric film. A deflection of the atomic force microscope probe is detected when the input waveform signal is applied to the ferroelectric film to generate a deflection signal. Spectrum data of the ferroelectric film based on the deflection signal is generated. The spectrum data of the ferroelectric film is analyzed to determine whether the spectrum data of the ferroelectric film is a ferroelectric signal or a non-ferroelectric signal.
High Speed Atomic Force Profilometry of Large Areas
An apparatus and method of operating an atomic force profiler (AFP), such as an AFM, using a feedforward control signal in subsequent scan lines of a large area sample to achieve large throughput advantages in, for example, automated applications.
High Speed Atomic Force Profilometry of Large Areas
An apparatus and method of operating an atomic force profiler (AFP), such as an AFM, using a feedforward control signal in subsequent scan lines of a large area sample to achieve large throughput advantages in, for example, automated applications.
Battery electrode analysis method
The present disclosure relates to a method for analyzing an electrode for a battery, which has the advantage of being capable of more easily distinguishing between the constituent materials of the electrode such as the electrode active material, the conductive material, and the pores, by using scanning spreading resistance microscopy.
Method and apparatus for aligning a probe for scanning probe microscopy to the tip of a pointed sample
Example embodiments relate to methods and apparatuses for aligning a probe for scanning probe microscopy (SPM) to the tip of a pointed sample. One embodiments includes a method for aligning an SPM probe to an apex area of a free-standing tip of a pointed sample. The method includes providing an SPM apparatus that includes the SPM probe; a sample holder; a drive mechanism; and detection, control, and representation tools for acquiring and representing an image of a surface scanned by the SPM probe. The method also includes mounting the sample on the sample holder. Further, the method includes positioning the probe tip of the SPM, determining a 2-dimensional area that includes the pointed sample, performing an SPM acquisition scan, evaluating and acquired image, and placing the SPM probe in a position where it is aligned with an apex area of the free-standing tip of the pointed sample.
Atomic force microscopy apparatus, methods, and applications
Atomic force microscopy apparatus and method that enable observing charge generation transients with nanometer spatial resolution and nanosecond to picosecond time resolution, the timescale relevant for studying photo-generated charges in the world's highest efficiency photovoltaic films. The AFM apparatus includes an AFM, a light source for illumination of a sample operatively coupled to the AFM, a voltage source operatively coupled to the AFM, and a control circuitry operatively coupled to the light source and the voltage source. The AFM apparatus improves the time resolution and enables rapid acquisition of photocapacitance transients in a wide array of solar-energy-harvesting materials.
Atomic force microscopy apparatus, methods, and applications
Atomic force microscopy apparatus and method that enable observing charge generation transients with nanometer spatial resolution and nanosecond to picosecond time resolution, the timescale relevant for studying photo-generated charges in the world's highest efficiency photovoltaic films. The AFM apparatus includes an AFM, a light source for illumination of a sample operatively coupled to the AFM, a voltage source operatively coupled to the AFM, and a control circuitry operatively coupled to the light source and the voltage source. The AFM apparatus improves the time resolution and enables rapid acquisition of photocapacitance transients in a wide array of solar-energy-harvesting materials.
Large radius probe
A large radius probe for a surface analysis instrument such as an atomic force microscope (AFM). The probe is microfabricated to have a tip with a hemispherical distal end or apex. The radius of the apex is the range of about a micron making the probes particularly useful for nanoindentation analyses. The processes of the preferred embodiments allow such large radius probes to be batch fabricated to facilitate cost and robustness.
METHOD FOR ELECTRICALLY EXAMINING ELECTRONIC COMPONENTS OF AN INTEGRATED CIRCUIT
The invention relates to a method for electrically examining electronic components of an integrated circuit. According to the invention, a method for electrically examining electronic components of an integrated circuit (1) is provided, comprising a target region (3) to be examined in which electronic components having contact points (5) are located, and a remaining region, referred to as non-target region (2), in which an examination is carried out using a combined SEM/AFM nanoprobe. In a first step, the non-target region (2) is at least partially imaged with the scanning electron microscope part of the SEM/AFM nanoprobe, and in a subsequent step the target region (3) is at least partially imaged with the atomic force microscope part of the SEM/AFM nanoprobe.
Interconnect with nanotube fitting
A light emitting diode (LED) array is formed by bonding an LED substrate to a backplane substrate via fitted nanotube interconnects. The backplane substrate may include circuits for driving the LED array. The LED substrate may be a chip or wafer, and may include one or more LED devices. The LED substrate is positioned above the backplane substrate, such that a LED device of the LED substrate is aligned to a corresponding circuit in the backplane substrate. Each of the fitted interconnects electrically connect a LED device to the corresponding circuit of the backplane substrate.