A test and measurement system can include a data store configured to store augmentation settings for dynamically augmenting a physical testing environment and a computing device coupled to the data store. The computing device can be configured to receive an input feed from the physical testing environment, create an augmentation image based on the augmentation settings and the input feed, and output the augmented image to be overlaid on the physical testing environment to augment a user's view of the physical testing environment.

An analysis device analyzes inspection results of an inspection object which includes inspection target devices having respective electrodes on which needle marks are formed. The analysis device includes a display part for displaying an image, and an image generation part for generating an image to be displayed on the display part. The image generation part generates an analysis image based on information on inspection results with respect to the needle marks. The analysis image includes a needle mark scatter plot image showing positions of the needle marks with respect to the electrodes in each inspection target device in an overlapped manner, an inspection object map image showing a surface of the inspection object and showing needle mark inspection results with respect to the inspection target devices, and a captured image of the electrodes. Display contents of the images are linked with each other.

The present invention provides a measuring device (1, 11) for measuring signals (2, 12), the measuring device (1, 11) comprising a data memory (4, 14) configured to store device data (5, 15) for the measuring device (1, 11), and a data interface (6, 16) connected to the data memory (4, 14) and configured to read the device data (5, 15) from the data memory (4, 14) and output at least a part of the read device data (5, 15) to an external memory device (7, 17) in a storage mode and to read device data (5, 15) from the external memory device (7, 17) and store the read device data (5, 15) in the data memory (4, 14) in a recovery mode. The present invention further provides a corresponding method for such a measuring device (1, 11).

A test and measurement instrument includes an input for accepting an input signal from a Device Under Test (DUT), acquisition memory for storing a sampled waveform derived from the input signal, an output display, and one or more processors configured to accept a portion of the sampled waveform as a search portion, search the sampled waveform for portions similar to the search portion, and visually indicate, on the output display, portions of the sampled waveform that are similar to the search portion as matched portions. Methods of operation and description of storage media, the operation of which performs the above operations, are also described.

A system of the present disclosure has a host testing device having a first wireless transceiver and having host testing device logic configured to transmit a test command via the first wireless transceiver. Additionally, the system has a remote testing device coupled to a system component. The remote testing device has a second wireless transceiver and remote testing device logic that receives the test command from the host testing device and executes the test command on the system component.

A computer-implemented method of analyzing an electrical wiring harness assembly comprises receiving, via a processing element, a test result associated with the electrical wiring harness assembly; determining, via the processing element, a probable error type based on the test result; retrieving from a memory element, via the processing element, a plurality of natural language terms associated with the probable error type, each of the plurality of natural language terms having a corresponding phrase order value; and reporting, via a user interface, each of the plurality of natural language terms in an order according to the phrase order values.

Described herein are techniques related to a semiconductor fabrication process that facilitates the enhancement of systemic conformities of patterns of the fabricated semiconductor wafer. A semiconductor wafer with maximized systemic conformities of patterns will maximize the electrical properties and/or functionality of the electronic devices formed as part of the fabricated semiconductor wafer. This Abstract is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.

A diagnostic test instrument for testing power system equipment may include a chassis having a number of bays capable of receiving test circuitry modules, which may be field inserted by a user desiring to perform a particular test. The instrument may include controller circuitry that may sense in each of the bays whether a respective test circuitry module is inserted therein, and then interrogate respective test circuitry modules in each respective bay to identify a type of the respective test circuitry module. Available testing capabilities may be identified according to the type of each of the respective test circuitry modules identified in respective bays. The controller circuitry may output configuration instructions to test circuitry modules, and respective test ports included in each of the respective test circuitry modules may be selectively illuminated as a configuration instruction to visually identify an assigned functionality of the respective test ports.

A method for operating an oscilloscope is described, wherein a waveform axis scale input value is detected. Further, a record length input value is detected. An oscilloscope operating point is determined relative to at least one predetermined operating mode limit. In addition, a method for operating an oscilloscope as well as an oscilloscope are described.

An interface element (20) for a testing apparatus of electronic devices comprises at least one support (21) provided with a plurality of through-openings (22) that house respective interconnections elements (23), which extend between a first end (23a) and a second end (23b). Suitably, the interconnections elements (23) are made of a conductive elastomer that fills the openings (22) of the support (21), each of the interconnection elements (23) forming a conductive channel between different and opposing faces (Fa, Fb) of the support (21).