A magnetic field transducer mounting apparatus can include a first mount configured to fixedly couple to a side surface of a wafer test fixture magnet, and a second and third mount configured to adjustably position a magnetic field transducer in a predetermined location proximate a face of the wafer test fixture magnet.

A magnetic field transducer mounting apparatus can include a first mount configured to fixedly couple to a side surface of a wafer test fixture magnet, and a second and third mount configured to adjustably position a magnetic field transducer in a predetermined location proximate a face of the wafer test fixture magnet.

A magnetic field transducer mounting apparatus can include a first mount configured to fixedly couple to a side surface of a wafer test fixture magnet, and a second and third mount configured to adjustably position a magnetic field transducer in a predetermined location proximate a face of the wafer test fixture magnet.

In some embodiments, a semiconductor wafer testing system is provided. The semiconductor wafer testing system includes a semiconductor wafer prober having one or more conductive probes, where the semiconductor wafer prober is configured to position the one or more conductive probes on an integrated chip (IC) that is disposed on a semiconductor wafer. The semiconductor wafer testing system also includes a ferromagnetic wafer chuck, where the ferromagnetic wafer chuck is configured to hold the semiconductor wafer while the wafer prober positions the one or more conductive probes on the IC. An upper magnet is disposed over the ferromagnetic wafer chuck, where the upper magnet is configured to generate an external magnetic field between the upper magnet and the ferromagnetic wafer chuck, and where the ferromagnetic wafer chuck amplifies the external magnetic field such that the external magnetic field passes through the IC with an amplified magnetic field strength.

In some embodiments, a semiconductor wafer testing system is provided. The semiconductor wafer testing system includes a semiconductor wafer prober having one or more conductive probes, where the semiconductor wafer prober is configured to position the one or more conductive probes on an integrated chip (IC) that is disposed on a semiconductor wafer. The semiconductor wafer testing system also includes a ferromagnetic wafer chuck, where the ferromagnetic wafer chuck is configured to hold the semiconductor wafer while the wafer prober positions the one or more conductive probes on the IC. An upper magnet is disposed over the ferromagnetic wafer chuck, where the upper magnet is configured to generate an external magnetic field between the upper magnet and the ferromagnetic wafer chuck, and where the ferromagnetic wafer chuck amplifies the external magnetic field such that the external magnetic field passes through the IC with an amplified magnetic field strength.

Provided is a jig enabling detachment and attachment of a probe head from and to an electric connecting apparatus without using a special holding device. A jig (50) is applied to an electric connecting apparatus (10) electrically connecting a device under test to a testing apparatus for the device under test. The electric connecting apparatus includes a wiring substrate (22) and a probe head (28) secured to the wiring substrate with a plurality of set screws (26) and including a plurality of probes (34) made of a magnetic body. The jig (50) includes a plate (52) and a magnet (54) attached to the plate. The plate can detachably be attached to the probe head, and the magnet is opposed to a lower end portion (34b) of each of the probes.

Provided is a jig enabling detachment and attachment of a probe head from and to an electric connecting apparatus without using a special holding device. A jig (50) is applied to an electric connecting apparatus (10) electrically connecting a device under test to a testing apparatus for the device under test. The electric connecting apparatus includes a wiring substrate (22) and a probe head (28) secured to the wiring substrate with a plurality of set screws (26) and including a plurality of probes (34) made of a magnetic body. The jig (50) includes a plate (52) and a magnet (54) attached to the plate. The plate can detachably be attached to the probe head, and the magnet is opposed to a lower end portion (34b) of each of the probes.

A current sensor detects a current flowing through a current path. The current sensor includes plural sensor elements, and each sensor element has a current path, a magnetic detector, a first magnetic shield and a second magnetic shield. The magnetic detector faces a part of the current path. A part of the current path and the magnetic detector are positioned between the first and second magnetic shields. The second magnetic field, the current path, the magnetic detector and the first magnetic shield are stacked in order along a stacking direction in each sensor element. The plural sensor elements are disposed adjacently to each other in a direction perpendicular to the stacking direction. The current path has a facing part facing the magnetic detector, and a first bent part bending from the facing part toward the second magnetic shield.

A current sensor detects a current flowing through a current path. The current sensor includes plural sensor elements, and each sensor element has a current path, a magnetic detector, a first magnetic shield and a second magnetic shield. The magnetic detector faces a part of the current path. A part of the current path and the magnetic detector are positioned between the first and second magnetic shields. The second magnetic field, the current path, the magnetic detector and the first magnetic shield are stacked in order along a stacking direction in each sensor element. The plural sensor elements are disposed adjacently to each other in a direction perpendicular to the stacking direction. The current path has a facing part facing the magnetic detector, and a first bent part bending from the facing part toward the second magnetic shield.

A magnetic field transducer mounting apparatus can include a first mount configured to fixedly couple to a side surface of a wafer test fixture magnet, and a second and third mount configured to adjustably position a magnetic field transducer in a predetermined location proximate a face of the wafer test fixture magnet.