A probe device, for performing an electrical test of a semiconductor device formed on a semiconductor wafer, includes a mounting table on which the semiconductor wafer is mounted, a driving mechanism configured to bring a probe into contact with an electrode of the semiconductor device mounted on the mounting table, and a temperature control mechanism configured to control a temperature of the mounting table. The mounting table includes a disk-shaped first electrode, a disk-shaped second electrode, and a disk-shaped insulating plate interposed between the first electrode and the second electrode. The first electrode, the second electrode and the insulating plate are fixed to each other at a fixing part provided at their respective centers, and are locked to be movable in a diametric direction at a locking part provided at an outer side of the fixing part in the diametric direction.

A probe head comprises a plate-shaped support including respective pluralities of guide holes, a plurality of contact probes being slidingly housed in the respective pluralities of guide holes and including at least a first group of contact probes being apt to carry only one type of signal chosen between ground and power supply signals, a conductive portion realized on the support and including a plurality of the guide holes housing the contact probes of the first group, and at least one filtering capacitor having at least one capacitor plate being electrically connected to the conductive portion, the conductive portion electrically connecting the contact probes of the first group.

A voltage sensor system for sensing voltage in a conductor, the voltage sensor system including a first plate, a first electrode disposed a first distance away from the first plate, a second plate, a second electrode disposed a second distance away from the second plate, a control unit structured to control one of the first plate and the second plate to be grounded and the other of the first plate and the second plate to be electrically floating, and a differential amplifier electrically connected to the first electrode and the second electrode and being structured to output an output voltage that is proportional to a difference in voltage between the first electrode and the second electrode.

A signal generating device for generation of measurement signals for an electrical system includes a housing which features an electrically conducting material, an energy reservoir arranged in the housing, a data interface arranged at the housing and designed to receive signal data, a coupling interface arranged at the housing and coupled to the electrical system, and a signal generator arranged in the housing. The signal generator is coupled to the electrical energy reservoir, to the data interface and to the coupling interface. The signal generator is designed, based on the signal data, to generate the measurement signals and to output them via the coupling interface. A corresponding measuring device is also included.

A testing device includes a base body, a holder, an electrically conductive plate, plural testing probes and plural insulation structures. The testing device of the present invention uses the electrically conductive plate to replace the plastic plate of the conventional testing device. Consequently, the electrostatic discharge effect is avoided. Moreover, the insulation structure is arranged between the testing probe and the electrically conductive plate to separate the testing probe from the electrically conductive plate so as to avoid the electric leakage problem. Consequently, the testing device of the present invention is capable of avoiding the electrostatic discharge effect without causing damage of the under-test object and reducing the measurement accuracy.

A testing device includes a base body, a holder, an electrically conductive plate, plural testing probes and plural insulation structures. The testing device of the present invention uses the electrically conductive plate to replace the plastic plate of the conventional testing device. Consequently, the electrostatic discharge effect is avoided. Moreover, the insulation structure is arranged between the testing probe and the electrically conductive plate to separate the testing probe from the electrically conductive plate so as to avoid the electric leakage problem. Consequently, the testing device of the present invention is capable of avoiding the electrostatic discharge effect without causing damage of the under-test object and reducing the measurement accuracy.

A flexible resistive tip cable assembly includes a probe Radio Frequency (RF) connector structured to receive a RF differential signal and a testing connection assembly. A coaxial cable is structured to conduct the RF differential signal between the probe RF connector and the testing connection assembly. The coaxial cable includes a cable for conducting the differential signal, and a plurality of magnetic elements positioned along a length of the cable and structured to isolate the differential signal from common mode interference. The magnetic elements are separated from adjacent magnetic elements by a gap with elastomeric elements is positioned in each gap to provide cable flexibility. The assembly may also include an Electrically Erasable Programmable Read Only Memory (EEPROM) loaded with an attenuation associated with the flexible resistive tip cable assembly for use in signal testing by a device coupled to the testing connection assembly.

A flexible resistive tip cable assembly includes a probe Radio Frequency (RF) connector structured to receive a RF differential signal and a testing connection assembly. A coaxial cable is structured to conduct the RF differential signal between the probe RF connector and the testing connection assembly. The coaxial cable includes a cable for conducting the differential signal, and a plurality of magnetic elements positioned along a length of the cable and structured to isolate the differential signal from common mode interference. The magnetic elements are separated from adjacent magnetic elements by a gap with elastomeric elements is positioned in each gap to provide cable flexibility. The assembly may also include an Electrically Erasable Programmable Read Only Memory (EEPROM) loaded with an attenuation associated with the flexible resistive tip cable assembly for use in signal testing by a device coupled to the testing connection assembly.

A probe module, which is provided between a tester and a DUT for transmitting electrical signals therebetween, includes a signal transmitting member, a plurality of probes, a positioning member, and a signal connector. The signal transmitting member has a circuit and two grounding. The probes are electrical connected to the circuit and the groundings of the signal transmitting member. The positioning member is made of an insulating material, and provided on the probes. The signal connector is adapted to be electrically connected to the tester, wherein the signal connector has a signal transmission portion and a grounding portion; the signal transmission portion is electrically connected to the circuit of the signal transmitting member, and the grounding portion is electrically connected to the at least one grounding of the signal transmitting member.

High frequency operation of an integrated circuit test system is greatly extended by incorporation of a dedicated high frequency signal element that provides a circuit specific compensation network as part of the intermediation circuit board that enables connectivity between test equipment and the integrated circuit under test.