Patent classifications
G01R1/18
ENCAPSULATED PRINTED CIRCUIT BOARD ASSEMBLY
Encapsulated PCB assembly (1) for electrical connection to a high- or medium-voltage power conductor in a power distribution network of a national grid, comprising a) a PCB (10), delimited by a peripheral edge (20) and comprising a high-tension pad (60, 62) on a voltage of at least one kilovolt, b) an electrically insulating encapsulation body (70) in surface contact with, and enveloping, the high-tension pad and at least a portion of the PCB edge adjacent to the high-tension pad, c) a shielding layer (80) on an external surface (90) of the encapsulation body and for being held on electrical ground or on a low voltage to shield at least a low-voltage portion of the PCB. The high-tension pad extends to the peripheral edge of the PCB.
ENCAPSULATED PRINTED CIRCUIT BOARD ASSEMBLY
Encapsulated PCB assembly (1) for electrical connection to a high- or medium-voltage power conductor in a power distribution network of a national grid, comprising a) a PCB (10), delimited by a peripheral edge (20) and comprising a high-tension pad (60, 62) on a voltage of at least one kilovolt, b) an electrically insulating encapsulation body (70) in surface contact with, and enveloping, the high-tension pad and at least a portion of the PCB edge adjacent to the high-tension pad, c) a shielding layer (80) on an external surface (90) of the encapsulation body and for being held on electrical ground or on a low voltage to shield at least a low-voltage portion of the PCB. The high-tension pad extends to the peripheral edge of the PCB.
METHOD AND APPARATUS FOR SIMULATING AND DESIGNING STRUCTURE PARAMETERS OF AIR-CORE COIL AND ELECTRONIC DEVICE
The present invention discloses a method and apparatus for simulating and designing structural parameters of an air-core coil. The method for simulating and designing structural parameters of the air-core coil includes: building an impedance function of the air-core coil according to a structural parameter variable, the air-core coil being of a differential structure and being wound in a completely parallel winding fashion; building an index function of the air-core coil by calculating an equivalent bandwidth, sensitivity and an equivalent noise power spectrum by means of the impedance function. The method is intuitive, and makes calculation of the optimized technological and structural parameters easier and more convenient, thus reducing the amount of calculation and shortening the calculation time.
METHOD AND APPARATUS FOR SIMULATING AND DESIGNING STRUCTURE PARAMETERS OF AIR-CORE COIL AND ELECTRONIC DEVICE
The present invention discloses a method and apparatus for simulating and designing structural parameters of an air-core coil. The method for simulating and designing structural parameters of the air-core coil includes: building an impedance function of the air-core coil according to a structural parameter variable, the air-core coil being of a differential structure and being wound in a completely parallel winding fashion; building an index function of the air-core coil by calculating an equivalent bandwidth, sensitivity and an equivalent noise power spectrum by means of the impedance function. The method is intuitive, and makes calculation of the optimized technological and structural parameters easier and more convenient, thus reducing the amount of calculation and shortening the calculation time.
Enclosure for testing electronic devices
Various devices and techniques help to reduce the entry of unwanted radio waves into an enclosure and reduce the reflection of radio waves inside the enclosure. Such devices and techniques enable a test environment inside the enclosure that provides high-quality functionality and performance testing.
Probe head for a testing apparatus of electronic devices with enhanced filtering properties
A probe head comprises a plate-shaped support including respective pluralities of guide holes, a plurality of contact probes being slidingly housed in the respective pluralities of guide holes and including at least a first group of contact probes being apt to carry only one type of signal chosen between ground and power supply signals, a conductive portion realized on the support and including a plurality of the guide holes housing the contact probes of the first group, and at least one filtering capacitor having at least one capacitor plate being electrically connected to the conductive portion, the conductive portion electrically connecting the contact probes of the first group.
Probe head for a testing apparatus of electronic devices with enhanced filtering properties
A probe head comprises a plate-shaped support including respective pluralities of guide holes, a plurality of contact probes being slidingly housed in the respective pluralities of guide holes and including at least a first group of contact probes being apt to carry only one type of signal chosen between ground and power supply signals, a conductive portion realized on the support and including a plurality of the guide holes housing the contact probes of the first group, and at least one filtering capacitor having at least one capacitor plate being electrically connected to the conductive portion, the conductive portion electrically connecting the contact probes of the first group.
Current detection circuit, battery management system, and battery pack
A current detection circuit to detect an electric current of the battery pack includes an insulating substrate, a first busbar and a second busbar disposed on a first surface of the insulating substrate, a shunt resistor disposed between the first busbar and the second busbar on the first surface, and electrically connected to the first busbar and the second busbar, and a hall effect sensor disposed on a second surface of the insulating substrate, wherein the second surface is opposite the first surface.
Measurement device
A measurement device with improved electrical strength comprises an input for receiving an input signal as well as a measurement circuit connected with the input. The measurement circuit has at least one component. The measurement device also comprises an electrical interface provided in addition to the input. The measurement device further comprises at least one internal enclosure that encloses the component within the measurement device, thereby improving the electrical strength of the measurement device.
Test device
A test device for a high-speed/high-frequency test. The test device includes: a conductive block which includes a probe hole; at least one signal probe which is supported in an inner wall of the probe hole without contact, includes a first end to be in contact with a testing contact point of the object to be tested, and is retractable in a lengthwise direction; and a coaxial cable which includes a core wire to be in electric contact with a second end of the signal probe. With this test device, the coaxial cable is in direct contact with the signal probe, thereby fully blocking out noise in a test circuit board.