Patent classifications
G01R1/24
HIGH DENSITY WAVEGUIDE ASSEMBLY FOR MILLIMETER AND 5G APPLICATIONS
Embodiments of the present disclosure use a customizable ganged waveguide that comprises a top metal plate and a bottom metal plate with trenches that come together in a way so as to form waveguide channels. The waveguide assembly of the present invention also comprises a waveguide adapter affixed to a first end of the ganged waveguide and operable to conduct the signal to a tester. Further, it comprises an air barrier affixed to a second end of the ganged waveguide to prevent air from flowing from the ganged waveguide to a printed circuit board connected at the second end. Finally, it comprises a tuning plate comprising double ridge slots configured to allow maximal signal to be transferred to the printed circuit board from the ganged waveguide.
HIGH DENSITY WAVEGUIDE ASSEMBLY FOR MILLIMETER AND 5G APPLICATIONS
Embodiments of the present disclosure use a customizable ganged waveguide that comprises a top metal plate and a bottom metal plate with trenches that come together in a way so as to form waveguide channels. The waveguide assembly of the present invention also comprises a waveguide adapter affixed to a first end of the ganged waveguide and operable to conduct the signal to a tester. Further, it comprises an air barrier affixed to a second end of the ganged waveguide to prevent air from flowing from the ganged waveguide to a printed circuit board connected at the second end. Finally, it comprises a tuning plate comprising double ridge slots configured to allow maximal signal to be transferred to the printed circuit board from the ganged waveguide.
Voltage booster isolation transformer system and method of operating the same
A system and method for an isolation transformer boost system. The system includes an isolation transformer, a sensor, and an electronic processor coupled to the sensor. The electronic processor configured to receive an electrical characteristic measurement from the sensor, compare the electrical characteristic measurement to a predetermined threshold, and activate an electrical characteristic boost when the electrical characteristic measurement is below the predetermined threshold.
Miniature test probe
A miniature probe for measuring small voltage signals of a DUT includes a probe body having a flexible substrate and signal transmission lines running a longitudinally, and a first probe connection circuit located at a first end of the probe body and including exposed wires, SMT components coupled between the exposed wires and the signal transmission lines, respectively, and a local mechanical stiffener mounted adjacent the SMT components. The wires are connectable to the DUT for receiving the voltage signals. The probe further includes a second probe connection circuit located at a second end of the probe body, and including transmission line connectors coupled to the signal transmission lines, respectively, and a bent portion of the flexible substrate between the probe body and the transmission line connectors. The bent portion enables the transmission line connectors to exit the probe substantially axially, relative to the longitudinal length of the probe body.
Miniature test probe
A miniature probe for measuring small voltage signals of a DUT includes a probe body having a flexible substrate and signal transmission lines running a longitudinally, and a first probe connection circuit located at a first end of the probe body and including exposed wires, SMT components coupled between the exposed wires and the signal transmission lines, respectively, and a local mechanical stiffener mounted adjacent the SMT components. The wires are connectable to the DUT for receiving the voltage signals. The probe further includes a second probe connection circuit located at a second end of the probe body, and including transmission line connectors coupled to the signal transmission lines, respectively, and a bent portion of the flexible substrate between the probe body and the transmission line connectors. The bent portion enables the transmission line connectors to exit the probe substantially axially, relative to the longitudinal length of the probe body.
Shield box, shield box assembly and apparatus for testing a semiconductor device
A shield box includes a top portion, a bottom portion and a socket. The top portion defines an aperture and includes at least one first ridge and at least one first groove. The bottom portion includes at least one second ridge and at least one second groove. The first ridge of the top portion occupies a second space defined by the second groove of the bottom portion, and the second ridge of the bottom portion occupies a first space defined by the first groove of the top portion. The socket is disposed over the bottom portion and accessible through the aperture of the top portion.
Nonlinear transmission line (NLTL)-based miniature reflectometers with reduced heat dissipation and scalable tether length
A system for measuring an electrical response of a device under test (DUT) includes a reflectometer with reduced heat dissipation used with a vector network analyzer (VNA). The reflectometer is tethered to the VNA using a tether of scalable length which carries low frequencies. The reflectometer has a distributed harmonic generator including a non-linear transmission line (NLTL) for multiplying a frequency of an RF signal received from the VNA to generate a test signal having a frequency in the millimeter wave range at a test port connected to the DUT. A sampler in the reflectometer receives a local oscillator (LO) signal from the VNA and includes another NLTL for receiving the LO signal and generating pulses at a frequency in the millimeter wave range. When the test signal is transmitted to the DUT, the sampler outputs intermediate frequency signals which are transmitted to the VNA for characterization of the DUT.
Nonlinear transmission line (NLTL)-based miniature reflectometers with reduced heat dissipation and scalable tether length
A system for measuring an electrical response of a device under test (DUT) includes a reflectometer with reduced heat dissipation used with a vector network analyzer (VNA). The reflectometer is tethered to the VNA using a tether of scalable length which carries low frequencies. The reflectometer has a distributed harmonic generator including a non-linear transmission line (NLTL) for multiplying a frequency of an RF signal received from the VNA to generate a test signal having a frequency in the millimeter wave range at a test port connected to the DUT. A sampler in the reflectometer receives a local oscillator (LO) signal from the VNA and includes another NLTL for receiving the LO signal and generating pulses at a frequency in the millimeter wave range. When the test signal is transmitted to the DUT, the sampler outputs intermediate frequency signals which are transmitted to the VNA for characterization of the DUT.
INTERCONNECT SYSTEM WITH HIGH CURRENT AND LOW LEAKAGE CAPABILITY
A test and measurement instrument switch matrix including a first cable including a center conductor and a guard connected to a first output of the test and measurement instrument; a second cable including a center conductor and a guard connected to a second output of the test and measurement instrument; a third cable including a center conductor and a guard connected to the device under test; and a fourth cable including a center conductor connected to the device under test and a guard connected to the device under test.
INTERCONNECT SYSTEM WITH HIGH CURRENT AND LOW LEAKAGE CAPABILITY
A test and measurement instrument switch matrix including a first cable including a center conductor and a guard connected to a first output of the test and measurement instrument; a second cable including a center conductor and a guard connected to a second output of the test and measurement instrument; a third cable including a center conductor and a guard connected to the device under test; and a fourth cable including a center conductor connected to the device under test and a guard connected to the device under test.