The present invention relates to resistance calibration and in particular to resistance calibration in the context of semiconductor integrated circuitry.

A detection device includes a light refraction structure and a resistance detection circuit. The light refraction structure includes a substrate, a conductive layer, and a refraction layer. The conductive layer and the refraction layer are formed on the substrate. The conductive layer includes a resistance. The resistance detection circuit is electrically coupled to the conductive layer and is adapted to detect the resistance of the conductive layer. The resistance detection circuit generates a detection signal according to a change in the resistance, and the detection signal represents a state of the refraction layer.

The present invention relates to a half-bridge signal processing circuit comprising a first and a second branch. The first branch comprises a first stimulus responsive sense element and a first current source arranged to provide a current to the first sense element. The second branch comprises a second stimulus responsive sense element and a second current source arranged to provide a current to said second sense element. The first and the second branch have a terminal in common. The first branch comprises a first node between said the current source and the first stimulus responsive sense element configured to generate a first signal related to a voltage over the first sense element. The second branch comprises a second node between the second current source and the second stimulus responsive sense element configured to generate a second signal related to a voltage over the second sense element.

A current sensor for detecting a current from or into a vehicle battery, comprising: * a measurement circuit; and * an electric conductor, having:at least one first measurement path, defined by a first potential pick-up contacting means (1) and a second potential pick-up contacting means (2), at which a first voltage (U1) over the first measurement path can be detected;a first connection contact (21) for electrically contacting a connection element;a second connection contact (22) for electrically contacting a battery pole terminal; anda current feed contacting means (5) for electrically contacting a device for providing a calibration current; wherein the first measurement path is formed in series between the first connection contact (21) and the second connection contact (22), wherein the electrical conductor, on account of its geometrical parameters (11,12,13,14,15) and contacting means (1,2,3,4,5,6,21,22), is formed in such a way that a calibration current (Iref) that can be fed at the current feed contacting means (5) causes a current density distribution in the first measurement path, which converges with a current density distribution in the first measurement path caused by a load current (Iload) of equal current strength that can be fed at the first connection contact (21).

In accordance with an embodiment, a sensor includes: a signal source with a first signal source terminal and a second signal source terminal; a bridge circuit connected to the first and second signal source terminals, the bridge circuit including: a first branch including: a first reference impedance element; and a first sensor impedance element configured to transduce a magnitude to be measured into a first impedance-related parameter; and a second branch including: a second reference impedance element; and a second sensor impedance element configured to transduce the magnitude to be measured into a second sensor impedance-related parameter.

A pressure sensing apparatus comprising a pressure sensor configured to sense a pressure and a controller. The controller is configured to supply a reverse bias voltage to the pressure sensor or to not supply a bias voltage to the pressure sensor in a time duration in which pressure sensing of the pressure sensor is not performed.

Methods, apparatuses and systems for providing offset calibration and fault monitoring are disclosed herein. An example controller component may comprise: a resistance-based bridge circuit; a signal conditioning circuit configured to condition an output of the resistance-based bridge circuit; a first diagnostic circuit coupled to the signal conditioning circuit configured to monitor an output of a first branch of the resistance-based bridge circuit; and a second diagnostic circuit coupled to the signal conditioning circuit configured to monitor an output of a second branch of the resistance-based bridge circuit.

A method for measuring a contact resistance at an interface of an electrically conductive coating and a cross-ply surface of a composite layer having electrically conductive fibers. The method includes: placing a dielectric coating of a sensing pad in contact with the composite layer or with the electrically conductive coating on the cross-ply surface of the composite layer; electrically connecting first and second input terminals of a comparator to the sensing pad and to one side of a capacitor respectively; electrically connecting another side of the capacitor to a fixed resistance; electrically connecting the fixed resistance to an electrically conductive body inserted in a hole in the composite layer; supplying an alternating current to the electrically conductive body and to the fixed resistance; and outputting a characteristic voltage signal if an amplitude of the input signal at the first input terminal is at least equal to an amplitude of the input signal at the second input terminal.

A system, in some embodiments, comprises: a multi-resistor Wheatstone bridge supplied by a first current source; and a second current source coupled to the bridge and configured to at least partially compensate for a voltage detected by an analog-to-digital converter (ADC), said voltage indicative of an alteration of a physical parameter affecting the bridge, wherein the ADC produces a digital code that represents said voltage.

The present invention relates to resistance calibration and in particular to resistance calibration in the context of semiconductor integrated circuitry.