G01R19/252

Partial discharge detector

A partial discharge (PD) detection system includes a PD sensor configured to sense a PD event of an electrical system and to generate a sensor signal in response to the PD event. An envelope generator is coupled to receive the sensor signal from the PD sensor. The envelope generator extracts an envelope signal from the sensor signal. A digitizer is configured to convert the envelope signal to a digital representation of the PD event.

Partial discharge detector

A partial discharge (PD) detection system includes a PD sensor configured to sense a PD event of an electrical system and to generate a sensor signal in response to the PD event. An envelope generator is coupled to receive the sensor signal from the PD sensor. The envelope generator extracts an envelope signal from the sensor signal. A digitizer is configured to convert the envelope signal to a digital representation of the PD event.

Differential current sensing with robust path, voltage offset removal and process, voltage, temperature (PVT) tolerance

Aspects of the disclosure are directed to voltage-based current sensing. In accordance with one aspect, voltage-based current sensing may include performing a coarse calibration of a voltage based current sensor to determine a coarse offset; performing a fine calibration of the voltage based current sensor to determine a fine offset; performing a frequency calibration of the voltage based current sensor to determine a frequency offset; and performing a transfer function calibration of the voltage based current sensor to determine a sensor transfer function using one or more of the coarse offset, the fine offset and the frequency offset; and measuring a load current using the sensor transfer function.

Current sensor

A current sensor for detecting a current based on a terminal voltage and a resistance value of a shunt resistor, includes: a resistance value correction circuit having: correction resistors; a signal application unit; a voltage detection unit that detects terminal voltages of the shunt resistor and a part of the correction resistors in a first period, and terminal voltages of all of the correction resistors in a second period; and a correction unit that corrects the resistance value for current detection based on a calculated resistance value of the shunt resistor. Resistance values and resistance accuracies of the correction resistors are higher as the plurality of correction resistors are disposed farther from the shunt resistor.

Current sensor

A current sensor for detecting a current based on a terminal voltage and a resistance value of a shunt resistor, includes: a resistance value correction circuit having: correction resistors; a signal application unit; a voltage detection unit that detects terminal voltages of the shunt resistor and a part of the correction resistors in a first period, and terminal voltages of all of the correction resistors in a second period; and a correction unit that corrects the resistance value for current detection based on a calculated resistance value of the shunt resistor. Resistance values and resistance accuracies of the correction resistors are higher as the plurality of correction resistors are disposed farther from the shunt resistor.

DESIGN FOR COMMUNICATION BETWEEN A MICROCONTROLLER AND AT LEAST ONE SENSOR CHIP
20210123956 · 2021-04-29 ·

The present disclosure relates to a sensor system, comprising a microcontroller, at least one sensor chip designed to measure a physical quantity, wherein the microcontroller and the sensor chip are coupled to one another via at least one analog signal interface for conveying analog measurement data between the sensor chip and the microcontroller and via a bidirectional digital signal interface for conveying digital secondary information between the sensor chip and the microcontroller.

DESIGN FOR COMMUNICATION BETWEEN A MICROCONTROLLER AND AT LEAST ONE SENSOR CHIP
20210123956 · 2021-04-29 ·

The present disclosure relates to a sensor system, comprising a microcontroller, at least one sensor chip designed to measure a physical quantity, wherein the microcontroller and the sensor chip are coupled to one another via at least one analog signal interface for conveying analog measurement data between the sensor chip and the microcontroller and via a bidirectional digital signal interface for conveying digital secondary information between the sensor chip and the microcontroller.

CIRCUIT-BREAKER AND MOBILE DEVICE

A circuit-breaker includes an electronic trip unit, which initiates an interruption or reduction of the current flow in a low-voltage circuit when current or current-time limits are exceeded in the low-voltage circuit. The electronic trip unit includes at least two processors that independently check whether current or current-time limits are being exceeded. A test signal is fed to the circuit-breaker via a first communication interface, which is fed to one of the two processors during operation so that a test of the circuit-breaker is carried out during operation, while at the same time an active protection is provided with regard to the exceeding of current or current-time limits.

CIRCUIT-BREAKER AND MOBILE DEVICE

A circuit-breaker includes an electronic trip unit, which initiates an interruption or reduction of the current flow in a low-voltage circuit when current or current-time limits are exceeded in the low-voltage circuit. The electronic trip unit includes at least two processors that independently check whether current or current-time limits are being exceeded. A test signal is fed to the circuit-breaker via a first communication interface, which is fed to one of the two processors during operation so that a test of the circuit-breaker is carried out during operation, while at the same time an active protection is provided with regard to the exceeding of current or current-time limits.

BALL GRID ARRAY CURRENT METER WITH A CURRENT SENSE MESH

Electrical current flow in a ball grid array (BGA) package can be measured by an apparatus including an integrated circuit (IC) electrically connected to the BGA package. Solder balls connect the BGA package to a printed circuit board (PCB). A current sense mesh can be placed between adjacent solder balls and is attached to the upper surface of the PCB. The solder balls are electrically connected to supply current from the PCB through the BGA package to the IC. A MUX/Sequencer can sequentially connect wires of the current sense mesh to an amplifier. The amplifier can amplify a voltage induced on the current sense mesh by current flow into the BGA package. A sensing analog-to-digital converter (ADC) is electrically connected to convert a voltage at the output of the amplifier into digital output signals.