A test fixture for PCB components is described herein. The test fixture comprises a shim with an aperture configured to direct RF energy from a component of a PCB, via an end of the PCB, and to a top clamp of the test fixture. The end of the PCB may correspond to a cut line of a destructive test. The test fixture also comprises the top clamp with a test port and a taper configured to direct the RF energy from the aperture to the test port. The test fixture also comprises a bottom clamp attached to the top clamp to retain the PCB between the top and bottom clamps for testing. The test fixture allows for quick mounting of the PCB and testing of the component without modifying a design of the PCB or requiring specific drilling of the PCB.

A probe structure for inspecting characteristics of a connector having at least one terminal includes a plunger, a coaxial probe, a flange, a housing, and a spring. A first end portion of the housing and the flange are configured to restrict rotation of the housing in the circumferential direction in a state in which the first end portion of the housing is fitted into the through-hole of the flange. Thus, inspection of characteristics of the terminal of the connector can be performed with higher accuracy.

The present disclosure is provided with a probe card and a transfer stage for transferring an inspection target toward the probe card. The transfer stage is provided with a chuck top on which the inspection target is mounted, an aligner configured to be contacted to or separated from the chuck top, and an aligning mechanism for aligning the chuck top with the aligner. The aligning mechanism has radially-expandable positioning pins at a plurality of positions on the upper surface of the aligner, and pin insertion members at positions on the lower surface of the chuck top corresponding to the positioning pins, the pin insertion members having pin insertion holes of which diameters are larger than those of the positioning pins that are not radially expanded. The chuck top is aligned with the aligner by inserting the positioning pins into the pin insertion holes and radially expanding the positioning pins.

Aspects of the invention include a wafer test device with a conformal laminate and rigid probes extending from the laminate to form an electrical connection with a microcircuit under test. The wafer test device also includes a spring plate on a side of the laminate that is opposite a side from which the rigid probes extend. The spring plate includes a conformal inner frame and a rigid outer frame. The laminate is attached to the inner frame of the spring plate.

A tester apparatus is described. Various components contribute to the functionality of the tester apparatus, including an insertion and removal apparatus, thermal posts, independent gimbaling, the inclusion of a photo detector, a combination of thermal control methods, a detect circuitry in a socket lid, through posts with stand-offs, and a voltage retargeting.

An apparatus for probing a device-under-test (DUT) includes a fixture disposed over the DUT, a circuitry film disposed along a contour of the fixture, a first signal connector, and a plurality of probing tips disposed on the circuitry film and extending toward the device-under-test. The circuitry film includes a first portion attached to a top sidewall of the fixture, and the first signal connector is disposed on and electrically connected to the first portion of the circuitry film. The first signal connector is electrically coupled to the probing tips through the circuitry film. A method for probing a DUT is also provided.

Provided is a Kelvin contact for inspection in which contacts and an insulating layer are less likely to be shifted relative to each other even after repeatedly performed Kelvin inspection. The Kelvin contact for inspection includes: a first contact having an upper contact point that comes into contact with one electrode terminal of an IC device and a lower contact point that comes into contact with an electrode pad of a substrate for inspection; and a second contact having an upper contact point that comes into contact with the one electrode terminal and the lower contact point that comes into contact with an electrode pad of the substrate for inspection. The first and second contacts are adjacently arranged to contact with the same one electrode terminal and provided with an insulating layer surrounding the entire main body area except upper and lower contact point areas including the upper and lower contact points, respectively.

A light emitting diode (LED) array is formed by bonding an LED substrate to a backplane substrate via fitted nanotube interconnects. The backplane substrate may include circuits for driving the LED array. The LED substrate may be a chip or wafer, and may include one or more LED devices. The LED substrate is positioned above the backplane substrate, such that a LED device of the LED substrate is aligned to a corresponding circuit in the backplane substrate. Each of the fitted interconnects electrically connect a LED device to the corresponding circuit of the backplane substrate.

Machine with flying probes for testing electronic boards comprising a conveyor for loading/unloading the boards into/from the testing station, a plurality of flying probes suitable to interact with predetermined points of each board and a plurality of contacting devices arranged at the sides of the working volume of the flying probes and suitable to cooperate with contact areas arranged on one edge of the board.

A device is provided for electrically measuring surface characteristics of a sample. The device comprises at least one group of three electrodes: a first and second electrode spaced apart from each other and configured to be placed onto the surface of the sample, and a third electrode between the first two but isolated from these two electrodes by a one or more first insulators, wherein a second insulator further isolates the central electrode from the sample when the device is placed thereon. The three electrodes and the insulators are attached to a single or to multiple holders with conductors incorporated therein for allowing the coupling of the electrodes to power sources or measurement tools. The placement of the device onto a semiconductor sample creates a transistor with the sample surface acting as the channel. The device thereby allows the determination of the transistor characteristics of the sample in a straightforward way.