A turret handler with picker pairs is provided for testing a plurality of electronic elements. The turret handler includes a plurality of outer pickers, a plurality of inner pickers, a plurality of sockets and a package carrier. The outer pickers travel along a first circular path. The inner pickers travel along a second circular path. The first circular path and the second circular path are concentric circles, and the outer pickers and the inner pickers are arranged side by side along the radial direction of the first circular path. The sockets include a plurality of first sockets and a plurality of second sockets. The first sockets circumferentially correspond to the first circular path, the second sockets circumferentially correspond to the second circular path, and each first socket corresponds to one second socket along the radial direction. The package carrier includes a plurality of recesses.

A method for evaluating the insulating performance of a separator using an insulating performance evaluation system according to an exemplary embodiment of the present disclosure includes: preparing a measurement subject wherein a metal contact layer is interposed between two sheets of separator so as to form a plurality of local contacts with the surface of the separator; sandwiching the measurement subject between an upper jig and a lower jig; applying a voltage the magnitude of which varies with time between the upper jig and the lower jig using a voltage application unit; receiving a current measurement value flowing between the upper jig and the lower jig as an input from a current measurement unit; and determining the voltage value at which the current measurement value is equal to or greater than a preset critical value as a dielectric breakdown voltage, by a control unit.

An inspection jig includes contact terminals and a pitch conversion unit electrically connected to the contact terminals and configured to convert a first pitch between adjacent two of the contact terminals into a second pitch different from the first pitch. The contact terminals each include a tubular body that extends in an axial direction of the contact terminal and is electrically conductive, and a conductor that is electrically conductive and has a stick shape. The tubular body includes a spring portion that has a helical shape along a peripheral surface of the tubular body. The conductor includes an uninserted portion that protrudes from the tubular body toward a first side in the axial direction, and an inserted portion that is disposed in the tubular body and is fixed to a first axial end portion of the tubular body. The pitch conversion unit includes a board portion and a protruding portion.

Elongated flexible probes can be disposed in holes of upper and lower guide plates of a probe card assembly. Each probe can include one or more spring mechanisms that exert normal forces against sidewalls of holes in one of the guide plates. The normal forces can result in frictional forces against the sidewalls that are substantially parallel to the sidewalls. The frictional forces can reduce or impede movement parallel to the sidewalls of the probes in the holes.

A testing device includes a circuit board, a carrier, a probe pin, a main body, a shaft, a pressing portion and a resilient spiral spring. The carrier is used to hold a device under test (DUT). The probe pin is electrically connected to the circuit board and the DUT. The shaft is movably connected to the main body with a screwing rotation method. The pressing portion is connected to one end surface of the shaft. The resilient spiral spring is retractably coiled on the shaft, and one end of the resilient spiral spring being far away from the shaft extends in a transverse direction intersecting an axial direction of the shaft.

The present invention provides a semiconductor film layer inspection apparatus (10) for detecting the electrical characteristics of a semiconductor film layer (30) formed on one surface of a substrate (20) and including an oxide semiconductor layer (31), and a detection unit used therein. The apparatus includes a base unit (40), a detection unit (200) and a carrier generator (300 300a and 300b). The detection unit (200) includes: a detection probe pin (230) and a detection probe module (202). The detection probe pin (230) includes a detection probe pin body (231) and a detection probe pin contactor unit (233). The detection probe pin contactor unit at least partially forms a plurality of independently detectable and operable segmented pin contactor unit blocks.

Multiple pin probes and methods for controlling such multiple pin probes to support parallel measurements are disclosed. The method may include: establishing electrical contact between a multiple pin probe and a subject of measurement; selecting two pins out of a plurality of pins included in the multiple pin probe as current-carrying pins; selecting more than two additional pins out of the plurality of pins included in the multiple pin probe as voltage-metering pins; injecting a current through the current-carrying pins; simultaneously measuring voltage signals through the voltage-metering pins; calculating a simulated voltage distribution curve at least partially based on the voltage signals simultaneously measured through the voltage-metering pins; and determining one or more processor monitor parameters of the subject of measurement at least partially based on the simulated voltage distribution curve.

Circuits and methods for testing wafers are disclosed herein. An embodiment of a method includes electrically contacting a first probe and a second probe to a wafer. A gas is blown in the areas proximate the first probe and the second probe. An electric potential is then applied between the first probe and the second probe while the gas is being blown.

A probe card is disclosed. The probe card includes a first disc, a second disc, an alignment plate and multiple micro probes. One of the micro probes includes a linear segment and a curved segment connected to each other at an angle stop. The first disc includes a recessed area having multiple holes formed therein, wherein one of the holes is configured to receive the linear segment of the micro probe. The second disc includes a recessed area having multiple holes formed therein, wherein one of the holes is configured to receive the curved segment of the micro probe. Placed within the recessed area of the second disc, the alignment plate includes multiple holes formed therein, wherein one of the holes is configured to receive the curved segment of the micro probe.

A probe head and methods of testing a device using a probe head are provided. The probe head includes a first end connected to a first substrate. The first substrate is configured to be connected to a test head. The probe head also includes second end having a first inner recess surrounded by a first protrusion and a first plurality of probe needles connected to the first protrusion.