A portable nodal impedance analyser. The impedance analyser (100) is configured with an auto best curve-fit application which automatically selects the values for Voltage, Source Impedance and Frequency of the stimulus waveform (best fit values) to generate equivalent circuit and its appropriate V-I traces. The auto best curve-fit application automatically selects one or more input Sinusoidal Patterns (Waveforms) in such a way that the V-I Characteristics of the components present in a Node (the two points across which the input Pattern is driven, and response is received), are best revealed by automatically adjusting the Drive Voltage (0.2V, 4V, 8V and 13V), Source Impedance (10?, 50?, 100?, 500?, 1K?, 5K?, 10K?, 50K?, 100K?) and Frequency (from 1 Hz to 50 KHz) of the input Patterns.

The present disclosure relates to a system and method for health monitoring and early warning for an electronic device. A sensor is used to monitor a physical parameter of a circuit board of a host electronic system of the electronic device to acquire sensor data, and transmit the acquired sensor data to an embedded control device. The sensor data includes at least one of current data, vibration data, temperature data and voltage data. The embedded control device is used to extract a feature from the sensor data to acquire feature data, and perform real-time analysis and prediction based on the feature data to obtain and display a prediction result. In this way, the user can be provided with real-time health monitoring and real-time prediction information for the host electronic system circuit board.

The present invention is directed to a system for testing printed circuit boards. The system is configured to test the simultaneously test a multiplicity of printed circuit boards. The system examines the electrical characteristics of a printed circuit board and is operable to identify if a printed circuit board meets a desired characteristic.

The line power and neutral conductors for an arc fault sensing circuit interrupter such as in a miniature circuit breaker are arranged as a rigid conductor surrounding and holding an insulated flexible conductor when passing through the Ground Fault Interrupter current transformer. Voltage metering takes place across the rigid conductor to enable arc fault detection and ground fault detection in the miniature circuit breaker within the space of a single current transformer.

A testing arrangement is provided which comprises: a board assembly comprising (i) a first connector configured to receive a first component while the board assembly is to operate in a regular mode of operation and (ii) a second connector configured to receive a second component while the board assembly is to operate in the regular mode of operation; a first test card configured to be attached to the first connector while the board assembly is to operate in a test mode of operation; and a second test card configured to be attached to the second connector while the board assembly is to operate in the test mode of operation, wherein while the board assembly is to operate in the test mode of operation, the first test card is configured to communicate with the second test card to facilitate testing of the board assembly.

In an embodiment, a universal test cell includes a plurality of test slots configured to receive a plurality of universal test containers each including similar dimensions. Each universal test container is configured to enclose each of a plurality of different devices to test. Each universal test container includes an external electrical interface configured to couple to each of the plurality of different devices to test. The universal test cell is configured to test the plurality of different devices while each is located within a universal test container of the plurality of universal test containers. The universal test cell includes a plurality of universal electrical interfaces that are each configured to couple with the external electrical interface of each universal test container.

An instrument panel includes a frame defining an opening, a plurality of cards, and an HMI. The cards have a front face, a rear face, one or more circuits, and a data interface on the rear face in communication with the circuits. The cards include one or more first cards and one or more second cards. The first cards front face have a vertical dimension approximately equal to a vertical dimension of the opening. The second cards have a body, a nose projecting from the body defining the second cards front face, and a recess between the nose and body. The HMI includes a front face received within the opening. The first cards are positioned with the front face visible within the opening. The second cards are positioned with the nose visible within the opening and a depth of the HMI received within the recess.

A method of securing a probe tip to a device under test (DUT), the method comprising: positioning the probe tip near a test point of the DUT, the probe tip comprising a connection point on a signal-path portion of the probe tip and an attachment tab, the connection point making an electrical connection with the test point of the DUT, the attachment tab extending away from the signal-path portion of the probe tip; applying an adhesive to the DUT through a hole in the attachment tab of the probe tip; and curing the adhesive to secure the probe tip to the DUT.

According to some aspects of the present disclosure, power modules having current sensing circuits, and corresponding sensing methods, are disclosed. Example power modules include a printed circuit board (PCB) having a PCB trace, an output choke inductor, and an output pin. The power module also includes a first sense terminal coupled to the PCB trace, a second sense terminal coupled to the output pin such that a resistance between the first sense terminal and the second sense terminal is defined by a resistance of the PCB trace and a resistance of the output pin, and a control coupled to the first sense terminal and the second sense terminal. The control is adapted to measure a voltage between the sense terminals, and to determine a current through the PCB trace and the output pin based on the measured voltage and the resistance between the sense terminals.

A method, printed circuit board assembly (PCBA), and device comprising a PCBA are disclosed. The method includes obtaining a material comprising silver halide grains, incorporating the material into a PCBA having at least one component in contact with the material, detecting a variation in electrical properties of the at least one component that is above a threshold variation and, in response, enacting a data protection response. The PCBA includes a material comprising silver halide grains, at least one component in contact with the material, and a monitoring component. The monitoring component is configured to detect a variation in electrical properties of the at least one component that is above a threshold variation and, in response, enact a data protection response.