G01R31/2801

Method, device and system for measuring frequency domain characteristics, and storage medium

A method for measuring frequency domain characteristics of a PDN having an output terminal connected to a power supply end of a functional circuit. The method includes: a to-be-measured output interface of the functional circuit is acquired; the to-be-measured output interface is controlled to output a first level signal having a first preset rule; remaining at least one output interface of the functional circuit, other than the to-be-measured output interface, is controlled to output a second level signal having a second preset rule according to a first frequency; changing voltage values corresponding to the first frequency and output by the to-be-measured output interface are acquired; and a characteristic impedance of the PDN at the first frequency is determined based on the changing voltage values corresponding to the first frequency.

Instrument panel for computing system

An instrument panel includes a frame defining an opening, a plurality of cards, and an HMI. The cards have a front face, a rear face, one or more circuits, and a data interface on the rear face in communication with the circuits. The cards include one or more first cards and one or more second cards. The first cards front face have a vertical dimension approximately equal to a vertical dimension of the opening. The second cards have a body, a nose projecting from the body defining the second cards front face, and a recess between the nose and body. The HMI includes a front face received within the opening. The first cards are positioned with the front face visible within the opening. The second cards are positioned with the nose visible within the opening and a depth of the HMI received within the recess.

Reverse recovery measurements and plots

A test and measurement instrument has a user interface, one or more probes to connect to a device under test (DUT), and one or more processors to: receive waveform data from the DUT, locate one or more reverse recovery regions in the waveform data, determine a reverse recovery time for the DUT from the reverse recovery region, and display a reverse recovery plot of the one or more reverse recovery regions on the user interface. A method of providing reverse recovery measurements for a device under test (DUT) includes receiving waveform data through one or more probes from the DUT, locating one or more reverse recovery regions in the waveform data, determining a reverse recovery time for the DUT for the one or more reverse recovery regions, and displaying a reverse recovery plot of the one or more reverse recovery regions on the user interface.

Probe and probe device
12487252 · 2025-12-02 · ·

[Problem] To provide a probe and a probe device that can be easily attached to and detached from circuit boards and make it possible to conduct testing of circuit boards or electronic components in an efficient manner. [Means of Solution] A first clamping piece 20 has first clamping portions 25 at one end located adjacent to the circuit board P that make contact with one surface of a circuit board P; a second clamping piece 30 has a second clamping portion 31 at one end located adjacent to the circuit board P that makes contact with the other surface of the circuit board; the first clamping piece 20 and second clamping piece 30 have operative portions 26, 32 at the other end located on the side distal from the circuit board P for receiving an operating force opposing a biasing force exerted by a biasing member 40.

Method and system for testing a printed circuit board

A testing system and method for testing a Printed Circuit Boards (PCBs) is provided. The method is being executed at a testing system which comprises a RF test analyzer; a RF energy source; and one or more RF probes. The method includes performing a first level scanning of a first set of components in the PCB. The method further includes performing a second level scanning of another set of components in the PCB, which differs from the first set of components in the PCB; the second level scanning is performed only if anomalies are identified which is based on analyzing the results of the performed first level scanning. The method further includes determining detailed root causes of the identified anomalies which is based on analyzing results of the performed second level scanning.

Flexible wide bandgap double pulse testing methodology

A test and measurement instrument has a user interface, one or more probes to allow the instrument to connect to a device under test (DUT), and one or more processors configured to execute code to cause the one or more processors to: receive one or more user inputs through the user interface, at least one of the user inputs to identify at least one analysis to be performed on the DUT, receive waveform data from the DUT when the DUT is activated by application of power from a power supply, and application of one of a first and second pulse or multiple pulses from a source instrument, perform the at least one analysis on the waveform data, and display the waveform data and analysis on the user interface. A method of automatically performing a double pulse test and analysis on a device under test (DUT) includes receiving a user input through a user interface on a test and measurement instrument, the user input to identify at least one analysis to be performed on waveform data received from the DUT, receiving the waveform data from the DUT when the DUT is activated by application of power from a power supply, and application of one of a first and a second pulse or multiple pulses from a source instrument, performing the analysis on the waveform data, and displaying the waveform data and analysis on the user interface.

Electronic unit and method for testing at least one state of an electronic unit

An electronic unit includes at least one component and a printed circuit board, wherein the at least one component has at least one terminal. The printed circuit board has at least one first contact surface and at least one second contact surface, wherein the at least one first contact surface and the at least one second contact surface are spaced apart from one another. The at least one terminal is joined to the at least two contact surfaces by at least one solder joint. A method for testing at least one state of an electronic unit is also disclosed.