Systems, methods, and devices for monitoring operation of industrial equipment are disclosed. In one embodiment, a monitoring system is provided that includes a passive backplane and one more functional circuits that can couple to the backplane. Each of the functional circuits that are coupled to the backplane can have access to all data that is delivered to the backplane. Therefore, resources (e.g., computing power, or other functionality) from each functional circuits can be shared by all active functional circuits that are coupled to the backplane. Because resources from each of the functional circuits can be shared, and because the functional circuits can be detachably coupled to the backplane, performance of the monitoring systems can be tailored to specific applications. For example, processing power can be increased by coupling additional processing circuits to the backplane.

The present disclosure relates to an electronic unit including at least one component and a printed circuit board, wherein the at least one component has at least one terminal, wherein the printed circuit board has at least one first contact surface and at least one second contact surface, wherein the at least one first contact surface and the at least one second contact surface are spaced apart from one another, wherein the at least one terminal is joined to the at least two contact surfaces by at least one solder joint. The present disclosure further relates to a method for testing at least one state of an electronic unit.

The present invention is directed to a system for testing printed circuit boards. The system is configured to test the simultaneously test a multiplicity of printed circuit boards. The system examines the electrical characteristics of a printed circuit board and is operable to identify if a printed circuit board meets a desired characteristic.

One aspect of this description relates to a testing apparatus including an advance process control monitor (APCM) in a first wafer, a plurality of pads disposed over and coupled to the APCM. The plurality of pads are in a second wafer. The testing apparatus includes a testing unit disposed between the first wafer and the second wafer. The testing unit is coupled to the APCM. The testing unit includes a metal structure within a dielectric. The testing apparatus includes a plurality of through silicon vias (TSVs) extending in a first direction from the first wafer, through the dielectric of the testing unit, to the second wafer.

A display module and its formation method are provided in the present disclosure. The display module includes a main flexible circuit board, including a first binding terminal, a second binding terminal, a first test point and a second test point, where the first test point is electrically connected to the first binding terminal, and the second test point is electrically connected to the second binding terminal; and further includes an auxiliary flexible circuit board, including a third binding terminal and a fourth binding terminal, where the third binding terminal is electrically connected to the fourth binding terminal, the first binding terminal is disposed corresponding to the third binding terminal, and the second binding terminal is disposed corresponding to the fourth binding terminal.

A method for measuring frequency domain characteristics of a PDN having an output terminal connected to a power supply end of a functional circuit. The method includes: a to-be-measured output interface of the functional circuit is acquired; the to-be-measured output interface is controlled to output a first level signal having a first preset rule; remaining at least one output interface of the functional circuit, other than the to-be-measured output interface, is controlled to output a second level signal having a second preset rule according to a first frequency; changing voltage values corresponding to the first frequency and output by the to-be-measured output interface are acquired; and a characteristic impedance of the PDN at the first frequency is determined based on the changing voltage values corresponding to the first frequency.

A rigid-flex printed circuit board (PCB) includes at least one rigid PCB including at least one electrical component, a flex circuit, and a built-in diagnostic circuit. The flex circuit includes at least one end connected to the at least one rigid PCD. The flex circuit includes at least one signal trace configured to deliver an electrical signal to the at least one electrical component. The built-in diagnostic circuit is configured to detect a fault in the rigid-flex PCB.

A test and measurement instrument has a user interface, one or more probes to connect to a device under test (DUT), and one or more processors configured to execute code to cause the one or more processors to: receive waveform data from the DUT after activation of the DUT by application of power from a power supply, and application of at least a first and second pulse from a source instrument, locate one or more reverse recovery regions in the waveform data, determine a reverse recovery time for the DUT from the reverse recovery region, and display a reverse recovery plot of the one or more reverse recovery regions on the user interface, the reverse recovery plot being automatically configured to display one or more of the reverse recovery regions, and including at least one characteristic for the one or more reverser recovery regions annotated on the reverse recovery plot. A method of providing reverse recovery measurements for a device under test (DUT) includes receiving waveform data through the probes from the DUT after activation of the DUT by application of power from a power supply, and application of a first and second pulse from a source instrument, locating one or more reverse recovery regions in the waveform data, determining a reverse recovery time for the DUT for the one or more reverse recovery regions, and displaying a reverse recovery plot of the one or more reverse recovery regions on the user interface, the reverse recovery plot being automatically configured to display the one or more reverse recovery regions, and including at least one characteristic of the one or more reverse recovery regions annotated on the reverse recovery plot.

A method, printed circuit board assembly (PCBA), and device comprising a PCBA are disclosed. The method includes obtaining a material comprising silver halide grains, incorporating the material into a PCBA having at least one component in contact with the material, detecting a variation in electrical properties of the at least one component that is above a threshold variation and, in response, enacting a data protection response. The PCBA includes a material comprising silver halide grains, at least one component in contact with the material, and a monitoring component. The monitoring component is configured to detect a variation in electrical properties of the at least one component that is above a threshold variation and, in response, enact a data protection response.

A flexible monitoring system and corresponding methods of use are provided. The system can include a base containing backplane, and one or more monitoring circuits. The monitoring circuits can be designed with a common architecture that is programmable to perform different predetermined functions. As a result, monitoring circuits can be shared between different implementations of the flexible monitoring system. Multiple bases that can be communicatively coupled in a manner that establishes a common backplane between respective bases that is formed from the individual backplanes of each base. Each monitoring circuit is not limited to sending data to and/or receiving data from the backplane to which it is physically coupled but can instead can communicate along the common backplane. Computational processing capacity can be increased or decreased independently of input signals received by addition or removal of processing circuits from the monitoring system.