A test-and-measurement probe (200) for a test-and-measurement instrument (101), the test-and-measurement probe having a probe head (103) and a touchscreen user interface (250). The probe head is configured to obtain a signal from a device under test. The touchscreen user interface is configured to visually convey test-and-measurement information to a user and to accept user touch input. In embodiments, the touchscreen user interface is removably connected to a compbox (105) of the test-and-measurement probe, through a wired connection or wirelessly.

Described herein are antenna-coupled radio frequency (RF) probes with replaceable tips. In the described embodiments, test signals are coupled onto a probe tip wafer via an on-tip antenna, thus the probe tip is decoupled from the probe body. This allows for separate fabrication of the probe body and the probe tip. As such, the probe tip can be made available as a “commodity” and the user can simply replace a worn-out or damaged probe tip, providing significant savings in per-unit cost and operation cost of the new contact probes. The decoupling of probe tip and probe body allows for manual replacement of probe tip without the need for extremely accurate alignment which is typically required in extremely high frequency probes. Manual replacement of the tips is only possible due to the much less stringent alignment requirements afforded by the antenna coupling from the probe body to the probe tip.

The disclosure describes a process and apparatus for accessing devices on a substrate. The substrate may include only full pin JTAG devices (504), only reduced pin JTAG devices (506), or a mixture of both full pin and reduced pin JTAG devices. The access is accomplished using a single interface (502) between the substrate (408) and a JTAG controller (404). The access interface may be a wired interface or a wireless interface and may be used for JTAG based device testing, debugging, programming, or other type of JTAG based operation.

An electromagnetic field probe includes one continuous conductor line having terminals at both ends of the one continuous conductor line and including 2N (N is an integer greater than or equal to 3) conductors radially extending from a point near the center of the electromagnetic field probe, the one continuous conductor line being not short-circuited in the middle and being formed by connecting an end portion of a conductor included in the 2N conductors to an end portion of another conductor included in the 2N conductors, and two conductors included in the 2N conductors are disposed at positions at which the two conductors face each other with the point near the center present between the two conductors, and end portions of the two conductors close to the point near the center are connected to each other.

Detecting whether a target utility device that includes multiple electronic components is genuine or suspected counterfeit by: performing a test sequence of energizing and de-energizing the target device and collecting electromagnetic interference (EMI) signals emitted by the target device; generating a target EMI fingerprint from the EMI signals collected; retrieving a plurality of reference EMI fingerprints from a database library, each of which corresponds to a different configuration of electronic components of a genuine device of the same make and model as the target device; iteratively comparing the target EMI fingerprint to the retrieved reference EMI fingerprints and generating a similarity metric between each compared set; and indicating that the target device (i) is genuine where the similarity metric for any individual reference EMI fingerprint satisfies a threshold test, and is a suspect counterfeit device where no similarity metric for any individual reference EMI fingerprint satisfies the test.

Detecting whether a target utility device that includes multiple electronic components is genuine or suspected counterfeit by: performing a test sequence of energizing and de-energizing the target device and collecting electromagnetic interference (EMI) signals emitted by the target device; generating a target EMI fingerprint from the EMI signals collected; retrieving a plurality of reference EMI fingerprints from a database library, each of which corresponds to a different configuration of electronic components of a genuine device of the same make and model as the target device; iteratively comparing the target EMI fingerprint to the retrieved reference EMI fingerprints and generating a similarity metric between each compared set; and indicating that the target device (i) is genuine where the similarity metric for any individual reference EMI fingerprint satisfies a threshold test, and is a suspect counterfeit device where no similarity metric for any individual reference EMI fingerprint satisfies the test.

A programmable semiconductor device contains a wireless communication block (“WCB”) capable of facilitating wirelessly field programmable gate array (“FPGA”) programming download as well as functional logic implementation. In one aspect, WCB detects an FPGA access request for initiating an FPGA reconfiguration from a remote system via a wireless communications network. Upon receiving a configuration bitstream for programming the FPGA via the wireless communications network, the configuration bitstream is forwarded from WCB to a configuration download block (“CDB”) for initiating a configuration process. CDB subsequently programs at least a portion of configurable logic blocks (“LBs”) in FPGA in response to the configuration bitstream.

A test assembly for testing an antenna-in-package (AiP) device includes a socket over a circuit board, where the socket includes an opening for receiving the AiP device; a plunger configured to move along sidewalls of the opening, where during testing of the AiP device, the plunger is configured to cause the AiP device to be pressed towards the circuit board such that the AiP device is operatively coupled to the circuit board via input/output connections of the AiP device and of the circuit board; and a loadboard disposed within the socket and between the plunger and the AiP device, where the loadboard includes a coupling structure configured to be electromagnetically coupled to a transmit antenna and to a receive antenna of the AiP device, so that testing signals transmitted by the transmit antenna are conveyed to the receive antenna externally relative to the AiP device through the coupling structure.

A system and method for detecting dynamic electromagnetic emission of an integrated circuit (IC) chip is provided. One embodiment of the method, includes exciting nitro vacancy (NV) centers of a diamond slide located in close proximity to the IC chip via use of light, resulting in an NV fluorescence; providing an optical readout of the NV fluorescence, wherein the optical readout provides quantum states of the NV centers, thereby providing a spectra of electromagnetic fields of the IC chip. A determination is then made of at least one of the group comprising clock frequencies of the IC chip, referred to herein as determined clock frequencies, and data bandwidth of the IC chip, referred to herein as determined data bandwidth of the IC chip, from the spectra of electromagnetic fields of the IC chip. A comparison is then performed, comparing at least one of the group comprising determined clock frequencies and determined data bandwidth, to at least one of the group comprising expected clock frequencies of the IC chip and expected data bandwidth of the IC chip, thereby determining if a foreign device or software is located on the IC chip.

A system and method for detecting dynamic electromagnetic emission of an integrated circuit (IC) chip is provided. One embodiment of the method, includes exciting nitro vacancy (NV) centers of a diamond slide located in close proximity to the IC chip via use of light, resulting in an NV fluorescence; providing an optical readout of the NV fluorescence, wherein the optical readout provides quantum states of the NV centers, thereby providing a spectra of electromagnetic fields of the IC chip. A determination is then made of at least one of the group comprising clock frequencies of the IC chip, referred to herein as determined clock frequencies, and data bandwidth of the IC chip, referred to herein as determined data bandwidth of the IC chip, from the spectra of electromagnetic fields of the IC chip. A comparison is then performed, comparing at least one of the group comprising determined clock frequencies and determined data bandwidth, to at least one of the group comprising expected clock frequencies of the IC chip and expected data bandwidth of the IC chip, thereby determining if a foreign device or software is located on the IC chip.