An electrical bonding test device, including a test system circuit configured to generate a current pulse for ground bonding testing of subject units, a first test system connector configured to provide an electrical connection between a first unit connector shell of a first unit of the subject units and the test system circuit and to pass the current pulse to the first unit connector shell during the ground bonding testing, and a second test system connector configured to provide an electrical connection between a second unit connector shell of a second unit of the subject units and a first node of the test system circuit. The test system circuit is further configured to provide an indication indicating whether a bonding path through the subject units is a conductive path having a resistance below a resistance threshold.

An electrical bonding test device, including a test system circuit configured to generate a current pulse for ground bonding testing of subject units, a first test system connector configured to provide an electrical connection between a first unit connector shell of a first unit of the subject units and the test system circuit and to pass the current pulse to the first unit connector shell during the ground bonding testing, and a second test system connector configured to provide an electrical connection between a second unit connector shell of a second unit of the subject units and a first node of the test system circuit. The test system circuit is further configured to provide an indication indicating whether a bonding path through the subject units is a conductive path having a resistance below a resistance threshold.

In accordance with one embodiment, a method for testing a plurality of electronic components is provided, including subdividing the plurality of electronic components into a plurality of first groups and subdividing the plurality of electronic components into a plurality of second groups. The method may further include measuring, for each first group, an electrical parameter of an interconnection of the components of the first group; measuring, for each second group, an electrical parameter of an interconnection of the components of the second group, and determining which electronic components of the plurality of electronic components have a predefined property, on the basis of the result of the measurement of the electrical parameter for the first groups and on the basis of the result of the measurement of the electrical parameter for the second groups.

A computer including a hardware interface wherein the hardware interface includes a first resistor with a first first resistor pin and a second first resistor pin, a second resistor with a first second resistor pin and a second second resistor pin, a transistor, a comparator; the first first resistor pin being coupled on the one hand to the first hardware interface pin and on the other hand to a first transistor pin.

A computer including a hardware interface wherein the hardware interface includes a first resistor with a first first resistor pin and a second first resistor pin, a second resistor with a first second resistor pin and a second second resistor pin, a transistor, a comparator; the first first resistor pin being coupled on the one hand to the first hardware interface pin and on the other hand to a first transistor pin.

A contact monitoring unit is for a safety-critical triggering apparatus of a switching device, including a connection diagram arranged on a first circuit carrier medium for a triggering apparatus and triggering electronics arranged on a second circuit carrier medium. The contact monitoring unit includes redundant electrical connections that are monitored such that, even a failure of a redundant electrical connection is detected.

A device for determining impedance at a data pin of a communication interface. In one embodiment, the device includes a current source configured to selectively inject a test current to the data pin. The device also includes a sensing circuit for sensing a first test voltage corresponding to a voltage at the data pin without the test current injected, and a second test voltage corresponding to another voltage at the data pin with the test current injected. The sensing circuit determines the impedance at the data pin based on the first test voltage and the second test voltage.

A lidar sensor assembly includes a detector array having a plurality of photodetectors. An integrated circuit is bonded to the detector array via a plurality of connection bumps. A reference trace is defined by conductive material on at least one of the integrated circuit and the detector array. A test trace is defined by conductive material on the detector array, at least two of the connection bumps, and conductive material on the integrated circuit. A resistance measuring device is configured to independently measure a reference resistance along the reference trace and a test resistance along the test trace. The assembly also includes a processor in communication with the resistance measuring device. The processor is configured to receive the reference resistance and the test resistance, subtract the reference resistance from the test resistance to produce a bond resistance, and compare the bond resistance to a predetermined resistance value.

A lidar sensor assembly includes a detector array having a plurality of photodetectors. An integrated circuit is bonded to the detector array via a plurality of connection bumps. A reference trace is defined by conductive material on at least one of the integrated circuit and the detector array. A test trace is defined by conductive material on the detector array, at least two of the connection bumps, and conductive material on the integrated circuit. A resistance measuring device is configured to independently measure a reference resistance along the reference trace and a test resistance along the test trace. The assembly also includes a processor in communication with the resistance measuring device. The processor is configured to receive the reference resistance and the test resistance, subtract the reference resistance from the test resistance to produce a bond resistance, and compare the bond resistance to a predetermined resistance value.

An illustrative embodiment of a cable joint integrity detection systems for an electric vehicle includes an electric vehicle power converter module; a fastener joint on the power converter module; vehicle wiring connections electrically interfacing with the power converter module at the fastener joint; a current sensor electrically interfacing with the fastener joint; and a controller interfacing with the current sensor, the current sensor transmits a sensor signal to the controller to ensure connectional integrity between the fastener joint and the vehicle wiring connections. Cable joint integrity detection methods are also disclosed.