A fuse monitoring device for monitoring a fuse supported by a fuse block, the fuse monitoring device including a housing. The housing includes a holder attachment mechanism configured to connect the fuse monitoring device to a fuse block. The housing also includes a mounting attachment mechanism configured to connect the fuse monitoring device to a mounting structure and at least one sensor configured to be operably connected to a fuse and configured to measure fuse data associated with the fuse. The monitoring device further includes at least one processor communicatively coupled to the at least one sensor.

A fuse monitoring device for monitoring a fuse supported by a fuse block, the fuse monitoring device including a housing. The housing includes a holder attachment mechanism configured to connect the fuse monitoring device to a fuse block. The housing also includes a mounting attachment mechanism configured to connect the fuse monitoring device to a mounting structure and at least one sensor configured to be operably connected to a fuse and configured to measure fuse data associated with the fuse. The monitoring device further includes at least one processor communicatively coupled to the at least one sensor.

A semiconductor wafer includes a semiconductor substrate having a plurality of die areas separated from one another by dicing areas. Each die area includes one or more metal layers above the semiconductor substrate and a plurality of fuse structures formed in at least one of the one or more metal layers. Each fuse structure includes a fuse area between first and second fuse heads. Each die area also includes a first pair of contacts connected to different areas of the first fuse head of at least some of the fuse structures. The wafer can be singulated along the dicing areas into individual dies. A corresponding method of fuse verification is also provided.

A semiconductor wafer includes a semiconductor substrate having a plurality of die areas separated from one another by dicing areas. Each die area includes one or more metal layers above the semiconductor substrate and a plurality of fuse structures formed in at least one of the one or more metal layers. Each fuse structure includes a fuse area between first and second fuse heads. Each die area also includes a first pair of contacts connected to different areas of the first fuse head of at least some of the fuse structures. The wafer can be singulated along the dicing areas into individual dies. A corresponding method of fuse verification is also provided.

The present invention relates to fuse diagnosis device and method using voltage distribution, and more particularly, to fuse diagnosis device and method using voltage distribution which connect a resistor unit and a diagnostic resistor to one side of the fuse so as to be connected with the battery in parallel and calculate voltage of a battery applied to the diagnostic resistor by using the voltage distribution to diagnose a state of the fuse, in order to diagnose the states of one or more fuses connected in parallel.

The present invention relates to fuse diagnosis device and method using voltage distribution, and more particularly, to fuse diagnosis device and method using voltage distribution which connect a resistor unit and a diagnostic resistor to one side of the fuse so as to be connected with the battery in parallel and calculate voltage of a battery applied to the diagnostic resistor by using the voltage distribution to diagnose a state of the fuse, in order to diagnose the states of one or more fuses connected in parallel.

A circuit protection device including a primary fuse, and a positive temperature coefficient (PTC) device and a secondary fuse electrically connected in series with one another and in parallel with the primary fuse, the secondary fuse formed of a quantity of solder disposed on a dielectric surface, wherein the dielectric surface exhibits a de-wetting characteristic relative to the solder such that, when the solder is melted, the solder draws away from the dielectric surface to create a galvanic opening.

A circuit protection device including a primary fuse, and a positive temperature coefficient (PTC) device and a secondary fuse electrically connected in series with one another and in parallel with the primary fuse, the secondary fuse formed of a quantity of solder disposed on a dielectric surface, wherein the dielectric surface exhibits a de-wetting characteristic relative to the solder such that, when the solder is melted, the solder draws away from the dielectric surface to create a galvanic opening.

Apparatus and method for controlling a pyro-fuse. A pyro-fuse control system includes a current sensing circuit and a diagnostic circuit. The current sensing circuit is configured to determine whether the current flowing in conductor exceeds a threshold current. The diagnostic circuit is coupled to the current sensing circuit. The diagnostic circuit is configured to determine whether an indication of current exceeding the threshold current generated by the current sensing circuit is caused by current flowing the conductor and is not caused by a fault in the current sensing circuit.

A method is for protecting an electrical architecture including a protective device provided with a protective fuse capable of melting in a deteriorated mode of operation during which a breaking current having an amperage greater than a threshold is flowing through the architecture. The method includes, in a nominal mode of operation, periodically estimating a temperature of the fuse and controlling an amperage of a useful current flowing through the fuse such that the estimated temperature remains below a melting temperature of the fuse.