Patent classifications
G01R33/0076
SEMI-ACTIVE MAGNETIC SHIELDING FOR QUBIT UNIT COMPONENTS OF QUANTUM COMPUTING APPARATUSES
A computer-implemented method of reducing an impact of stray magnetic fields on components of a quantum computing chip is disclosed. The computer implemented method includes applying a first current signal to a first component of a quantum computing chip, whereby the first component generates a stray magnetic field impacting an operation of a second component of the quantum computing chip. The computer implemented method further includes applying a compensation current signal to a shielding circuit of the quantum computing chip, the compensation current signal generated according to a predetermined function of the first signal, to magnetically shield the second component from the stray magnetic field generated by the first component.
MAGNETIC ISOLATOR
The present disclosure discloses a magnetic isolator, including a substrate, a magnetic field generating unit, a magnetic field sensing unit, a shielding layer, and an isolation dielectric, where the magnetic field generating unit includes a current conductor, the current conductor is arranged to extend along a first direction on one side of the substrate, the magnetic field sensing unit and the current conductor are arranged on the same side of the substrate, the magnetic field sensing unit is located on a lateral side of the current conductor, and a distance between the current conductor and the magnetic field sensing unit is greater than 0 along a second direction, where the first direction is perpendicular to the second direction; an isolation dielectric is arranged between the current conductor and the magnetic field sensing unit; and an isolation dielectric is arranged within the distance between the current conductor and the magnetic field sensing unit along the second direction, thereby playing a role in electrical isolation, facilitating improving the isolation strength, and simplifying the process. The shielding layer can absorb external interfering magnetic fields, and further improve the signal-to-noise ratio.
SYSTEM AND METHOD FOR CHARACTERIZING DEFECTS IN ELECTRONIC ITEMS USING MAGNETIC FIELD DETECTION
An electronic circuit triage device diagnoses functionality of various electronic circuits of an electronic device. The electronic circuit triage device detects whether an electronic circuit is functioning properly by measuring a magnetic field pattern associated with the electronic circuit and comparing the magnetic field pattern to an expected magnetic field pattern.
A magnetic sensor array includes non-packaged magnetic sensors disposed on a substrate. The non-packaged magnetic sensors can include bare dice, in one embodiment. In another embodiment, the magnetic sensors are formed directly on the substrate, such as by printing conductive traces on the substrate. In another embodiment, a magnetic sensor array includes a magnetic field converter configured to launch received magnetic fields along an axis corresponding to a magnetic sensor maximum sensitivity.
Sensing motor current
A circuit for sensing the driving current of a motor, the circuit comprising: a driver configured to generate a driving current for each phase of a multiple-phase motor, the instantaneous sum of all the driving currents being zero; a current sensor for each phase of the multiple-phase motor, each current sensor configured to measure the driving current of that phase and comprising a plurality of current sensor elements arranged with respect to each other such that each current sensor element has the same magnitude of driving current systematic error due to magnetic fields external to the driving current to be measured; and a controller configured to, for each phase of the multiple-phase motor, generate an estimate of the driving current of that phase to be the measured driving current of that phase minus 1/n of the total of the measured driving currents for all phases, n being the number of phases of the multiple-phase motor.
Magnetic detection module, detection device, case assembly, and production method for magnetic detection module
A magnetic detection module is provided so as to be selectively mountable in any of housings having a plurality of specifications having different shapes or sizes of mounting portions, and detects magnetic flux generated in the housing. The magnetic detection module includes one or more magnetic sensors that detect magnetic flux, a case in which the magnetic sensors are housed, and a cap that can be attached to an end of the case and is provided with a sealing member. The magnetic detection module can be attached to the housing of the first specification with the cap not attached to the case, and can be attached to the housing of the second specification through a sealing member with the cap attached to the case.
PERMEABILITY MEASUREMENT JIG, PERMEABILITY MEASUREMENT DEVICE, AND PERMEABILITY MEASUREMENT METHOD
In the present disclosure, there is provided a permeability measurement jig including a first waveguide, wherein a signal line of the first waveguide comprises an excited magnetic part at one end side, and a magnetic field is generated at the excited magnetic part by an excitation signal, and a second waveguide, wherein a signal line of the second waveguide comprises a detection part at one end side, a detection signal is induced at the detection part due to an action of the magnetic field generated at the excited magnetic part to a measurement sample, and the detection part is placed on the excited magnetic part to face the excited magnetic part at a predetermined distance. A permeability measurement device having the permeability measurement jig and a permeability measurement method are disclosed.
MAGNETORESISTIVE INERTIAL SENSOR CHIP
This invention describes a magnetoresistive inertial sensor chip, comprising a substrate, a vibrating diaphragm, a magnetic field sensing magnetoresistor and at least one permanent magnet thin film. The vibrating diaphragm is located on one side surface of the substrate. The magnetic field sensing magnetoresistor and the permanent magnet thin film are set on the surface of the vibrating diaphragm displaced from the base of the substrate. A contact electrode is also arranged on the surface of the vibrating diaphragm away from the base of the substrate. The magnetic field sensing magnetoresistor is connected to the contact electrode through a lead. The substrate comprises a cavity formed through etching and either one or both of the magnetic field sensing magnetoresistors and the permanent magnet thin film are arranged in a vertical projection area of the cavity in the vibrating diaphragm portion. A magnetic field generated by the permanent magnet thin film changes in the sensing direction of the magnetic field sensing magnetoresistor of magnetoresistive inertial sensor chip, which changes the resistance valve of the magnetic field sensing magnetoresistor, thereby producing a change in an output electrical signal. This magnetoresistive inertial sensor chip uses the high-sensitivity and high-frequency response characteristics of a magnetoresistor to improve the output signal strength and frequency response, thereby facilitating the detection of small and high frequency pressure, vibration, or acceleration changes.
Magnetic sensor
A first conductor includes a first base section and a first narrow section. The area of the exterior surface of the first narrow section as viewed from a direction perpendicular or substantially perpendicular to an insulating layer is smaller than that of the first base section. The first base section and the first narrow section are provided side by side in the direction perpendicular or substantially perpendicular to the insulating layer. A stress relaxer including a material different from that of the first conductor is provided in a region which is surrounded by the exterior surface of the first narrow section and also by the exterior surface of the first base section, as viewed from the direction perpendicular or substantially perpendicular to the insulating layer.
Sensor package and method for producing a sensor package
A sensor package including a metal carrier and a sensor chip arranged on the metal carrier and having a first sensor element. In an orthogonal projection of the sensor chip onto a surface of the metal carrier, at least two edge sections of the sensor chip are free of overlap with the surface of the metal carrier. The sensor chip is designed to detect a magnetic field induced by an electric current flowing through a current conductor.
Magnetic sensor with yoke and shield
A magnetic sensor includes a magnetic field conversion unit, a magnetic field detection unit, and two shields. The magnetic field conversion unit includes a plurality of yokes. Each yoke is shaped to be long in a Y direction, and is configured to receive an input magnetic field and output an output magnetic field. The input magnetic field contains an input magnetic field component in a direction parallel to a Z direction, and a magnetic field component in a direction parallel to the Y direction. The output magnetic field contains an output magnetic field component in a direction parallel to an X direction. The magnetic field detection unit generates a detection value according to the output magnetic field component. Each shield has such a shape that its maximum dimension in the Y direction is smaller than its maximum dimension in the X direction.